OPTOELECTRONICS CIRCUIT COLLECTION AVALANCHE PHOTODIODE BIAS SUPPLY 1Provides an output voltage of 0V to +80V for reverse biasingan avalanche photodiode to control its gain. This circuit canalso be reconfigured to supply a 0V to –80V output.LINEAR TEC DRIVER–1This is a bridge-tied load (BTL) linear amplifier for drivinga thermoelectric cooler (TEC). It operates on a single +5Vsupply and can drive ±2A into a common TEC.LINEAR TEC DRIVER–2This is very similar to DRIVER–1 but its power output stagewas modified to operate from a single +3.3V supply in orderto increase its efficiency. Driving this amplifier from astandard +2.5V referenced signal causes the output transistorsto have unequal power dissipation.LINEAR TEC DRIVER–3This BTL TEC driver power output stage achieves very highefficiency by swinging very close to its supply rails, ±2.5V.This driver can also drive ±2A into a common TEC. Operationis shown with the power output stage operating on±1.5V supplies. Under these conditions, this linear amplifiercan achieve very high efficiency. Application ReportThe following collection of analog circuits may be useful in electro-optics applications such as optical networkingsystems. This page summarizes their salient characteristics.
上传时间： 2013-10-27
上传用户：落花无痕
第一部分 信号完整性知识基础.................................................................................5第一章 高速数字电路概述.....................................................................................51.1 何为高速电路...............................................................................................51.2 高速带来的问题及设计流程剖析...............................................................61.3 相关的一些基本概念...................................................................................8第二章 传输线理论...............................................................................................122.1 分布式系统和集总电路.............................................................................122.2 传输线的RLCG 模型和电报方程...............................................................132.3 传输线的特征阻抗.....................................................................................142.3.1 特性阻抗的本质.................................................................................142.3.2 特征阻抗相关计算.............................................................................152.3.3 特性阻抗对信号完整性的影响.........................................................172.4 传输线电报方程及推导.............................................................................182.5 趋肤效应和集束效应.................................................................................232.6 信号的反射.................................................................................................252.6.1 反射机理和电报方程.........................................................................252.6.2 反射导致信号的失真问题.................................................................302.6.2.1 过冲和下冲.....................................................................................302.6.2.2 振荡：.............................................................................................312.6.3 反射的抑制和匹配.............................................................................342.6.3.1 串行匹配.........................................................................................352.6.3.1 并行匹配.........................................................................................362.6.3.3 差分线的匹配.................................................................................392.6.3.4 多负载的匹配.................................................................................41第三章 串扰的分析...............................................................................................423.1 串扰的基本概念.........................................................................................423.2 前向串扰和后向串扰.................................................................................433.3 后向串扰的反射.........................................................................................463.4 后向串扰的饱和.........................................................................................463.5 共模和差模电流对串扰的影响.................................................................483.6 连接器的串扰问题.....................................................................................513.7 串扰的具体计算.........................................................................................543.8 避免串扰的措施.........................................................................................57第四章 EMI 抑制....................................................................................................604.1 EMI/EMC 的基本概念..................................................................................604.2 EMI 的产生..................................................................................................614.2.1 电压瞬变.............................................................................................614.2.2 信号的回流.........................................................................................624.2.3 共模和差摸EMI ..................................................................................634.3 EMI 的控制..................................................................................................654.3.1 屏蔽.....................................................................................................654.3.1.1 电场屏蔽.........................................................................................654.3.1.2 磁场屏蔽.........................................................................................674.3.1.3 电磁场屏蔽.....................................................................................674.3.1.4 电磁屏蔽体和屏蔽效率.................................................................684.3.2 滤波.....................................................................................................714.3.2.1 去耦电容.........................................................................................714.3.2.3 磁性元件.........................................................................................734.3.3 接地.....................................................................................................744.4 PCB 设计中的EMI.......................................................................................754.4.1 传输线RLC 参数和EMI ........................................................................764.4.2 叠层设计抑制EMI ..............................................................................774.4.3 电容和接地过孔对回流的作用.........................................................784.4.4 布局和走线规则.................................................................................79第五章 电源完整性理论基础...............................................................................825.1 电源噪声的起因及危害.............................................................................825.2 电源阻抗设计.............................................................................................855.3 同步开关噪声分析.....................................................................................875.3.1 芯片内部开关噪声.............................................................................885.3.2 芯片外部开关噪声.............................................................................895.3.3 等效电感衡量SSN ..............................................................................905.4 旁路电容的特性和应用.............................................................................925.4.1 电容的频率特性.................................................................................935.4.3 