When I started writing the first edition of RF Power Amplifiers for Wireless Communications,some time back in 1997, it seemed that I was roaming a largely uninhabitedlandscape. For reasons still not clear to me there were few, if any, otherbooks dedicated to the subject of RF power amplifiers. Right at the same time, however,hundreds of engineers were being assigned projects to design PAs for wirelesscommunications products. It was not, therefore, especially difficult to be successfulwith a book that was fortuitously at the right place and the right time.
标签： Communications Amplifiers Wireless Edition
上传时间： 2013-11-12
上传用户：YYRR
Abstract: The process of designing a radio system can be complex and often involves many project tradeoffs. Witha little insight, balancing these various characteristics can make the job of designing a radio system easier. Thistutorial explores these tradeoffs and provides details to consider for various radio applications. With a focus on theindustrial, scientific, medical (ISM) bands, the subjects of frequency selection, one-way versus two-way systems,modulation techniques, cost, antenna options, power-supply influences, effects on range, and protocol selectionare explored.
标签： 无线
上传时间： 2013-12-13
上传用户：eastgan
在研究传统家用燃气报警器的基础上，以ZigBee协议为平台，构建mesh网状网络实现网络化的智能语音报警系统。由于传感器本身的温度和实际环境温度的影响，传感器标定后采用软件补偿方法。为了减少系统费用，前端节点采用半功能节点设备，路由器和协调器采用全功能节点设备，构建mesh网络所形成的家庭内部报警系统，通过通用的电话接口连接到外部的公用电话网络，启动语音模块进行报警。实验结果表明，在2.4 GHz频率下传输，有墙等障碍物的情况下，节点的传输距离大约为35 m，能够满足家庭需要，且系统工作稳定，但在功耗方面仍需进一步改善。 Abstract: On the basis of studying traditional household gas alarm system, this paper proposed the platform for the ZigBee protocol，and constructed mesh network to achieve network-based intelligent voice alarm system. Because of the sensor temperature and the actual environment temperature, this system design used software compensation after calibrating sensor. In order to reduce system cost, semi-functional node devices were used as front-end node, however, full-function devices were used as routers and coordinator，constructed alarm system within the family by building mesh network，connected to the external public telephone network through the common telephone interface, started the voice alarm module. The results indicate that nodes transmit about 35m in the distance in case of walls and other obstacles by 2.4GHz frequency transmission, this is able to meet family needs and work steadily, but still needs further improvement in power consumption.
上传时间： 2013-10-30
上传用户：swaylong
通过比较各种隔离数字通信的特点和应用范围，指出塑料光纤在隔离数字通信中的优势。使用已经标准化的TOSLINK接口，有利于节省硬件开发成本和简化设计难度。给出了塑料光纤的硬件驱动电路，说明设计过程中的注意事项，对光收发模块的电压特性和频率特性进行全面试验，并给出SPI口使用塑料光纤隔离通信的典型应用电路图。试验结果表明，该设计可为电力现场、电力电子及仪器仪表的设计提供参考。 Abstract: y comparing characteristics and applications area of various isolated digital communications， this article indicates advantages of plastic optical fiber in isolated digital communications. Using the standardized TOSLINK interface， it helps to control costs and difficulty in hardware development and design. Then it gives the hardware driver circuit of plastic optical fiber module， explains the noticed details in design process， gives results on the basis of the optical transceiver module voltage characteristics and frequency characteristics tests. Finally，it gives typical application circuit of the SPI communication port by using plastic optical fiber isolation .The results show that this design can be referenced for the power field， power electronics and instrumentation design.
上传时间： 2014-01-10
上传用户：gundan
The LPC1850/30/20/10 are ARM Cortex-M3 based microcontrollers for embeddedapplications. The ARM Cortex-M3 is a next generation core that offers systemenhancements such as low power consumption, enhanced debug features, and a highlevel of support block integration.The LPC1850/30/20/10 operate at CPU frequencies of up to 150 MHz. The ARMCortex-M3 CPU incorporates a 3-stage pipeline and uses a Harvard architecture withseparate local instruction and data buses as well as a third bus for peripherals. The ARMCortex-M3 CPU also includes an internal prefetch unit that supports speculativebranching.The LPC1850/30/20/10 include up to 200 kB of on-chip SRAM data memory, a quad SPIFlash Interface (SPIFI), a State Configuration Timer (SCT) subsystem, two High-speedUSB controllers, Ethernet, LCD, an external memory controller, and multiple digital andanalog peripherals.
