1. How the termination of the current process?
标签： termination the current process
上传时间： 2013-12-16
上传用户：sssl
Under the labor sentiment monitor system has several parts of compositions: The mobile termination software and hardware development, the central server software development as well as opens video frequency the prompt reflection. The labor sentiment monitor end is responsible for the data and the scene picture which
标签： compositions termination sentiment monitor
上传时间： 2014-11-29
上传用户：aig85
For a variety of reasons, it is desirable to charge batteriesas rapidly as possible. At the same time, overchargingmust be limited to prolong battery life. Such limitation ofovercharging depends on factors such as the choice ofcharge termination technique and the use of multi-rate/multi-stage charging schemes. The majority of batterycharger ICs available today lock the user into one fixedcharging regimen, with at best a limited number ofcustomization options to suit a variety of application needsor battery types. The LTC®1325 addresses these shortcomingsby providing the user with all the functionalblocks needed to implement a simple but highly flexiblebattery charger (see Figure 1) which not only addressesthe issue of charging batteries but also those of batteryconditioning and capacity monitoring.
上传时间： 2013-10-19
上传用户：royzhangsz
The RT9005A/B is a dual-output Linear regulator for DDR-SDRAM VDDQ supply and termination voltage VTT supply.
上传时间： 2013-11-13
上传用户：lmq0059
Accurate measurement of the third order intercept pointfor low distortion IC products such as the LT5514 requirescertain precautions to be observed in the test setup andtesting procedure. The LT5514 linearity performance ishigh enough to push the test equipment and test set-up totheir limits. A method for accurate measurement of thirdorder intermodulation products, IM3, with standard testequipment is outlined below.It is also important to correctly interpret the LT5514specification with respect to ROUT, and the impact ofdemo-board transmission-line termination loss whenevaluating the linearity performance, as explained in theLT5514 Datasheet and in Note 1 of this document.
上传时间： 2013-11-14
上传用户：l254587896
Procedure TSPSA: begin init-of-T { T为初始温度} S={1，……，n} {S为初始值} termination=false while termination=false begin for i=1 to L do begin generate(S′form S) { 从当前回路S产生新回路S′} Δt:=f(S′))-f(S) {f(S)为路径总长} IF(Δt<0) OR (EXP(-Δt/T)>Random-of-[0,1]) S=S′ IF the-halt-condition-is-TRUE THEN termination=true End T_lower End End
标签： Procedure init-of-T TSPSA begin
上传时间： 2013-12-20
上传用户：shinesyh
Cypress Semiconductor makes a variety of PLL-based clock generators. This application note provides a set of recommendations to optimize usage of Cypress clock devices in a system. The application note begins with recommended termination techniques for clock generators. Subsequently, power supply filtering and bypassing is discussed. Finally, the application note provides some recommendations on board layout.
标签： Semiconductor application generators PLL-based
上传时间： 2013-12-20
上传用户：水中浮云
A passive optical network (PON) is a point-to-multipoint, fiber to the premises network architecture in which unpowered optical splitters are used to enable a single optical fiber to serve multiple premises, typically 32-128. A PON consists of an Optical Line termination (OLT) at the service provider s central office and a number of Optical Network Units (ONUs) near end users. A PON configuration reduces the amount of fiber and central office equipment required compared with point to point architectures
标签： network point-to-multipoint architecture premises
上传时间： 2016-12-10
上传用户：王庆才
The CommScope InstaPATCH® 360 and ReadyPATCH® solutions utilize a standards-compliant multi-fiber connector to provide high density termination capability. The connector is called an MPO (Multi-fiber Push On) connector by the standards. In many cases, multi-fiber connector products are referred to as MTP connectors. This document is intended to clarify the difference between the two terms – MPO and MTP.
上传时间： 2017-04-12
上传用户：asdfghjkl1234567890
1. Scope ......................................................................................................................................................................... 12. DDR4 SDRAM Package Pinout and Addressing ....................................................................................................... 22.1 DDR4 SDRAM Row for X4,X8 and X16 ................................................................................................................22.2 DDR4 SDRAM Ball Pitch........................................................................................................................................22.3 DDR4 SDRAM Columns for X4,X8 and X16 ..........................................................................................................22.4 DDR4 SDRAM X4/8 Ballout using MO-207......................................................................................................... 22.5 DDR4 SDRAM X16 Ballout using MO-207.............................................................................................................32.6 Pinout Description ..................................................................................................................................................52.7 DDR4 SDRAM Addressing.....................................................................................................................................73. Functional Description ...............................................................................................................................................83.1 Simplified State Diagram ....................................................................................................................................83.2 Basic Functionality..................................................................................................................................................93.3 RESET and Initialization Procedure .....................................................................................................................103.3.1 Power-up Initialization Sequence .............................................................................................................103.3.2 Reset Initialization with Stable Power ......................................................................................................113.4 Register Definition ................................................................................................................................................123.4.1 Programming the mode registers .............................................................................................................123.5 Mode Register ......................................................................................................................................................134. DDR4 SDRAM Command Description and Operation ............................................................................................. 244.1 Command Truth Table ..........................................................................................................................................244.2 CKE Truth Table ...................................................................................................................................................254.3 Burst Length, Type and Order ..............................................................................................................................264.3.1 BL8 Burst order with CRC Enabled .........................................................................................................264.4 DLL-off Mode & DLL on/off Switching procedure ................................................................................................274.4.1 DLL on/off switching procedure ...............................................................................................................274.4.2 DLL “on” to DLL “off” Procedure ..............................................................................................................274.4.3 DLL “off” to DLL “on” Procedure ..............................................................................................................284.5 DLL-off Mode........................................................................................................................................................294.6 Input Clock Frequency Change ............................................................................................................................304.7 Write Leveling.......................................................................................................................................................314.7.1 DRAM setting for write leveling & DRAM termination function in that mode ............................................324.7.2 Procedure Description .............................................................................................................................334.7.3 Write Leveling Mode Exit .........................................................................................................................34
标签： DDR4
上传时间： 2022-01-09
上传用户：
