The need to develop reliable microelectronic devices capable of operating at high speeds with complex functionality requires a better understanding of the factors that govern the thermal performance of electronics. With an increased demand on system reliability and performance combined with miniaturization of the devices, thermal consideration has become a crucial factor in the design of elec- tronic packages, from chip to system levels.
标签: Telecommunications Management Equipment Thermal of
上传时间: 2020-06-01
上传用户:shancjb
This book is concerned with integrated circuits and systems for wireless and mobile communications. Circuit techniques and implementation of reconfigurable low-voltage and low-power single-chip CMOS transceivers for multiband and multi- mode universal wireless communications are the focus of the book. Applications encompass both long-range mobile cellular communications (GSM and UMTS) and short-range wireless LANs (IEEE802.11 and Bluetooth). Recent advances in research into transceiver architecture, RF frontend, analogue baseband, RF CAD and automatic testing are reported.
标签: Communication Wireless Circuits Systems and
上传时间: 2020-06-01
上传用户:shancjb
Electrostatic discharge (ESD) is one of the most prevalent threats to the reliability of electronic components. It is an event in which a finite amount of charge is trans- ferred from one object (i.e., human body) to another (i.e., microchip). This process can result in a very high current passing through the microchip within a very short period of time, and, hence, more than 35% of chip damages can be attributed to an ESD-related event. As such, designing on-chip ESD structures to protect integrated circuits against the ESD stresses is a high priority in the semiconductor industry.
标签: Electrostatic Protection Discharge
上传时间: 2020-06-05
上传用户:shancjb
This paper reviews key factors to practical ESD protection design for RF and analog/mixed-signal (AMS) ICs, including general challenges emerging, ESD-RFIC interactions, RF ESD design optimization and prediction, RF ESD design characterization, ESD-RFIC co-design technique, etc. Practical design examples are discussed. It means to provide a systematic and practical design flow for whole-chip ESD protection design optimization and prediction for RF/AMS ICs to ensure 1 st Si design success.
标签: ESD_protection_for_RF_and_AMS_ICs
上传时间: 2020-06-05
上传用户:shancjb
ESD is a crucial factor for integrated circuits and influences their quality and reliability. Today increasingly sensitive processes with deep sub micron structures are developed. The integration of more and more functionality on a single chip and saving of chip area is required. Integrated circuits become more susceptible to ESD/EOS related damages. However, the requirements on ESD robustness especially for automotive applications are increasing. ESD failures are very often the reason for redesigns. Much research has been conducted by semiconductor manufacturers on ESD robust design.
标签: Guidelines Design Basic ESD
上传时间: 2020-06-05
上传用户:shancjb
A power semiconductor module is basically a power circuit of different materials assembled together using hybrid technology, such as semiconduc- tor chip attachment, wire bonding, encapsulation, etc. The materials involved cover a wide range from insulators, conductors, and semiconduc- tors to organics and inorganics. Since these materials all behave differently under various environmental, electrical, and thermal stresses, proper selec- tion of these materials and the assembly processes are critical. In-depth knowledge of the material properties and the processing techniques is there- fore required to build a high-performance and highly reliable power module.
标签: Manufacture Electronic Modules Design Power
上传时间: 2020-06-07
上传用户:shancjb
We are in the era of ubiquitous computing in which the use and development of Radio Frequency Iden- tification (RFID) is becoming more widespread. RFID systems have three main components: readers, tags, and database. An RFID tag is composed of a small microchip, limited logical functionality, and an antenna. Most common tags are passive and harvest energy from a nearby RFID reader. This energy is used both to energize the chip and send the answer back to the reader request. The tag provides a unique identifier (or an anonymized version of that), which allows the unequivocal identification of the tag holder (i.e. person, animal, or items).
