Ultiboard PCB introduction
标签： development ultiboard PCB
上传时间： 2013-11-21
上传用户：HGH77P99
第一部分 信号完整性知识基础.................................................................................5第一章 高速数字电路概述.....................................................................................51.1 何为高速电路...............................................................................................51.2 高速带来的问题及设计流程剖析...............................................................61.3 相关的一些基本概念...................................................................................8第二章 传输线理论...............................................................................................122.1 分布式系统和集总电路.............................................................................122.2 传输线的RLCG 模型和电报方程...............................................................132.3 传输线的特征阻抗.....................................................................................142.3.1 特性阻抗的本质.................................................................................142.3.2 特征阻抗相关计算.............................................................................152.3.3 特性阻抗对信号完整性的影响.........................................................172.4 传输线电报方程及推导.............................................................................182.5 趋肤效应和集束效应.................................................................................232.6 信号的反射.................................................................................................252.6.1 反射机理和电报方程.........................................................................252.6.2 反射导致信号的失真问题.................................................................302.6.2.1 过冲和下冲.....................................................................................302.6.2.2 振荡：.............................................................................................312.6.3 反射的抑制和匹配.............................................................................342.6.3.1 串行匹配.........................................................................................352.6.3.1 并行匹配.........................................................................................362.6.3.3 差分线的匹配.................................................................................392.6.3.4 多负载的匹配.................................................................................41第三章 串扰的分析...............................................................................................423.1 串扰的基本概念.........................................................................................423.2 前向串扰和后向串扰.................................................................................433.3 后向串扰的反射.........................................................................................463.4 后向串扰的饱和.........................................................................................463.5 共模和差模电流对串扰的影响.................................................................483.6 连接器的串扰问题.....................................................................................513.7 串扰的具体计算.........................................................................................543.8 避免串扰的措施.........................................................................................57第四章 EMI 抑制....................................................................................................604.1 EMI/EMC 的基本概念..................................................................................604.2 EMI 的产生..................................................................................................614.2.1 电压瞬变.............................................................................................614.2.2 信号的回流.........................................................................................624.2.3 共模和差摸EMI ..................................................................................634.3 EMI 的控制..................................................................................................654.3.1 屏蔽.....................................................................................................654.3.1.1 电场屏蔽.........................................................................................654.3.1.2 磁场屏蔽.........................................................................................674.3.1.3 电磁场屏蔽.....................................................................................674.3.1.4 电磁屏蔽体和屏蔽效率.................................................................684.3.2 滤波.....................................................................................................714.3.2.1 去耦电容.........................................................................................714.3.2.3 磁性元件.........................................................................................734.3.3 接地.....................................................................................................744.4 PCB 设计中的EMI.......................................................................................754.4.1 传输线RLC 参数和EMI ........................................................................764.4.2 叠层设计抑制EMI ..............................................................................774.4.3 电容和接地过孔对回流的作用.........................................................784.4.4 布局和走线规则.................................................................................79第五章 电源完整性理论基础...............................................................................825.1 电源噪声的起因及危害.............................................................................825.2 电源阻抗设计.............................................................................................855.3 同步开关噪声分析.....................................................................................875.3.1 芯片内部开关噪声.............................................................................885.3.2 芯片外部开关噪声.............................................................................895.3.3 等效电感衡量SSN ..............................................................................905.4 旁路电容的特性和应用.............................................................................925.4.1 电容的频率特性.................................................................................935.4.3 电容的介质和封装影响.....................................................................955.4.3 电容并联特性及反谐振.....................................................................955.4.4 如何选择电容.....................................................................................975.4.5 电容的摆放及Layout ........................................................................99第六章 系统时序.................................................................................................1006.1 普通时序系统...........................................................................................1006.1.1 时序参数的确定...............................................................................1016.1.2 时序约束条件...................................................................................1063.2 高速设计的问题.......................................................................................2093.3 SPECCTRAQuest SI Expert 的组件.......................................................2103.3.1 SPECCTRAQuest Model Integrity .................................................2103.3.2 SPECCTRAQuest Floorplanner/Editor .........................................2153.3.3 Constraint Manager .......................................................................2163.3.4 SigXplorer Expert Topology Development Environment .......2233.3.5 SigNoise 仿真子系统......................................................................2253.3.6 EMControl .........................................................................................2303.3.7 SPECCTRA Expert 自动布线器.......................................................2303.4 高速设计的大致流程...............................................................................2303.4.1 拓扑结构的探索...............................................................................2313.4.2 空间解决方案的探索.......................................................................2313.4.3 使用拓扑模板驱动设计...................................................................2313.4.4 时序驱动布局...................................................................................2323.4.5 以约束条件驱动设计.......................................................................2323.4.6 设计后分析.......................................................................................233第四章 SPECCTRAQUEST SIGNAL EXPLORER 的进阶运用..........................................2344.1 SPECCTRAQuest Signal Explorer 的功能包括：................................2344.2 图形化的拓扑结构探索...........................................................................2344.3 全面的信号完整性(Signal Integrity)分析.......................................2344.4 完全兼容 IBIS 模型...............................................................................2344.5 PCB 设计前和设计的拓扑结构提取.......................................................2354.6 仿真设置顾问...........................................................................................2354.7 改变设计的管理.......................................................................................2354.8 关键技术特点...........................................................................................2364.8.1 拓扑结构探索...................................................................................2364.8.2 SigWave 波形显示器........................................................................2364.8.3 集成化的在线分析(Integration and In-process Analysis) .236第五章 部分特殊的运用...............................................................................2375.1 Script 指令的使用..................................................................................2375.2 差分信号的仿真.......................................................................................2435.3 眼图模式的使用.......................................................................................249第四部分：HYPERLYNX 仿真工具使用指南............................................................251第一章 使用LINESIM 进行前仿真.......................................................................2511.1 用LineSim 进行仿真工作的基本方法...................................................2511.2 处理信号完整性原理图的具体问题.......................................................2591.3 在LineSim 中如何对传输线进行设置...................................................2601.4 在LineSim 中模拟IC 元件.....................................................................2631.5 在LineSim 中进行串扰仿真...................................................................268第二章 使用BOARDSIM 进行后仿真......................................................................2732.1 用BOARDSIM 进行后仿真工作的基本方法...................................................2732.2 BoardSim 的进一步介绍..........................................................................2922.3 BoardSim 中的串扰仿真..........................................................................309
上传时间： 2014-04-18
上传用户：wpt
Power over Ethernet (PoE) is a new development thatallows for the delivery of power to Ethernet-based devicesvia standard Ethernet CAT5 cable, precluding the need forwall adapters or other external power sources. The PoEspecification defines a hardware detection protocol wherePower Sourcing Equipment (PSE) is able to identify PoEPowered Devices (PDs), thus allowing full backwardscompatibility with non-PoE-aware (legacy) Ethernetdevices.
