C++在几乎所有的计算环境中都非常普及，而且可以用于几乎所有的应用程序。C++从C中继承了过程化编程的高效性，并集成了面向对象编程的功能。C++在其标准库中提供了大量的功能。有许多商业C++库支持数量众多的操作系统环境和专业应用程序。但因为它的内容太多了，所以掌握C++并不十分容易。本书详述了C++语言的各个方面，包括数据类型、程序控制、函数、指针、调试、类、重载、继承、多态性、模板、异常和输入输出等内容。每一章都以前述内容为基础，每个关键点都用具体的示例进行详细的讲解。本书基本不需要读者具备任何C++知识，书中包含了理解C++的所有必要知识，读者可以从头开始编写自己的C++程序。本书也适合于具备另一种语言编程经验但希望全面掌握C++语言的读者。 I created all the files under Microsoft Windows so lines are terminated by CR/LF. In addition to this "ReadMe" file you will find three zip archives in the primary archive, so you need to unzip each of these to get at the code. 为PDG格式,这有pdg阅读器下载|pdg文件阅读器下载
标签： 源代码
上传时间： 2013-11-18
上传用户：gaoqinwu
There has long been a need for portable ultrasoundsystems that have good resolution at affordable costpoints. Portable systems enable healthcare providersto use ultrasound in remote locations such asdisaster zones, developing regions, and battlefields,where it was not previously practical to do so.
上传时间： 2015-01-01
上传用户：hfnishi
Nios II软件构建工具入门 The Nios® II Software Build Tools (SBT) allows you to construct a wide variety of complex embedded software systems using a command-line interface. From this interface, you can execute Software Built Tools command utilities, and use scripts other tools) to combine the command utilities in many useful ways. This chapter introduces you to project creation with the SBT at the command line This chapter includes the following sections: ■ “Advantages of Command-Line Software Development” ■ “Outline of the Nios II SBT Command-Line Interface” ■ “Getting Started in the SBT Command Line” ■ “Software Build Tools Scripting Basics” on page 3–8
上传时间： 2013-11-15
上传用户：nanxia
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
上传时间： 2013-11-21
上传用户：不懂夜的黑
Design techniques for electronic systems areconstantly changing. In industries at the heart of thedigital revolution, this change is especially acute.Functional integration, dramatic increases incomplexity, new standards and protocols, costconstraints, and increased time-to-market pressureshave bolstered both the design challenges and theopportunities to develop modern electronic systems.One trend driving these changes is the increasedintegration of core logic with previously discretefunctions to achieve higher performance and morecompact board designs.
上传时间： 2013-11-23
上传用户：kangqiaoyibie
Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the developmentof designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit theDocumentation in any form or by any means including, but not limited to, electronic, mechanical, photocopying, recording, or otherwise,without the prior written consent of Xilinx. Xilinx expressly disclaims any liability arising out of your use of the Documentation. Xilinx reservesthe right, at its sole discretion, to change the Documentation without notice at any time. Xilinx assumes no obligation to correct any errorscontained in the Documentation, or to advise you of any corrections or updates. Xilinx expressly disclaims any liability in connection withtechnical support or assistance that may be provided to you in connection with the Information.
上传时间： 2013-11-11
上传用户：zwei41
Xilinx FPGAs require at least two power supplies: VCCINTfor core circuitry and VCCO for I/O interface. For the latestXilinx FPGAs, including Virtex-II Pro, Virtex-II and Spartan-3, a third auxiliary supply, VCCAUX may be needed. Inmost cases, VCCAUX can share a power supply with VCCO.The core voltages, VCCINT, for most Xilinx FPGAs, rangefrom 1.2V to 2.5V. Some mature products have 3V, 3.3Vor 5V core voltages. Table 1 shows the core voltagerequirement for most of the FPGA device families. TypicalI/O voltages (VCCO) vary from 1.2V to 3.3V. The auxiliaryvoltage VCCAUX is 2.5V for Virtex-II Pro and Spartan-3, andis 3.3V for Virtex-II.
上传时间： 2013-10-22
上传用户：aeiouetla
This document was developed under the Standard Hardware and Reliability Program (SHARP) TechnologyIndependent Representation of Electronic Products (TIREP) project. It is intended for use by VHSIC HardwareDescription Language (VHDL) design engineers and is offered as guidance for the development of VHDL modelswhich are compliant with the VHDL Data Item Description (DID DI-EGDS-80811) and which can be providedto manufacturing engineering personnel for the development of production data and the subsequent productionof hardware. Most VHDL modeling performed to date has been concentrated at either the component level orat the conceptual system level. The assembly and sub-assembly levels have been largely disregarded. Under theSHARP TIREP project, an attempt has been made to help close this gap. The TIREP models are based upon lowcomplexity Standard Electronic Modules (SEM) of the format A configuration. Although these modules are quitesimple, it is felt that the lessons learned offer guidance which can readily be applied to a wide range of assemblytypes and complexities.
上传时间： 2013-11-20
上传用户：pzw421125
The fundamental problem of communication is that of reproducing at one point either exactly or approximately a message selected at another point. Frequently the messages have meaning; that is they refer to or are correlated according to some system with certain physical or conceptual entities.
标签： 通信
上传时间： 2013-11-11
上传用户：xy@1314
Xilinx is disclosing this user guide, manual, release note, and/or specification (the “Documentation”) to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the Documentation in any form or by any means including, but not limited to, electronic, mechanical, photocopying, recording, or otherwise, without the prior written consent of Xilinx. Xilinx expressly disclaims any liability arising out of your use of the Documentation. Xilinx reserves the right, at its sole discretion, to change the Documentation without notice at any time. Xilinx assumes no obligation to correct any errors contained in the Documentation, or to advise you of any corrections or updates. Xilinx expressly disclaims any liability in connection with technical support or assistance that may be provided to you in connection with the Information.
标签： CPLD
上传时间： 2014-12-05
上传用户：qazxsw