上传时间: 2020-06-08
上传用户:shancjb
MAX1447 3.5- and 4.5-Digit, Single-chip ADCs with LED Drivers
上传时间: 2020-11-12
上传用户:
深圳市永嘉微电科技有限公司,原厂直销!原装现货更有优势!工程服务,技术支持,让您的生产高枕无忧!量大价优,保证原装。您有量,我有价! 联系人:许先生 联系手机:188 9858 2398 (微信) 联系QQ:191 888 5898 E-mail:zes1688@163.com VK2C22系列 产品品牌:VINKA永嘉微电 产品型号:VK2C22 驱动芯片:LCD驱动 针脚数:52/48 封装形式:LQFP52/48 产品年份:全新年份 概述 VK2C22系列是一款存储器映射和多功能LCD控制/驱动芯片。该系列芯片显示模式有176点(44×4)。VK2C22软件配置特性使得它适用于多种LCD应用,包括LCD模块和显示子系统。VK2C22通过双线双向I2C接口与大多数微处理器/微控制器进行通信。 功能特性 1.工作电压:2.4V ~ 5.5V 2.内部32kHz RC振荡器 3.Bias:1/2或1/3;Duty:1/4 4.带电压跟随器的内部LCD偏置发生器 5.I2C接口 6.两个可选LCD帧频率:80Hz或160Hz 7.多达 44×4位RAM用来存储显示数据 8.显示模式44×4:44 SEGs和4COMs 9.多种闪烁模式 10.读/写地址自动增加 11.内建16级VLCD电压调整电路 12.低功耗 13.提供VLCD引脚来调整LCD工作电压 14.采用硅栅极CMOS制造工艺 15.封装类型:48-pin LQFP,52-pin LQFP,chip和COG 应用领域 ● 电表 ● 水表 ● 气表 ● 热能表 ● 家用电器 ● 游戏机 ● 电话机 ● 消费类电子产品 极限参数 电源供应电压 .......................................VSS-0.3V~VSS+6.5V 端口输入电压 .......................................VSS-0.3V~VDD+0.3V 储存温度 ...........................................-55°C~150°C 工作温度 ...........................................-40°C~85°C 注:这里只强调额定功率,超过极限参数所规定的范围将对芯片造成损害,无法预期芯片在上述标示范围外的工作状态,而且若长期在标示范围外的条件下工作,可能影响芯片的可靠性。YH49 永嘉原厂LED/LCD液晶控制器及驱动器系列 芯片简介如下: 内存映射的LED控制器及驱动器 VK1628 --- 通讯接口:STb/CLK/DIO 电源电压:5V(4.5~5.5V) 驱动点阵:70/52 共阴驱动:10段7位/13段4位 共阳驱动:7段10位 按键:10x2 封装SOP28 VK1629 --- 通讯接口:STb/CLK/DIN/DOUT 电源电压:5V(4.5~5.5V) 驱动点阵:128 共阴驱动:16段8位 共阳驱动:8段16位 按键:8x4 封装QFP44 VK1629A --- 通讯接口:STb/CLK/DIO 电源电压:5V(4.5~5.5V) 驱动点阵:128 共阴驱动:16段8位 共阳驱动:8段16位 按键:--- 封装SOP32 VK1629B --- 通讯接口:STb/CLK/DIO 电源电压:5V(4.5~5.5V) 驱动点阵:112 共阴驱动:14段8位 共阳驱动:8段14位 按键:8x2 封装SOP32 VK1629C --- 通讯接口:STb/CLK/DIO 电源电压:5V(4.5~5.5V) 驱动点阵:120 共阴驱动:15段8位 共阳驱动:8段15位 按键:8x1 封装SOP32 VK1629D --- 通讯接口:STb/CLK/DIO 电源电压:5V(4.5~5.5V) 驱动点阵:96 共阴驱动:12段8位 共阳驱动:8段12位 按键:8x4 封装SOP32 VK1640 --- 通讯接口: CLK/DIN 电源电压:5V(4.5~5.5V) 驱动点阵:128 共阴驱动:8段16位 共阳驱动:16段8位 按键:--- 封装SOP28 VK1650 --- 通讯接口: SCL/SDA 电源电压:5V(3.0~5.5V) 