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Test-Bus_Controller

  • 电脑主板生产工艺及流程

    随着科学技术的不断发展,人们的生活水平的不断提高,通信技术的不断扩延,计算机已经涉及到各个不同的行业,成为人们生活、工作、学习、娱乐不可缺少的工具。而计算机主板作为计算机中非常重要的核心部件,其品质的好坏直接影响计算机整体品质的高低。因此在生产主板的过程中每一步都是要严格把关的,不能有丝毫的懈怠,这样才能使其品质得到保证。 基于此,本文主要介绍电脑主板的SMT生产工艺流程和F/T(Function Test)功能测试步骤(F/T测试步骤以惠普H310机种为例)。让大家了解一下完整的计算机主板是如何制成的,都要经过哪些工序以及如何检测产品质量的。 本文首先简单介绍了PCB板的发展历史,分类,功能及发展趋势,SMT及SMT产品制造系统,然后重点介绍了SMT生产工艺流程和F/T测试步骤。

    标签: 电脑主板 生产工艺 流程

    上传时间: 2013-11-02

    上传用户:c12228

  • XAPP740利用AXI互联设计高性能视频系统

    This application note covers the design considerations of a system using the performance features of the LogiCORE™ IP Advanced eXtensible Interface (AXI) Interconnect core. The design focuses on high system throughput through the AXI Interconnect core with F MAX  and area optimizations in certain portions of the design. The design uses five AXI video direct memory access (VDMA) engines to simultaneously move 10 streams (five transmit video streams and five receive video streams), each in 1920 x 1080p format, 60 Hz refresh rate, and up to 32 data bits per pixel. Each VDMA is driven from a video test pattern generator (TPG) with a video timing controller (VTC) block to set up the necessary video timing signals. Data read by each AXI VDMA is sent to a common on-screen display (OSD) core capable of multiplexing or overlaying multiple video streams to a single output video stream. The output of the OSD core drives the DVI video display interface on the board. Performance monitor blocks are added to capture performance data. All 10 video streams moved by the AXI VDMA blocks are buffered through a shared DDR3 SDRAM memory and are controlled by a MicroBlaze™ processor. The reference system is targeted for the Virtex-6 XC6VLX240TFF1156-1 FPGA on the Xilinx® ML605 Rev D evaluation board

    标签: XAPP 740 AXI 互联

    上传时间: 2013-11-23

    上传用户:shen_dafa

  • 扩频通信芯片STEL-2000A的FPGA实现

    针对传统集成电路(ASIC)功能固定、升级困难等缺点,利用FPGA实现了扩频通信芯片STEL-2000A的核心功能。使用ISE提供的DDS IP核实现NCO模块,在下变频模块调用了硬核乘法器并引入CIC滤波器进行低通滤波,给出了DQPSK解调的原理和实现方法,推导出一种简便的引入?仔/4固定相移的实现方法。采用模块化的设计方法使用VHDL语言编写出源程序,在Virtex-II Pro 开发板上成功实现了整个系统。测试结果表明该系统正确实现了STEL-2000A的核心功能。 Abstract:  To overcome drawbacks of ASIC such as fixed functionality and upgrade difficulty, FPGA was used to realize the core functions of STEL-2000A. This paper used the DDS IP core provided by ISE to realize the NCO module, called hard core multiplier and implemented CIC filter in the down converter, described the principle and implementation detail of the demodulation of DQPSK, and derived a simple method to introduce a fixed phase shift of ?仔/4. The VHDL source code was designed by modularity method , and the complete system was successfully implemented on Virtex-II Pro development board. Test results indicate that this system successfully realize the core function of the STEL-2000A.

