随着多媒体技术的发展，数字图像处理已经成为众多应用系统的核心和基础。它的发展主要依赖于两个性质不同、自成体系但又紧密相关的研究领域：图像处理算法及其相应的电路实现。图像处理系统的硬件实现—般有三种方式：专用的图像处理器件集成芯片(Application Specific Integrated Circuit)、数字信号处理器(Digital Signal Process)和现场可编程门阵列(Field Programmable Gate Array)以及相关电路组成。它们可以实时高速完成各种图像处理算法。图像处理中，低层的图像预处理的数据量很大，要求处理速度快，但运算结果相对比较简单。相对于其他两种方式，基于FPGA的图像处理方式的系统更适合于图像的预处理。本文设计了—种基于FPGA的小波域图像去噪系统。首先，阐述了基于小波变换的图像去噪算法原理，重点讨论了小波邻域阈值(NeighShrink)去噪算法，并给出了该算法相应的Matlab 仿真；然后，为了改进邻域阈值去噪算法中对每个分解子带都采用相同邻域和阈值的缺点，本文提出了基于最小二乘支持向量机(LS-SVM)分类的邻域阈值去噪算法和以斯坦无偏估计 (SURE)为准则同时结合小波系数尺度间关系的邻域阈值去噪算法。经Matlab实验表明，相比于其他几种经典算法，本文提出的两种改进算法在滤除噪声的同时能更好地保护图像细节，并在较高噪声情况下能获得更高的峰值信噪比。在此基础上本文将提出的改进小波邻域阈值去噪算法进行了相应的简化，以满足低噪声处理要求且易于在FPGA上实现；最后，给出了基于 FPGA的小波邻域阈值去噪系统的总体结构和FPGA内部各功能模块的具体实现方案，包括二维离散小波变换模块、二维离散小波逆变换模块、SDRAM存储器控制模块、去噪计算模块和系统核心控制模块，并对各个系统模块和整体进行了仿真验证，结果表明本文设计的基于FPGA 的小波邻域阈值去噪系统能满足实际的图像处理要求，具有一定的理论和实际应用价值。关键词：图像处理系统，FPGA，图像去噪算法，小波变换
上传时间： 2013-05-16
上传用户：450976175
JTAG(Joint Test Action Group;联合测试行动小组)是一种国际标准测试协议（IEEE 1149.1兼容），主要用于芯片内部测试。
上传时间： 2013-04-24
上传用户：amwfhv
Methods for designing a maintenance simulation training system for certain kind of radio are introduced. Fault modeling method is used to establish the fault database. The system sets up some typical failures， follow the prompts trainers can locate the fault source and confirm the type to accomplish corresponding fault maintenance training. A training evaluation means is given to examining and evaluating the training performance. The system intuitively and vividly shows the fault maintenance process， it can not only be used in teaching， but also in daily maintenance training to efficiently improve the maintenance operation level. Graphical programming language LabVIEW is used to develop the system platform.
上传时间： 2013-11-19
上传用户：3294322651
Abstract: A laser module designer can use a fixed resistor, mechanical pot, digital pot, or a digital-to-analogconverter (DAC) to control the laser driver's modulation and bias currents. The advantages of a programmablemethod (POT or DAC) are that the manufacturing process can be automated and digital control can be applied(e.g., to compensate for temperature). Using POTs can be a more simple approach than a DAC. There can be aslight cost advantage to using a POT, but this is usually not significant relative to other pieces of the design.Using a DAC can offer advantages, including improved linearity (translating to ease of software implementationand ability to hit the required accuracy), increased board density, a wider range of resolutions, a betteroptimization range, ease of use with a negative voltage laser driver, and unit-to-unit consistency
上传时间： 2013-11-13
上传用户：ca05991270
This unique guide to designing digital VLSI circuits takes a top-down approach, reflecting the natureof the design process in industry. Starting with architecture design, the book explains the why andhow of digital design, using the physics that designers need to know, and no more.Covering system and component aspects, design verification, VHDL modelling, clocking, signalintegrity, layout, electricaloverstress, field-programmable logic, economic issues, and more, thescope of the book is singularly comprehensive.