驱动点阵:8x16 共阴驱动:8段4位 共阳驱动:4段8位 按键:7x4 封装SOP16/DIP16 VK1668 ---通讯接口:STb/CLK/DIO 电源电压:5V(4.5~5.5V) 驱动点阵:70/52 共阴驱动:10段7位/13段4位 共阳驱动:7段10位 按键:10x2 封装SOP24 VK6932 --- 通讯接口:STb/CLK/DIN 电源电压:5V(4.5~5.5V) 驱动点阵:128 共阴驱动:8段16位17.5/140mA 共阳驱动:16段8位 按键:--- 封装SOP32 RAM映射LCD控制器和驱动器系列 VK1024b 2.4V~5.2V 6seg*4com 6*3 6*2 偏置电压1/2 1/3 S0P-16 VK1056b 2.4V~5.2V 14seg*4com 14*3 14*2 偏置电压1/2 1/3 SOP-24/SSOP-24 VK1072B 2.4V~5.2V 18seg*4com 18*3 18*2 偏置电压1/2 1/3 SOP-28 VK1072C 2.4V~5.2V 18seg*4com 18*3 18*2 偏置电压1/2 1/3 SOP-28 VK1088b 2.4V~5.2V 22seg*4com 22*3 偏置电压1/2 1/3 QFN-32L(4MM*4MM) VK0192 2.4V~5.2V 24seg*8com 偏置电压1/4 LQFP-44 VK0256 2.4V~5.2V 32seg*8com 偏置电压1/4 QFP-64 VK0256b 2.4V~5.2V 32seg*8com 偏置电压1/4 LQFP-64 VK0256C 2.4V~5.2V 32seg*8com 偏置电压1/4 LQFP-52 VK1621S-1 2.4V~5.2V 32*4 32*3 32*2 偏置电压1/2 1/3 LQFP44/48/SSOP48/SKY28/DICE裸片 VK1622B 2.7V~5.5V 32seg*8com 偏置电压1/4 LQFP-48 VK1622S 2.7V~5.5V 32seg*8com 偏置电压1/4 LQFP44/48/52/64/QFP64/DICE裸片 VK1623S 2.4V~5.2V 48seg*8com 偏置电压1/4 LQFP-100/QFP-100/DICE裸片 VK1625 2.4V~5.2V 64seg*8com 偏置电压1/4 LQFP-100/QFP-100/DICE VK1626 2.4V~5.2V 48seg*16com 偏置电压1/5 LQFP-100/QFP-100/DICE (高品质 高性价比:液晶显示驱动IC 原厂直销 工程技术支持!) 高抗干扰LCD液晶控制器及驱动系列 VK2C21A 2.4~5.5V 20seg*4com 16*8 偏置电压1/3 1/4 I2C通讯接口 SOP-28 VK2C21B 2.4~5.5V 16seg*4com 12*8 偏置电压1/3 1/4 I2C通讯接口 SOP-24 VK2C21C 2.4~5.5V 12seg*4com 8*8 偏置电压1/3 1/4 I2C通讯接口 SOP-20 VK2C21D 2.4~5.5V 8seg*4com 4*8 偏置电压1/3 1/4 I2C通讯接口 NSOP-16 VK2C22A 2.4~5.5V 44seg*4com 偏置电压1/2 1/3 I2C通讯接口 LQFP-52 VK2C22B 2.4~5.5V 40seg*4com 偏置电压1/2 1/3 I2C通讯接口 LQFP-48 VK2C23A 2.4~5.5V 56seg*4com 52*8 偏置电压1/3 1/4 I2C通讯接口 LQFP-64 VK2C23B 2.4~5.5V 36seg*8com 偏置电压1/3 1/4 I2C通讯接口 LQFP-48 VK2C24 2.4~5.5V 72seg*4com 68*8 60*16 偏置电压1/3 1/4 1/5 I2C通讯接口 LQFP-80 超低功耗LCD液晶控制器及驱动系列 VKL060 2.5~5.5V 15seg*4com 偏置电压1/2 1/3 I2C通讯接口 SSOP-24 VKL128 2.5~5.5V 32seg*4com 偏置电压1/2 1/3 I2C通讯接口 LQFP-44 VKL144A 2.5~5.5V 36seg*4com 偏置电压1/2 1/3 I2C通讯接口 TSSOP-48 VKL144B 2.5~5.5V 36seg*4com 偏置电压1/2 1/3 I2C通讯接口 QFN48L (6MM*6MM) 静态显示LCD液晶控制器及驱动系列 VKS118 2.4~5.2V 118seg*2com 偏置电压 -- 4线通讯接口 LQFP-128 VKS232 2.4~5.2V 116seg*2com 偏置电压1/11/2 4线通讯接口 LQFP-128 联系人:许先生 联系手机:188 9858 2398 (微信) 联系QQ:191 888 5898 E-mail:zes1688@163.com 以上介绍内容为IC参数简介,难免有错漏,且相关IC型号众多,未能一一收录。