电容的介质和封装影响.....................................................................955.4.3 电容并联特性及反谐振.....................................................................955.4.4 如何选择电容.....................................................................................975.4.5 电容的摆放及Layout ........................................................................99第六章 系统时序.................................................................................................1006.1 普通时序系统...........................................................................................1006.1.1 时序参数的确定...............................................................................1016.1.2 时序约束条件...................................................................................1063.2 高速设计的问题.......................................................................................2093.3 SPECCTRAQuest SI Expert 的组件.......................................................2103.3.1 SPECCTRAQuest Model Integrity .................................................2103.3.2 SPECCTRAQuest Floorplanner/Editor .........................................2153.3.3 Constraint Manager .......................................................................2163.3.4 SigXplorer Expert Topology Development Environment .......2233.3.5 SigNoise 仿真子系统......................................................................2253.3.6 EMControl .........................................................................................2303.3.7 SPECCTRA Expert 自动布线器.......................................................2303.4 高速设计的大致流程...............................................................................2303.4.1 拓扑结构的探索...............................................................................2313.4.2 空间解决方案的探索.......................................................................2313.4.3 使用拓扑模板驱动设计...................................................................2313.4.4 时序驱动布局...................................................................................2323.4.5 以约束条件驱动设计.......................................................................2323.4.6 设计后分析.......................................................................................233第四章 SPECCTRAQUEST SIGNAL EXPLORER 的进阶运用..........................................2344.1 SPECCTRAQuest Signal Explorer 的功能包括：................................2344.2 图形化的拓扑结构探索...........................................................................2344.3 全面的信号完整性(Signal Integrity)分析.......................................2344.4 完全兼容 IBIS 模型...............................................................................2344.5 PCB 设计前和设计的拓扑结构提取.......................................................2354.6 仿真设置顾问...........................................................................................2354.7 改变设计的管理.......................................................................................2354.8 关键技术特点...........................................................................................2364.8.1 拓扑结构探索...................................................................................2364.8.2 SigWave 波形显示器........................................................................2364.8.3 集成化的在线分析(Integration and In-process Analysis) .236第五章 部分特殊的运用...............................................................................2375.1 Script 指令的使用..................................................................................2375.2 差分信号的仿真.......................................................................................2435.3 眼图模式的使用.......................................................................................249第四部分：HYPERLYNX 仿真工具使用指南............................................................251第一章 使用LINESIM 进行前仿真.......................................................................2511.1 用LineSim 进行仿真工作的基本方法...................................................2511.2 处理信号完整性原理图的具体问题.......................................................2591.3 在LineSim 中如何对传输线进行设置...................................................2601.4 在LineSim 中模拟IC 元件.....................................................................2631.5 在LineSim 中进行串扰仿真...................................................................268第二章 使用BOARDSIM 进行后仿真......................................................................2732.1 用BOARDSIM 进行后仿真工作的基本方法...................................................2732.2 BoardSim 的进一步介绍..........................................................................2922.3 BoardSim 中的串扰仿真..........................................................................309
上传时间： 2014-04-18
上传用户：wpt
This document provides practical, common guidelines for incorporating PCI Express interconnect layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10- layer or more server baseboard designs. Guidelines and constraints in this document are intended for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI Express devices located on the same baseboard (chip-to-chip routing) and interconnects between a PCI Express device located “down” on the baseboard and a device located “up” on an add-in card attached through a connector. This document is intended to cover all major components of the physical interconnect including design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card edge-finger and connector considerations. The intent of the guidelines and examples is to help ensure that good high-speed signal design practices are used and that the timing/jitter and loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect. However, while general physical guidelines and suggestions are given, they may not necessarily guarantee adequate performance of the interconnect for all layouts and implementations. Therefore, designers should consider modeling and simulation of the interconnect in order to ensure compliance to all applicable specifications. The document is composed of two main sections. The first section provides an overview of general topology and interconnect guidelines. The second section concentrates on physical layout constraints where bulleted items at the beginning of a topic highlight important constraints, while the narrative that follows offers additional insight.
上传时间： 2013-10-15
上传用户：busterman
Avalanche photo diode (APD) receiver modules arewidely used in fi ber optic communication systems. AnAPD module contains the APD and a signal conditioningamplifi er, but is not completely self contained. It stillrequires signifi cant support circuitry including a highvoltage, low noise power supply and a precision currentmonitor to indicate the signal strength. The challenge issqueezing this support circuitry into applications withlimited board space. The LT®3482 addresses this challengeby integrating a monolithic DC/DC step-up converter andan accurate current monitor. The LT3482 can supportup to a 90V APD bias voltage, and the current monitorprovides better than 10% accuracy over four decades ofdynamic range (250nA to 2.5mA).
上传时间： 2014-01-18
上传用户：wenyuoo
A large group of fiber optic lasers are powered by DCcurrent. Laser drive is supplied by a current source withmodulation added further along the signal path. Thecurrent source, although conceptually simple, constitutesan extraordinarily tricky design problem. There are anumber of practical requirements for a fiber optic currentsource and failure to consider them can cause laser and/or optical component destruction.