标签： Integrated Digital Circuit Design
上传时间： 2013-11-04
上传用户：life840315
The MAX2691 low-noise amplifier (LNA) is designed forGPS L2 applications. Designed in Maxim’s advancedSiGe process, the device achieves high gain andlow noise figure while maximizing the input-referred 1dBcompression point and the 3rd-order intercept point. TheMAX2691 provides a high gain of 17.5dB and sub 1dBnoise figure.
标签： Amplifier Low-Noise 2691 Band
上传时间： 2014-12-04
上传用户：zaocan888
•Founded in Jan. 08, 2001 in Shanghai, China.•Fabless IDH focused on Analog & Mixed Signal Chip design & marketing •Over 100 IC introduced.•Over 200 OEM Customer worldwide•ISO-9000 Certified•Distribution Channel in Taiwan, China & Japan To achieve 100% customer satisfactionby producing the technically advanced product with the best quality, on-time delivery and service. Leverages on proprietary process and world-class engineering team to develop innovative & high quality analog solutions that add value to electronics equipment.
标签： Circuit Analog Design Porta
上传时间： 2013-10-24
上传用户：songnanhua
第一部分 信号完整性知识基础.................................................................................5第一章 高速数字电路概述.....................................................................................51.1 何为高速电路...............................................................................................51.2 高速带来的问题及设计流程剖析...............................................................61.3 相关的一些基本概念...................................................................................8第二章 传输线理论...............................................................................................122.1 分布式系统和集总电路.............................................................................122.2 传输线的RLCG 模型和电报方程...............................................................132.3 传输线的特征阻抗.....................................................................................142.3.1 特性阻抗的本质.................................................................................142.3.2 特征阻抗相关计算.............................................................................152.3.3 特性阻抗对信号完整性的影响.........................................................172.4 传输线电报方程及推导.............................................................................182.5 趋肤效应和集束效应.................................................................................232.6 信号的反射.................................................................................................252.6.1 反射机理和电报方程.........................................................................252.6.2 反射导致信号的失真问题.................................................................302.6.2.1 过冲和下冲.....................................................................................302.6.2.2 振荡：.............................................................................................312.6.3 反射的抑制和匹配.............................................................................342.6.3.1 串行匹配.........................................................................................352.6.3.1 并行匹配.........................................................................................362.6.3.3 差分线的匹配.................................................................................392.6.3.4 多负载的匹配.................................................................................41第三章 串扰的分析...............................................................................................423.1 串扰的基本概念.........................................................................................423.2 前向串扰和后向串扰.................................................................................433.3 后向串扰的反射.........................................................................................463.4 后向串扰的饱和.........................................................................................463.5 共模和差模电流对串扰的影响.................................................................483.6 连接器的串扰问题.....................................................................................513.7 串扰的具体计算.........................................................................................543.8 避免串扰的措施.........................................................................................57第四章 EMI 抑制....................................................................................................604.1 EMI/EMC 的基本概念..................................................................................604.2 EMI 的产生..................................................................................................614.2.1 电压瞬变.............................................................................................614.2.2 信号的回流.........................................................................................624.2.3 共模和差摸EMI ..................................................................................634.3 EMI 的控制..................................................................................................654.3.1 屏蔽.....................................................................................................654.3.1.1 电场屏蔽.........................................................................................654.3.1.2 磁场屏蔽.........................................................................................674.3.1.3 电磁场屏蔽.....................................................................................674.3.1.4 电磁屏蔽体和屏蔽效率.................................................................684.3.2 滤波.....................................................................................................714.3.2.1 去耦电容.........................................................................................714.3.2.3 磁性元件.........................................................................................734.3.3 接地.....................................................................................................744.4 PCB 设计中的EMI.......................................................................................754.4.1 传输线RLC 参数和EMI ........................................................................764.4.2 叠层设计抑制EMI ..............................................................................774.4.3 电容和接地过孔对回流的作用.........................................................784.4.4 