欢迎联系索取完整资料及样品!生意无论大小,做人首重诚信!本公司全体员工将既往开来,再接再厉。更高性价比的好产品.竭诚希望能与各位客户朋友深入沟通,携手共进,共同成长,合作共赢!谢谢。
标签: LCD驱动IC 液晶驱动芯片 抗干扰驱动芯片 显示屏驱动IC
上传时间: 2021-04-03
上传用户:szqxw1688
产品型号:VK1072B 产品品牌:VINKA/永嘉微电 封装形式: SOP28 联 系 人:沈经理 联 系 QQ:288 521 8966 联系手机:13554744703 提供专业工程服务,用芯服务客户-F03 概述:VK1072B 是一个18×4的LCD驱动器,可软件配置使其适用于各种LCD应用,仅用3条信号线便可控制LCD驱动器,也可通过指令使其进入省电模式(掉电模式)。 特点: l 工作电压:2.4~5.2V l 片内256kHz的RC振荡电路 l 1/2或1/3的偏置电压,1/2、1/3或1/4 的占空比 l 内部时钟频率 l Power down命令减少电源损耗 l 18×4的LCD驱动 l 18×4位的显示RAM l 3 端串行接口 l 内部LCD驱动频率 l 软件设置 l 数据模式和命令模式指令 l 写显示数据地址自动累加 l VLCD 脚是用来调节LCD电压的 l 封装形式:SOP28(300mil)(18.0mm x 7.5mm PP=1.27mm) VINKA原厂LCD/LED液晶控制器及驱动器系列 芯片简介如下: 高抗干扰LCD液晶控制器及驱动系列 VK2C21A 2.4~5.5V 20seg*4com 16*8 偏置电压1/3 1/4 I2C通讯接口 SOP-28 VK2C21B 2.4~5.5V 16seg*4com 12*8 偏置电压1/3 1/4 I2C通讯接口 SOP-24 VK2C21C 2.4~5.5V 12seg*4com 8*8 偏置电压1/3 1/4 I2C通讯接口 SOP-20 VK2C21D 2.4~5.5V 8seg*4com 4*8 偏置电压1/3 1/4 I2C通讯接口 NSOP-16 VK2C22A 2.4~5.5V 44seg*4com 偏置电压1/21/3 I2C通讯接口 LQFP-52 VK2C22B 2.4~5.5V 40seg*4com 偏置电压1/2 1/3 I2C通讯接口 LQFP-48 VK2C23A 2.4~5.5V 56seg*4com 52*8 偏置电压1/3 1/4 I2C通讯接口 LQFP-64 VK2C23B 2.4~5.5V 36seg*8com 偏置电压1/31/4 I2C通讯接口 LQFP-48 VK2C24 2.4~5.5V 72seg*4com 68*8 60*16 偏置电压1/3 1/41/5 I2C通讯接口LQFP-80 超低功耗LCD液晶控制器及驱动系列 VKL060 2.5~5.5V 15seg*4com 偏置电压1/21/3 I2C通讯接口 SSOP-24 VKL128 2.5~5.5V 32seg*4com 偏置电压1/21/3 I2C通讯接口 LQFP-44 VKL144A 2.5~5.5V 36seg*4com 偏置电压1/21/3 I2C通讯接口 TSSOP-48 VKL144B 2.5~5.5V 36seg*4com 偏置电压1/21/3 I2C通讯接口 QFN48L (6MM*6MM) 静态显示LCD液晶控制器及驱动系列 VKS118 2.4~5.2V 118seg*2com 偏置电压 -- 4线通讯接口 LQFP-128 VKS232 2.4~5.2V 116seg*2com 偏置电压1/11/2 4线通讯接口 LQFP-128) 内存映射的LED控制器及驱动器 VK1628--- 通讯接口:STb/CLK/DIO 电源电压:5V(4.5~5.5V) 