    标签: STEL 2000 FPGA 扩频通信

    上传时间: 2013-11-19

    上传用户:neu_liyan

  • 基于CPLD的QDPSK调制解调电路设计

    为了在CDMA系统中更好地应用QDPSK数字调制方式,在分析四相相对移相(QDPSK)信号调制解调原理的基础上,设计了一种QDPSK调制解调电路,它包括串并转换、差分编码、四相载波产生和选相、相干解调、差分译码和并串转换电路。在MAX+PLUSⅡ软件平台上,进行了编译和波形仿真。综合后下载到复杂可编程逻辑器件EPM7128SLC84-15中,测试结果表明,调制电路能正确选相,解调电路输出数据与QDPSK调制输入数据完全一致,达到了预期的设计要求。 Abstract:  In order to realize the better application of digital modulation mode QDPSK in the CDMA system, a sort of QDPSK modulation-demodulation circuit was designed based on the analysis of QDPSK signal modulation-demodulation principles. It included serial/parallel conversion circuit, differential encoding circuit, four-phase carrier wave produced and phase chosen circuit, coherent demodulation circuit, difference decoding circuit and parallel/serial conversion circuit. And it was compiled and simulated on the MAX+PLUSⅡ software platform,and downloaded into the CPLD of EPM7128SLC84-15.The test result shows that the modulation circuit can exactly choose the phase,and the output data of the demodulator circuit is the same as the input data of the QDPSK modulate. The circuit achieves the prospective requirement of the design.

    标签: QDPSK CPLD 调制解调 电路设计

    上传时间: 2013-10-28

    上传用户:jyycc

  • UART 4 UART参考设计,Xilinx提供VHDL代码

    UART 4 UART参考设计,Xilinx提供VHDL代码 uart_vhdl This zip file contains the following folders:  \vhdl_source  -- Source VHDL files:      uart.vhd  - top level file      txmit.vhd - transmit portion of uart      rcvr.vhd -  - receive portion of uart \vhdl_testfixture  -- VHDL Testbench files. This files only include the testbench behavior, they         do not instantiate the DUT. This can easily be done in a top-level VHDL          file or a schematic. This folder contains the following files:      txmit_tb.vhd  -- Test bench for txmit.vhd.      rcvr_tf.vhd  -- Test bench for rcvr.vhd.

    标签: UART Xilinx VHDL 参考设计

    上传时间: 2013-11-02

    上传用户:18862121743

  • pcb layout design(台湾硬件工程师15年经验

    PCB LAYOUT 術語解釋(TERMS)1. COMPONENT SIDE(零件面、正面)︰大多數零件放置之面。2. SOLDER SIDE(焊錫面、反面)。3. SOLDER MASK(止焊膜面)︰通常指Solder Mask Open 之意。4. TOP PAD︰在零件面上所設計之零件腳PAD,不管是否鑽孔、電鍍。5. BOTTOM PAD:在銲錫面上所設計之零件腳PAD,不管是否鑽孔、電鍍。6. POSITIVE LAYER:單、雙層板之各層線路;多層板之上、下兩層線路及內層走線皆屬之。7. NEGATIVE LAYER:通常指多層板之電源層。8. INNER PAD:多層板之POSITIVE LAYER 內層PAD。9. ANTI-PAD:多層板之NEGATIVE LAYER 上所使用之絕緣範圍,不與零件腳相接。10. THERMAL PAD:多層板內NEGATIVE LAYER 上必須零件腳時所使用之PAD,一般稱為散熱孔或導通孔。11. PAD (銲墊):除了SMD PAD 外,其他PAD 之TOP PAD、BOTTOM PAD 及INNER PAD 之形狀大小皆應相同。12. Moat : 不同信號的 Power& GND plane 之間的分隔線13. Grid : 佈線時的走線格點2. Test Point : ATE 測試點供工廠ICT 測試治具使用ICT 測試點 LAYOUT 注意事項:PCB 的每條TRACE 都要有一個作為測試用之TEST PAD(測試點),其原則如下:1. 一般測試點大小均為30-35mil,元件分布較密時,測試點最小可至30mil.測試點與元件PAD 的距離最小為40mil。2. 測試點與測試點間的間距最小為50-75mil,一般使用75mil。密度高時可使用50mil,3. 測試點必須均勻分佈於PCB 上,避免測試時造成板面受力不均。4. 多層板必須透過貫穿孔(VIA)將測試點留於錫爐著錫面上(Solder Side)。5. 測試點必需放至於Bottom Layer6. 輸出test point report(.asc 檔案powerpcb v3.5)供廠商分析可測率7. 測試點設置處:Setup􀃆pads􀃆stacks