上传时间： 2013-10-30
上传用户：wanghui2438
This collection of circuits was worked out between June1991 and July of 1994. Most were designed at customerrequest or are derivatives of such efforts. All representsubstantial effort and, as such, are disseminated here forwider study and (hopefully) use.1 The examples areroughly arranged in categories including power conversion,transducer signal conditioning, amplifiers and signalgenerators. As always, reader comment and questionsconcerning variants of the circuits shown may be addresseddirectly to the author.
上传时间： 2013-11-15
上传用户：凌云御清风
锁定放大是微弱信号检测的重要手段。基于相关检测理论，利用开关电容的开关实现锁定放大器中乘法器的功能，提出开关电容和积分器相结合以实现相关检测的方法，并设计出一种锁定放大器。该锁定放大器将微弱信号转化为与之相关的方波，通过后续电路得到正比于被测信号的直流电平，为后续采集处理提供方便。测量数据表明锁定放大器前级可将10-6 A的电流转换为10-1 V的电压，后级通过带通滤波器级联可将信号放大1×105倍。该方法在降低噪声的同时，可对微弱信号进行放大，线性度较高、稳定性较好。 Abstract: Lock-in Amplifying（LIA）is one of important means for weak signal detection. Based on cross-correlation detection theory， switch in the swithched capacitor was used as multiplier of LIA， and a new method of correlation detection was proposed combining swithched capacitor with integrator. A kind of LIA was designed which can convert the weak signal to square-wave， then DC proportional to measured signal was obtained through follow-up conditioning circuit， providing convenience for signal acquisition and processing. The measured data shows that the electric current（10-6 A） can be changed into voltage（10-1 V） by LIA， and the signal is magnified 1×105 times by cascade band-pass filter. The noise is suppressed and the weak signal is amplified. It has the advantages of good linearity and stability.
上传时间： 2013-11-29
上传用户：黑漆漆
The MAX9257/MAX9258 programmable serializer/deserializer (SerDes) devices transfer both video data and control signals over the same twisted-pair cable. However, control data can only be transmitted during the vertical blank time, which is indicated by the control-channel-enabled output (CCEN) signal. The electronic control unit (ECU) firmware designer needs to know how quickly to respond to the CCEN signal before it times out and how to calculate this duration. This application note describes how to calculate the duration of the CCEN for the MAX9257/MAX9258 SerDes chipset. The calculation is based on STO timeout, clock frequency, and UART bit timing. The CCEN duration is programmable and can be closed if not in use.
上传时间： 2014-01-24
上传用户：xingisme
针对科研实验中对拉压千斤顶加载过程控制的需要，采用ATmega128单片机控制步进电机进而实现对执行系统的电动泵站实行自动控制。对力和位移的数据采集与处理及用步进电机控制电动泵站手柄的技术细节作了重点描述。通过单片机的A/D变换器对AMP放大模块采集的电桥信号作量化处理，千斤顶的操控手柄位置依电动油泵阀门开启的方向和大小作若干定位，单片机根据力或位移传感器信号，实时控制步进电机驱动手柄旋转到相应操控位置。 Abstract: This article describes the use of ATmega128 AVR microcontroller series of DBS electric pumping stations and QF100/200 separate twoway hydraulic jack to automate the process of manipulating the work of the technical content. Articles on force and displacement data acquisition and processing， and stepper motor control electric pump with the handle of the key technical details were described. Through the MCU’s A / D converter module is collected on the AMP amplification quantify the signal bridge， jack handle position control valve opening according to the direction of electric pumps for a number of positioning and size of the microcontroller based on force or displacement sensor signals， real-time control stepper motor drive control handle rotate to the appropriate location.
上传时间： 2014-01-16
上传用户：hasan2015
便携式信号采集在机器健康诊断系统中有较高的应用价值。机器健康诊断的信号特点是包括低频信号。本文研究是为了实现简易而且低成本的低频便携式信号采集。以Microchip公司单片机PIC18F1320为核心设计信号采集电路，实现了信号的采集和保存。系统采用串行电可擦除芯片24LC32A保存数据，经过有线通信，信号数据由串行口通过MAX232芯片输送到微型计算机接收和保存，最后绘制出信号波形。 微型计算机程序采用Visual Basic编程。研究成功采样频率为3 kHz的复杂信号，证明该方案符合设计要求。 Abstract: Portable signal acquisition is useful in machine health monitoring systems. The signal characteristics of machine health monitoring includes low frequency signals. The goal of this study is to realize simple, inexpensive and portable low frequency signal sampling. This paper provides the project of signal acquisition system design based on PIC18F1320 microcontroller manufactured by the Microchip Technology Incorporation to achieve signal sampling and storage. The system adopted EEPROM 24LC32A to store the signal data. The microcomputer received data via wired link with the MAX232 IC through the serial port. The microcomputer program, programmed in Visual Basic, received the data, stored it and plotted the signal. The study successfully samples 3kHz complicated signals and thus meets the design requirement.
上传时间： 2013-11-19
上传用户：moerwang