驱动点阵:70/52 共阴驱动:10段7位/13段4位 共阳驱动:7段10位 按键:10x2 封装SOP28 VK1629--- 通讯接口:STb/CLK/DIN/DOUT 电源电压:5V(4.5~5.5V) 驱动点阵:128 共阴驱动:16段8位 共阳驱动:8段16位 按键:8x4 封装QFP44 VK1629A--- 通讯接口:STb/CLK/DIO 电源电压:5V(4.5~5.5V) 驱动点阵:128 共阴驱动:16段8位 共阳驱动:8段16位 按键:--- 封装SOP32 VK1629B--- 通讯接口:STb/CLK/DIO 电源电压:5V(4.5~5.5V) 驱动点阵:112 共阴驱动:14段8位 共阳驱动:8段14位 按键:8x2 封装SOP32 VK1629C--- 通讯接口:STb/CLK/DIO 电源电压:5V(4.5~5.5V) 驱动点阵:120 共阴驱动:15段8位 共阳驱动:8段15位 按键:8x1 封装SOP32 VK1629D--- 通讯接口:STb/CLK/DIO 电源电压:5V(4.5~5.5V) 驱动点阵:96 共阴驱动:12段8位 共阳驱动:8段12位 按键:8x4 封装SOP32 VK1640--- 通讯接口: CLK/DIN 电源电压:5V(4.5~5.5V) 驱动点阵:128 共阴驱动:8段16位 共阳驱动:16段8位 按键:--- 封装SOP28 VK1650--- 通讯接口: SCL/SDA 电源电压:5V(3.0~5.5V) 驱动点阵:8x16 共阴驱动:8段4位 共阳驱动:4段8位 按键:7x4 封装SOP16/DIP16 VK1668---通讯接口:STb/CLK/DIO 电源电压:5V(4.5~5.5V) 驱动点阵:70/52 共阴驱动:10段7位/13段4位 共阳驱动:7段10位 按键:10x2 封装SOP24 VK6932--- 通讯接口:STb/CLK/DIN 电源电压:5V(4.5~5.5V) 驱动点阵:128 共阴驱动:8段16位17.5/140mA 共阳驱动:16段8位 按键:--- 封装SOP32 RAM映射LCD控制器和驱动器系列 VK1024b 2.4V~5.2V 6seg*4com 6*3 6*2 偏置电压1/21/3 S0P-16 VK1056b 2.4V~5.2V 14seg*4com 14*3 14*2 偏置电压1/21/3 SOP-24/SSOP-24 VK1072B 2.4V~5.2V 18seg*4com 18*3 18*2 偏置电压1/21/3 SOP-28 VK1072C 2.4V~5.2V 18seg*4com 18*3 18*2 偏置电压1/21/3 SOP-28 VK1088b 2.4V~5.2V 22seg*4com 22*3 偏置电压1/2 1/3 QFN-32L(4MM*4MM) VK0192 2.4V~5.2V 24seg*8com 偏置电压1/4 LQFP-44 VK0256 2.4V~5.2V 32seg*8com 偏置电压1/4 QFP-64 VK0256b 2.4V~5.2V 32seg*8com 偏置电压1/4 LQFP-64 VK0256C 2.4V~5.2V 32seg*8com 偏置电压1/4 LQFP-52 VK1621S-12.4V~5.2V 32*4 32*332*2 偏置电压1/21/3 LQFP44/48/SSOP48/SKY28/DICE裸片 VK1622B 2.7V~5.5V 32seg*8com 偏置电压1/4 LQFP-48 VK1622S 2.7V~5.5V 32seg*8com 偏置电压1/4 LQFP44/48/52/64/QFP64/DICE裸片 VK1623S 2.4V~5.2V 48seg*8com 偏置电压1/4 LQFP-100/QFP-100/DICE裸片 VK1625 2.4V~5.2V 64seg*8com 偏置电压1/4 LQFP-100/QFP-100/DICE VK1626 2.4V~5.2V 48seg*16com 偏置电压1/5 LQFP-100/QFP-100/DICE E-mail: sy-chip@szvinka.com 以上介绍内容为IC参数简介,难免有错漏,且相关IC型号众多,未能一一收录。欢迎联系索取完整资料及样品!
标签: 1072B 1072 SOP LCD 28 VK 封装 液晶驱动 显示芯片
上传时间: 2021-07-12
上传用户:abcyyim0921