UG341 - LogiCORE™ Endpoint Block Plus v1.6 for PCI Express® 用户指南
标签： LogiCORE Endpoint Block 341
上传时间： 2013-10-11
上传用户：woshinimiaoye
This application note describes a reference system which illustrates how to build an embeddedPowerPC® system using the Xilinx 1-Gigabit Ethernet Media Access Controller processor core.This system has the PLB_Gemac configured to use Scatter/Gather Direct Memory Access andthe Serializer/Deserializer (SerDes) interface. This application note describes how to set up thespecific clocking structure required for the SerDes interface and the constraints to be added tothe UCF file. This reference system is complete with a standalone software application to testsome of the main features of this core, including access to registers, DMA capabilities, transmitand receive in loopback mode. This reference system is targeted for the ML300 evaluationboard.
上传时间： 2013-11-01
上传用户：truth12
CC2530是TI第二代ZigBee® / IEEE 802.15.4 RF片上系统，用于2.4 GHz免执照ISM频带。该芯片为工业级应用提供了最先进的选择性/兼容性、优秀的链路预算，并且支持低电压操作。
上传时间： 2013-10-27
上传用户：zhqzal1014
ADXL346是一款小而薄的超低功耗3轴加速度计，分辨率高(13位)，测量范围达±16 g。数字输出数据为16位二进制补码格式，可通过SPI(3线或4线)或I2C®数字接口访问。
上传时间： 2013-11-15
上传用户：二十八号
User ManualRev. 1.2SmartRF® CC2420DK: Packet Sniffer for IEEE 802.15.4 and ZigBee Table of contents1 INTRODUCTION...............................................................................................31.1 HARDWARE PLATFORM.......................................................................................31.2 SOFTWARE.........................................................................................................32 USER INTERFACE..........................................................................................42.1 MENUS AND TOOLBARS.......................................................................................62.2 SETUP................................................................................................................62.3 SELECT FIELDS...................................................................................................72.3.1 Tips............................................................................................................72.4 PACKET DETAILS.................................................................................................72.5 ADDRESS BOOK..................................................................................................92.5.1 Tips............................................................................................................92.6 DISPLAY FILTER................................................................................................102.7 TIME LINE.........................................................................................................103 HELP....................................................................................................................114 TROUBLESHOOTING..................................................................................125 GENERAL INFORMATION........................................................................135.1 DOCUMENT HISTORY........................................................................................135.2 DISCLAIMER......................................................................................................135.3 TRADEMARKS...................................................................................................136 ADDRESS INFORMATION........................................................................14
上传时间： 2014-01-14
上传用户：zhangyi99104144
A Computer-On-Module, or COM, is a Module with all components necessary for a bootable host computer, packaged as a super component. A COM requires a Carrier Board to bring out I/O and to power up. COMs are used to build single board computer solutions and offer OEMs fast time-to-market with reduced development cost. Like integrated circuits, they provide OEMs with significant freedom in meeting form-fit-function requirements. For all these reasons the COM methodology has gained much popularity with OEMs in the embedded industry. COM Express® is an open industry standard for Computer-On-Modules. It is designed to be future proof and to provide a smooth transition path from legacy parallel interfaces to LVDS (Low Voltage Differential Signaling) interfaces. These include the PCI bus and parallel ATA on the one hand and PCI Express and Serial ATA on the other hand.
上传时间： 2013-11-05
上传用户：Wwill
CodeWarrior Development Studio for ColdFire Architectures, Linux Application Edition (Classic, Linux and Windows®)
标签： CodeWarrior 开发套件
上传时间： 2013-10-14
上传用户：hz07104032
基于 ARM® Cortex™-M4内核的Kinetis 系列产品在K10到K50 MCU系列的基础上又添加了功耗更低、成本更优的新成员。这些MCU不仅提供32 KB到1 MB闪存、精准的模拟信号及出色的连接和HMI特性，还提供了一系列的小封装。本会议将简要介绍这些MCU的特性、产品计划及配套支持。
上传时间： 2013-10-17
上传用户：ccclll
本会议将简要介绍现在和未来QorIQ硬件平台的功率管理技术。会议将介绍现在和未来Linux® SDK中软件基础设施的实施与使用情况。并且通过真实世界用例演示这些技术与基础设施在不同应用，如打印、成像、路由和数据中心等中如何有效降低功耗.
上传时间： 2013-10-29
上传用户：guanliya
这堂课将使用OpenGL® ES、OpenCL™及OpenVG™来讨论i.MX 6系列的基本GPU编程知识，还将探索与i.MX 6系列一起使用的GPU PC开发工具。
上传时间： 2014-12-30
上传用户：wmwai1314