上传时间： 2014-12-31
上传用户：zhuoying119
资料介绍说明 orcad到power格式Dxdesigner转换器下载，为绿色免安装版，下载后双击schcvt.exe，即可使用了，界面如下图所示
标签： Dxdesigner orcad power 转换器
上传时间： 2013-11-01
上传用户：xinyuzhiqiwuwu
中文版详情浏览：http://www.elecfans.com/emb/fpga/20130715324029.html Xilinx UltraScale:The Next-Generation Architecture for Your Next-Generation Architecture The Xilinx® UltraScale™ architecture delivers unprecedented levels of integration and capability with ASIC-class system- level performance for the most demanding applications. The UltraScale architecture is the industr y's f irst application of leading-edge ASIC architectural enhancements in an All Programmable architecture that scales from 20 nm planar through 16 nm FinFET technologies and beyond, in addition to scaling from monolithic through 3D ICs. Through analytical co-optimization with the X ilinx V ivado® Design Suite, the UltraScale architecture provides massive routing capacity while intelligently resolving typical bottlenecks in ways never before possible. This design synergy achieves greater than 90% utilization with no performance degradation. Some of the UltraScale architecture breakthroughs include: • Strategic placement (virtually anywhere on the die) of ASIC-like system clocks, reducing clock skew by up to 50% • Latency-producing pipelining is virtually unnecessary in systems with massively parallel bus architecture, increasing system speed and capability • Potential timing-closure problems and interconnect bottlenecks are eliminated, even in systems requiring 90% or more resource utilization • 3D IC integration makes it possible to build larger devices one process generation ahead of the current industr y standard • Greatly increased system performance, including multi-gigabit serial transceivers, I/O, and memor y bandwidth is available within even smaller system power budgets • Greatly enhanced DSP and packet handling The Xilinx UltraScale architecture opens up whole new dimensions for designers of ultra-high-capacity solutions.
标签： UltraScale Xilinx 架构
上传时间： 2013-11-21
上传用户：wxqman
This white paper discusses how market trends, the need for increased productivity, and new legislation have accelerated the use of safety systems in industrial machinery. This TÜV-qualified FPGA design methodology is changing the paradigms of safety designs and will greatly reduce development effort, system complexity, and time to market. This allows FPGA users to design their own customized safety controllers and provides a significant competitive advantage over traditional microcontroller or ASIC-based designs. Introduction The basic motivation of deploying functional safety systems is to ensure safe operation as well as safe behavior in cases of failure. Examples of functional safety systems include train brakes, proximity sensors for hazardous areas around machines such as fast-moving robots, and distributed control systems in process automation equipment such as those used in petrochemical plants. The International Electrotechnical Commission’s standard, IEC 61508: “Functional safety of electrical/electronic/programmable electronic safety-related systems,” is understood as the standard for designing safety systems for electrical, electronic, and programmable electronic (E/E/PE) equipment. This standard was developed in the mid-1980s and has been revised several times to cover the technical advances in various industries. In addition, derivative standards have been developed for specific markets and applications that prescribe the particular requirements on functional safety systems in these industry applications. Example applications include process automation (IEC 61511), machine automation (IEC 62061), transportation (railway EN 50128), medical (IEC 62304), automotive (ISO 26262), power generation, distribution, and transportation. 图Figure 1. Local Safety System
上传时间： 2013-11-14
上传用户：zoudejile
WP369可扩展式处理平台-各种嵌入式系统的理想解决方案 ：Delivering unrivaled levels of system performance,flexibility, scalability, and integration to developers,Xilinx's architecture for a new Extensible Processing Platform is optimized for system power, cost, and size. Based on ARM's dual-core Cortex™-A9 MPCore processors and Xilinx’s 28 nm programmable logic,the Extensible Processing Platform takes a processor-centric approach by defining a comprehensive processor system implemented with standard design methods. This approach provides Software Developers a familiar programming environment within an optimized, full featured,powerful, yet low-cost, low-power processing platform.
上传时间： 2013-10-18
上传用户：cursor
Integrated EMI/Thermal Design forSwitching Power SuppliesWei ZhangThesis submitted to the Faculty of theVirginia Polytechnic Institute and State Universityin partial fulfillment of the requirements for the degree of Integrated EMI/Thermal Design forSwitching Power SuppliesWei Zhang(ABSTRACT)This work presents the modeling and analysis of EMI and thermal performancefor switch power supply by using the CAD tools. The methodology and design guidelinesare developed.By using a boost PFC circuit as an example, an equivalent circuit model is builtfor EMI noise prediction and analysis. The parasitic elements of circuit layout andcomponents are extracted analytically or by using CAD tools. Based on the model, circuitlayout and magnetic component design are modified to minimize circuit EMI. EMI filtercan be designed at an early stage without prototype implementation.In the second part, thermal analyses are conducted for the circuit by using thesoftware Flotherm, which includes the mechanism of conduction, convection andradiation. Thermal models are built for the components. Thermal performance of thecircuit and the temperature profile of components are predicted. Improved thermalmanagement and winding arrangement are investigated to reduce temperature.In the third part, several circuit layouts and inductor design examples are checkedfrom both the EMI and thermal point of view. Insightful information is obtained.
上传时间： 2013-11-16
上传用户：萍水相逢
