PK51是为8051系列单片机所设计的开发工具，支持所有8051系列衍生产品，，支持带扩展存储器和扩展指令集（例如Dallas390/5240/400,Philips 51MX,Analog Devices MicroConverters）的新设备,以及支持很多公司的一流的设备和IP内核,比如Analog Devices, Atmel, Cypress Semiconductor, Dallas Semiconductor, Goal, Hynix, Infineon, Intel, NXP(founded by Philips), OKI, Silicon Labs,SMSC, STMicroeleectronics,Synopsis, TDK, Temic, Texas Instruments,Winbond等。通过PK51专业级开发工具，可以轻松地了解8051的On-chip peripherals与及其它关键特性。
上传时间： 2013-10-09
上传用户：1109003457
The AT89C52 is a low-power, high-performance CMOS 8-bit microcomputer with 8Kbytes of Flash programmable and erasable read only memory (PEROM). The deviceis manufactured using Atmel’s high-density nonvolatile memory technology and iscompatible with the industry-standard 80C51 and 80C52 instruction set and pinout.The on-chip Flash allows the program memory to be reprogrammed in-system or by aconventional nonvolatile memory programmer. By combining a versatile 8-bit CPUwith Flash on a monolithic chip, the Atmel AT89C52 is a powerful microcomputerwhich provides a highly-flexible and cost-effective solution to many embedded controlapplications.
上传时间： 2013-11-10
上传用户：1427796291
自动检测80C51 串行通讯中的波特率本文介绍一种在80C51 串行通讯应用中自动检测波特率的方法。按照经验，程序起动后所接收到的第1 个字符用于测量波特率。这种方法可以不用设定难于记忆的开关，还可以免去在有关应用中使用多种不同波特率的烦恼。人们可以设想：一种可靠地实现自动波特检测的方法是可能的，它无须严格限制可被确认的字符。问题是：在各种的条件下，如何可以在大量允许出现的字符中找出波特率的定时间隔。显然，最快捷的方法是检测一个单独位时间（single bit time），以确定接收波特率应该是多少。可是，在RS-232 模式下，许多ASCII 字符并不能测量出一个单独位时间。对于大多数字符来说，只要波特率存在合理波动（这里的波特率是指标准波特率），从起始位到最后一位“可见”位的数据传输周期就会在一定范围内发生变化。此外，许多系统采用8 位数据、无奇偶校验的格式传输ASCII 字符。在这种格式里，普通ASCII 字节不会有MSB 设定
上传时间： 2013-10-15
上传用户：shirleyYim
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
上传时间： 2013-10-22
上传用户：ztj182002
Designing withProgrammable Logicin an Analog WorldProgrammable logic devices revolutionizeddigital design over 25 years ago,promising designers a blank chip todesign literally any function and programit in the field. PLDs can be low-logicdensity devices that use nonvolatilesea-of-gates cells called complexprogrammable logic devices (CPLDs)or they can be high-density devicesbased on SRAM look-up tables (LUTs)
标签： Solutions Analog Altera FPGAs
上传时间： 2013-11-08
上传用户：虫虫虫虫虫虫
The Xilinx Zynq-7000 Extensible Processing Platform (EPP) redefines the possibilities for embedded systems, giving system and software architects and developers a flexible platform to launch their new solutions and traditional ASIC and ASSP users an alternative that aligns with today’s programmable imperative. The new class of product elegantly combines an industrystandard ARMprocessor-based system with Xilinx 28nm programmable logic—in a single device. The processor boots first, prior to configuration of the programmable logic. This, along with a streamlined workflow, saves time and effort and lets software developers and hardware designers start development simultaneously.
上传时间： 2013-11-01
上传用户：dingdingcandy
This application note covers the design considerations of a system using the performance features of the LogiCORE™ IP Advanced eXtensible Interface (AXI) Interconnect core. The design focuses on high system throughput through the AXI Interconnect core with F MAX and area optimizations in certain portions of the design. The design uses five AXI video direct memory access (VDMA) engines to simultaneously move 10 streams (five transmit video streams and five receive video streams), each in 1920 x 1080p format, 60 Hz refresh rate, and up to 32 data bits per pixel. Each VDMA is driven from a video test pattern generator (TPG) with a video timing controller (VTC) block to set up the necessary video timing signals. Data read by each AXI VDMA is sent to a common on-screen display (OSD) core capable of multiplexing or overlaying multiple video streams to a single output video stream. The output of the OSD core drives the DVI video display interface on the board. Performance monitor blocks are added to capture performance data. All 10 video streams moved by the AXI VDMA blocks are buffered through a shared DDR3 SDRAM memory and are controlled by a MicroBlaze™ processor. The reference system is targeted for the Virtex-6 XC6VLX240TFF1156-1 FPGA on the Xilinx® ML605 Rev D evaluation board
上传时间： 2013-11-14
上传用户：fdmpy
The Tri-Mode Ethernet MAC (TEMAC) UltraController-II module is a minimal footprint,embedded network processing engine based on the PowerPC™ 405 (PPC405) processor coreand the TEMAC core embedded within a Virtex™-4 FX Platform FPGA. The TEMACUltraController-II module connects to an external PHY through Gigabit Media IndependentInterface (GMII) and Management Data Input/Output (MDIO) interfaces and supports tri-mode(10/100/1000 Mb/s) Ethernet. Software running from the processor cache reads and writesthrough an On-Chip Memory (OCM) interface to two FIFOs that act as buffers between thedifferent clock domains of the PPC405 OCM and the TEMAC.
上传时间： 2013-10-26
上传用户：yuzsu
多远程二极管温度传感器-Design Considerations for pc thermal management Multiple RDTS (remote diode temperature sensing) provides the most accurate method of sensing an IC’s junction temperature. It overcomes thermal gradient and placement issues encountered when trying to place external sensors. PCB component count decreases when using a device that provides multiple inputs.Better temperature sensing improves product performance and reliability. Disk drive data integrity suffers at elevated temperatures. IBM published an article stating that a 5°C rise in operating temperature causes a 15% increase in the drive’s failure rate. The overall performance of a system can be improved by providing a more accurate temperature measurement of the most critical devices allowing them to run just a few degrees hotter.The LM83 directly senses its own temperature and the temperature of three external PN junctions. One is dedicated to the CPU of choice, the other two go to other parts of your system that need thermal monitoring such as the disk drive or graphics chip. The SMBus-compatible LM83 supports SMBus timeout and logic levels. The LM83 has two interrupt outputs; one for user-programmable limits and WATCHDOG capability (INT), the other is a Critical Temperature Alarm output (T_CRIT_A) for system power supply shutdown.
标签： Considerat Design 远程 二极管
上传时间： 2014-12-21
上传用户：ljd123456
A Computer-On-Module, or COM, is a Module with all components necessary for a bootable host computer, packaged as a super component. A COM requires a Carrier Board to bring out I/O and to power up. COMs are used to build single board computer solutions and offer OEMs fast time-to-market with reduced development cost. Like integrated circuits, they provide OEMs with significant freedom in meeting form-fit-function requirements. For all these reasons the COM methodology has gained much popularity with OEMs in the embedded industry. COM Express® is an open industry standard for Computer-On-Modules. It is designed to be future proof and to provide a smooth transition path from legacy parallel interfaces to LVDS (Low Voltage Differential Signaling) interfaces. These include the PCI bus and parallel ATA on the one hand and PCI Express and Serial ATA on the other hand.
上传时间： 2013-11-05
上传用户：Wwill
