·详细说明：使用凌阳单片机的多命令语音识别范例- The use insults the positive monolithic integrated circuit the multi- orders speech recognition model 文件列表: Recognise_SD ............\bsrSD.h ............\
上传时间： 2013-04-24
上传用户：moshushi0009
PCB LAYOUT 術語解釋(TERMS)1. COMPONENT SIDE(零件面、正面)︰大多數零件放置之面。2. SOLDER SIDE(焊錫面、反面)。3. SOLDER MASK(止焊膜面)︰通常指Solder Mask Open 之意。4. TOP PAD︰在零件面上所設計之零件腳PAD，不管是否鑽孔、電鍍。5. BOTTOM PAD：在銲錫面上所設計之零件腳PAD，不管是否鑽孔、電鍍。6. positive LAYER：單、雙層板之各層線路；多層板之上、下兩層線路及內層走線皆屬之。7. NEGATIVE LAYER：通常指多層板之電源層。8. INNER PAD：多層板之positive LAYER 內層PAD。9. ANTI-PAD：多層板之NEGATIVE LAYER 上所使用之絕緣範圍，不與零件腳相接。10. THERMAL PAD：多層板內NEGATIVE LAYER 上必須零件腳時所使用之PAD，一般稱為散熱孔或導通孔。11. PAD (銲墊)：除了SMD PAD 外，其他PAD 之TOP PAD、BOTTOM PAD 及INNER PAD 之形狀大小皆應相同。12. Moat : 不同信號的 Power& GND plane 之間的分隔線13. Grid : 佈線時的走線格點2. Test Point : ATE 測試點供工廠ICT 測試治具使用ICT 測試點 LAYOUT 注意事項:PCB 的每條TRACE 都要有一個作為測試用之TEST PAD(測試點)，其原則如下：1. 一般測試點大小均為30-35mil，元件分布較密時，測試點最小可至30mil.測試點與元件PAD 的距離最小為40mil。2. 測試點與測試點間的間距最小為50-75mil，一般使用75mil。密度高時可使用50mil,3. 測試點必須均勻分佈於PCB 上，避免測試時造成板面受力不均。4. 多層板必須透過貫穿孔(VIA)將測試點留於錫爐著錫面上(Solder Side)。5. 測試點必需放至於Bottom Layer6. 輸出test point report(.asc 檔案powerpcb v3.5)供廠商分析可測率7. 測試點設置處:Setuppadsstacks
上传时间： 2013-10-22
上传用户：pei5
用NTC热敏电阻做温度采集:本应用例实现NTC热敏电阻器对温度的测量。热敏电阻器把温度的变化转换为电阻阻值的变化，再应用相应的测量电路把阻值的变化转换为电压的变化；SPMC75F2413A内建8路ADC可以把模拟的电压值转换为数字信号，对数值信号进行处理可以得到相应的温度值。1.2 热敏电阻器热敏电阻有电阻值随温度升高而升高的正温度系数（positive Temperature Coefficient简称PTC）热敏电阻和电阻值随温度升高而降低的负温度系数（Negative Temperature Coefficient简称NTC）热敏电阻。NTC热敏电阻器，是一种以过渡金属氧化物为主要原材料，采用电子陶瓷工艺制成的热敏半导体陶瓷组件。这种组件的电阻值随温度升高而降低，利用这一特性可制成测温、温度补偿和控温组件，又可以制成功率型组件，抑制电路的浪涌电流。
上传时间： 2013-11-16
上传用户：sssnaxie
We offer a broad line of high performance low dropout (LDO) linear regulators with fasttransient response, excellent line and load regulation, and very wide input voltage rangefrom 0.9V to 100V. Output currents range from 20mA to 10A, with positive, negative andmultiple output versions available. Many devices offer output voltage operation <0.8V andsome feature operation as low as 0V, even with a single supply. Most are stable with ceramicoutput capacitors. LDO regulators can be applied in virtually any application.
上传时间： 2013-11-15
上传用户：努力努力再努力
The RT9018A/B is a high performance positive voltage regulator designed for use in applications requining very low Input voltage and very low dropout voltage at up to 3A(peak).