布局和走线规则.................................................................................79第五章 电源完整性理论基础...............................................................................825.1 电源噪声的起因及危害.............................................................................825.2 电源阻抗设计.............................................................................................855.3 同步开关噪声分析.....................................................................................875.3.1 芯片内部开关噪声.............................................................................885.3.2 芯片外部开关噪声.............................................................................895.3.3 等效电感衡量SSN ..............................................................................905.4 旁路电容的特性和应用.............................................................................925.4.1 电容的频率特性.................................................................................935.4.3 电容的介质和封装影响.....................................................................955.4.3 电容并联特性及反谐振.....................................................................955.4.4 如何选择电容.....................................................................................975.4.5 电容的摆放及Layout ........................................................................99第六章 系统时序.................................................................................................1006.1 普通时序系统...........................................................................................1006.1.1 时序参数的确定...............................................................................1016.1.2 时序约束条件...................................................................................1063.2 高速设计的问题.......................................................................................2093.3 SPECCTRAQuest SI Expert 的组件.......................................................2103.3.1 SPECCTRAQuest Model Integrity .................................................2103.3.2 SPECCTRAQuest Floorplanner/Editor .........................................2153.3.3 Constraint Manager .......................................................................2163.3.4 SigXplorer Expert Topology Development Environment .......2233.3.5 SigNoise 仿真子系统......................................................................2253.3.6 EMControl .........................................................................................2303.3.7 SPECCTRA Expert 自动布线器.......................................................2303.4 高速设计的大致流程...............................................................................2303.4.1 拓扑结构的探索...............................................................................2313.4.2 空间解决方案的探索.......................................................................2313.4.3 使用拓扑模板驱动设计...................................................................2313.4.4 时序驱动布局...................................................................................2323.4.5 以约束条件驱动设计.......................................................................2323.4.6 设计后分析.......................................................................................233第四章 SPECCTRAQUEST SIGNAL EXPLORER 的进阶运用..........................................2344.1 SPECCTRAQuest Signal Explorer 的功能包括：................................2344.2 图形化的拓扑结构探索...........................................................................2344.3 全面的信号完整性(Signal Integrity)分析.......................................2344.4 完全兼容 IBIS 模型...............................................................................2344.5 PCB 设计前和设计的拓扑结构提取.......................................................2354.6 仿真设置顾问...........................................................................................2354.7 改变设计的管理.......................................................................................2354.8 关键技术特点...........................................................................................2364.8.1 拓扑结构探索...................................................................................2364.8.2 SigWave 波形显示器........................................................................2364.8.3 集成化的在线分析(Integration and In-process Analysis) .236第五章 部分特殊的运用...............................................................................2375.1 Script 指令的使用..................................................................................2375.2 差分信号的仿真.......................................................................................2435.3 眼图模式的使用.......................................................................................249第四部分：HYPERLYNX 仿真工具使用指南............................................................251第一章 使用LINESIM 进行前仿真.......................................................................2511.1 用LineSim 进行仿真工作的基本方法...................................................2511.2 处理信号完整性原理图的具体问题.......................................................2591.3 在LineSim 中如何对传输线进行设置...................................................2601.4 在LineSim 中模拟IC 元件.....................................................................2631.5 在LineSim 中进行串扰仿真...................................................................268第二章 使用BOARDSIM 进行后仿真......................................................................2732.1 用BOARDSIM 进行后仿真工作的基本方法...................................................2732.2 BoardSim 的进一步介绍..........................................................................2922.3 BoardSim 中的串扰仿真..........................................................................309
上传时间： 2014-04-18
上传用户：wpt
Abstract: This application note details a step-by-step design process for the MAX16833 high-voltagehigh-brightness LED driver. This process can speed up prototyping and increase the chance for firstpass
上传时间： 2013-10-09
上传用户：tianjinfan
The core voltages for FPGAs are moving lower as a resultof advances in the fabrication process. The newest FPGAfamily from Altera, the Stratix® II, now requires a corevoltage of 1.2V and the Stratix, Stratix GX, HardCopy®Stratix and CycloneTM families require a core voltage of1.5V. This article discusses how to power the core and I/Oof low voltage FPGAs using the latest step-down switchmode controllers from Linear Technology Corporation.
上传时间： 2013-10-08
上传用户：wangfei22