上传时间： 2013-11-11
上传用户：daoyue
ST8S开发原理图,和大家分享下,希望能和更多朋友一起学习,进步.
标签： S-DISCOVERY STM 原理图
上传时间： 2013-12-31
上传用户：1039312764
Abstract: This application note describes how to build, debug, and run applications on the on-board MAXQ622microcontroller to interface with the DS8005 dual smart card interface. This is demonstrated in both IAREmbedded Workbench and the Rowley CrossWorks IDE, using sample code provided with the kit.
上传时间： 2013-10-29
上传用户：ddddddd
一起学习
上传时间： 2013-11-10
上传用户：rologne
STM8的工程模板教程
上传时间： 2013-11-14
上传用户：love1314
，我说说AVR 的集成开发环境。也就是常说的IDE（Integrated Development Environment）。图片比较多，虽然用软件处理过体积，网页可能还是比较慢，还请见谅。 现今世界上的AVR 开发环境可以说是百花齐放了，互相当然各有长短，我们看看都有哪些： 首当其冲的应该还是IAR，为什么呢，因为当初AVR 还在ATMEL 胎中酝酿的时候，IAR 公司 参与了AVR 的设计，因此可以认为IAR 有更为正统的血液，它最了解AVR，它的编译器编出来的 代码应该最优秀。好比你生的孩子还是你最了解——至少相当长一段时间是这样的。事实上，IAR for AVR 确实展现了这个实力，它的功能确实最为强大，无论是源代码编写还是软件乃至硬件仿 真，编译出来的代码也十分优秀。但是事物总是相对存在的，优点有时就意味着缺点。IAR 功能 全面而强悍，代价就是它的软件界面比较复杂，设置选项多，网上的资料也比较少，最要命的是 这个软件非常的贵，好吧你说你有破解版，但是破解文件一般并不通用，而且破解方法一般都稍 显繁琐。以上几条，对于新接触AVR 的人来说，几乎是迈不过的坎。
标签： AVR
上传时间： 2013-10-15
上传用户：weiwolkt
以太网和CAN总线应用广泛，但由于其通信协议不同，两种总线器件间无法进行数据通信，因此，设计了基于CP2200与C8051F040的以太网总线与CAN总线接口转换电路，并给出部分相关硬件电路与软件设计分析。在保证数据完整和协议可靠的前提下，通过握手协议和简化的以太网协议，不仅实现了以太网数据与CAN数据的转发，同时还顺利的解决了以太网的高速性与CAN的低速率冲突，以及两者数据包之间的大小不同的矛盾。 Abstract: In the development of actual application， Ethernet and CAN bus are used very extensively. Owing to its various communication protocols， the communicating between two kinds of bus device can’t be carried out. Therefore， in order to solve this problem， the Ethernet-CAN bus interface circuit based on CP2200 and C8051F040 was designed in this paper， and part of the related hardware circuit and software design analysis were given. On the condition of data’s integrity and protocols’reliability， through the handshaking protocols and the simplified the Ethernet protocol， not only the data switching between CAN and Ethernet was realized， but also the differ in velocity and packet size was solved.
上传时间： 2013-10-15
上传用户：Ants
应用德国Micronas公司的CDC3207G微控制器开发了一款汽车仪表板系统。详细地介绍了该系统的硬件原理，以及步进电机，音频控制，LCD显示，LED指示灯和报警灯等几个模块的实现方法。应用μC/OS-II实时操作系统开发软件。着重介绍了启动代码的设计和任务的规划。 Abstract: A dashboard system is developed by using CDC3207G microcontroller made by Micronas.The hardware of the sys-tem and the realization of the step motor module,audio module,LCD display and LED indicator and alarm module are ex-plained in detail.The μC/OS-II real-time operating system is used for the software development and the starting code design and the task planning is explained specifically.
上传时间： 2013-10-26
上传用户：x4587