上传时间： 2013-10-10
上传用户：geshaowei
PCB LAYOUT 術語解釋(TERMS)1. COMPONENT SIDE(零件面、正面)︰大多數零件放置之面。2. SOLDER SIDE(焊錫面、反面)。3. SOLDER MASK(止焊膜面)︰通常指Solder Mask Open 之意。4. TOP PAD︰在零件面上所設計之零件腳PAD，不管是否鑽孔、電鍍。5. BOTTOM PAD：在銲錫面上所設計之零件腳PAD，不管是否鑽孔、電鍍。6. positive LAYER：單、雙層板之各層線路；多層板之上、下兩層線路及內層走線皆屬之。7. NEGATIVE LAYER：通常指多層板之電源層。8. INNER PAD：多層板之positive LAYER 內層PAD。9. ANTI-PAD：多層板之NEGATIVE LAYER 上所使用之絕緣範圍，不與零件腳相接。10. THERMAL PAD：多層板內NEGATIVE LAYER 上必須零件腳時所使用之PAD，一般稱為散熱孔或導通孔。11. PAD (銲墊)：除了SMD PAD 外，其他PAD 之TOP PAD、BOTTOM PAD 及INNER PAD 之形狀大小皆應相同。12. Moat : 不同信號的 Power& GND plane 之間的分隔線13. Grid : 佈線時的走線格點2. Test Point : ATE 測試點供工廠ICT 測試治具使用ICT 測試點 LAYOUT 注意事項:PCB 的每條TRACE 都要有一個作為測試用之TEST PAD(測試點)，其原則如下：1. 一般測試點大小均為30-35mil，元件分布較密時，測試點最小可至30mil.測試點與元件PAD 的距離最小為40mil。2. 測試點與測試點間的間距最小為50-75mil，一般使用75mil。密度高時可使用50mil,3. 測試點必須均勻分佈於PCB 上，避免測試時造成板面受力不均。4. 多層板必須透過貫穿孔(VIA)將測試點留於錫爐著錫面上(Solder Side)。5. 測試點必需放至於Bottom Layer6. 輸出test point report(.asc 檔案powerpcb v3.5)供廠商分析可測率7. 測試點設置處:Setuppadsstacks
上传时间： 2013-11-17
上传用户：cjf0304
ICA can be used in brain activation studies to reduce the number of dimension and filter out independent and interesting activations. This demonstration shows two studies. One provided by Hvidovre Universitets Hospital, Denmark, that consists of fMRI scannings of humans. Another provided by the EU sponsored MAPAWAMO project from fMRI scannings of monkeys. In the demo comparison between icaMS, icaML, icaMF, icaMF (positive sources) and PCA can be made. More detailes can found in [2].
标签： activation dimension studies indepen
上传时间： 2015-04-19
上传用户：zukfu
数字运算，判断一个数是否接近素数 A Niven number is a number such that the sum of its digits divides itself. For example, 111 is a Niven number because the sum of its digits is 3, which divides 111. We can also specify a number in another base b, and a number in base b is a Niven number if the sum of its digits divides its value. Given b (2 <= b <= 10) and a number in base b, determine whether it is a Niven number or not. Input Each line of input contains the base b, followed by a string of digits representing a positive integer in that base. There are no leading zeroes. The input is terminated by a line consisting of 0 alone. Output For each case, print "yes" on a line if the given number is a Niven number, and "no" otherwise. Sample Input 10 111 2 110 10 123 6 1000 8 2314 0 Sample Output yes yes no yes no
上传时间： 2015-05-21
上传用户：daguda
2^x mod n = 1 acm竞赛题 Give a number n, find the minimum x that satisfies 2^x mod n = 1. Input One positive integer on each line, the value of n. Output If the minimum x exists, print a line with 2^x mod n = 1. Print 2^? mod n = 1 otherwise. You should replace x and n with specific numbers. Sample Input 2 5 Sample Output 2^? mod 2 = 1 2^4 mod 5 = 1
标签： mod satisfies minimum number
上传时间： 2015-06-02
上传用户：qlpqlq
平均因子分解法，适用于正定矩阵First, let s recall the definition of the Cholesky decomposition: Given a symmetric positive definite square matrix X, the Cholesky decomposition of X is the factorization X=U U, where U is the square root matrix of X, and satisfies: (1) U U = X (2) U is upper triangular (that is, it has all zeros below the diagonal). It seems that the assumption of positive definiteness is necessary. Actually, it is "positive definite" which guarantees the existence of such kind of decomposition.
标签： 分解
上传时间： 2013-12-24
上传用户：啊飒飒大师的