    标签: layout design pcb 硬件工程师

    上传时间: 2013-11-17

    上传用户:cjf0304

  • pcb layout规则

    LAYOUT REPORT .............. 1   目錄.................. 1     1. PCB LAYOUT 術語解釋(TERMS)......... 2     2. Test Point : ATE 測試點供工廠ICT 測試治具使用............ 2     3. 基準點 (光學點) -for SMD:........... 4     4. 標記 (LABEL ING)......... 5     5. VIA HOLE PAD................. 5     6. PCB Layer 排列方式...... 5     7.零件佈置注意事項 (PLACEMENT NOTES)............... 5     8. PCB LAYOUT 設計............ 6     9. Transmission Line ( 傳輸線 )..... 8     10.General Guidelines – 跨Plane.. 8     11. General Guidelines – 繞線....... 9     12. General Guidelines – Damping Resistor. 10     13. General Guidelines - RJ45 to Transformer................. 10     14. Clock Routing Guideline........... 12     15. OSC & CRYSTAL Guideline........... 12     16. CPU

    标签: layout pcb

    上传时间: 2013-10-29

    上传用户:1234xhb

  • HDMI一致性测试

      The high defi nition multimedia interface (HDMI) is fastbecoming the de facto standard for passing digitalaudio and video data in home entertainment systems.This standard includes an I2C type bus called a displaydata channel (DDC) that is used to pass extended digitalinterface data (EDID) from the sinkdevice (such as adigital TV) to the source device (such as a digital A/Vreceiver). EDID includes vital information on the digitaldata formats that the sink device can accept. The HDMIspecifi cation requires that devices have less than 50pFof input capacitance on their DDC bus lines, which canbe very diffi cult to meet. The LTC®4300A’s capacitancebuffering feature allows devices to pass the HDMI DDCinput capacitance compliance test with ease.

    标签: HDMI 测试

    上传时间: 2013-11-21

    上传用户:tian126vip

  • LT5514三阶互调的精确测量

      Accurate measurement of the third order intercept pointfor low distortion IC products such as the LT5514 requirescertain precautions to be observed in the test setup andtesting procedure. The LT5514 linearity performance ishigh enough to push the test equipment and test set-up totheir limits. A method for accurate measurement of thirdorder intermodulation products, IM3, with standard testequipment is outlined below.It is also important to correctly interpret the LT5514specification with respect to ROUT, and the impact ofdemo-board transmission-line termination loss whenevaluating the linearity performance, as explained in theLT5514 Datasheet and in Note 1 of this document.

    标签: 5514 LT 三阶互调 精确测量

    上传时间: 2013-11-14

    上传用户:l254587896

  • 基于Multisim 10的矩形波信号发生器仿真与实现

    在Multisim 10软件环境下,设计一种由运算放大器构成的精确可控矩形波信号发生器,结合系统电路原理图重点阐述了各参数指标的实现与测试方法。通过改变RC电路的电容充、放电路径和时间常数实现了占空比和频率的调节,通过多路开关投入不同数值的电容实现了频段的调节,通过电压取样和同相放大电路实现了输出电压幅值的调节并提高了电路的带负载能力,可作为频率和幅值可调的方波信号发生器。Multisim 10仿真分析及应用电路测试结果表明,电路性能指标达到了设计要求。 Abstract:  Based on Multisim 10, this paper designed a kind of rectangular-wave signal generator which could be controlled exactly composed of operational amplifier, the key point was how to implement and test the parameter indicators based on the circuit diagram. The duty and the frequency were adjusted by changing the time constant and the way of charging and discharging of the capacitor, the width of frequency was adjusted by using different capacitors provided with multiple switch, the amplitude of output voltage was adjusted by sampling voltage and using in-phase amplifier circuit,the ability of driving loads was raised, the circuit can be used as squarewave signal generator whose frequency and amplitude can be adjusted. The final simulation results of Multisim 10 and the tests of applicable circuit show that the performance indicators of the circuit meets the design requirements.

    标签: Multisim 矩形波 信号发生器 仿真

    上传时间: 2014-01-21

    上传用户:shen007yue