The planarization technology of Chemical-Mechanical-Polishing (CMP), used for the manufacturing of multi- level metal interconnects for high-density Integrated Circuits (IC), is also readily adaptable as an enabling technology in MicroElectroMechanical Systems (MEMS) fabrication, particularly polysilicon surface micromachining. CMP not only eases the design and manufacturability of MEMS devices by eliminating several photolithographic and film issues generated by severe topography, but also enables far greater flexibility with process complexity and associated designs. T
标签： mechanical polishing Chemical
上传时间： 2020-06-06
上传用户：shancjb
stract With global drivers such as better energy consumption, energy efficiency and reduction of greenhouse gases, CO 2 emission reduction has become key in every layer of the value chain. Power Electronics has definitely a role to play in these thrilling challenges. From converters down to compound semiconductors, innovation is leading to breakthrough technologies. Wide BandGap, Power Module Packaging, growth of Electric Vehicle market will game change the overall power electronic industry and supply chain. In this presentation we will review power electronics trends, from technologies to markets.
标签： Electronics Materials Power WBG for
上传时间： 2020-06-07
上传用户：shancjb
adio Frequency Identification (RFID) is a rapidly developing automatic wireless data-collection technology with a long history.The first multi-bit functional passive RFID systems,with a range of several meters, appeared in the early 1970s, and continued to evolve through the 1980s. Recently, RFID has experienced a tremendous growth,due to developments in integrated circuits and radios, and due to increased interest from the retail industrial and government.
标签： RFID-Enabled Sensors RFID and
上传时间： 2020-06-08
上传用户：shancjb
Radio frequency identification (RFID) and Wireless sensor networks (WSN) are the two key wireless technologies that have diversified applications in the present and the upcoming systems in this area. RFID is a wireless automated recognition technology which is primarily used to recognize objects or to follow their posi- tion without providing any sign about the physical form of the substance. On the other hand, WSN not only offers information about the state of the substance and environment but also enables multi-hop wireless communications.
标签： Architecture Integrated RFID-WSN
上传时间： 2020-06-08
上传用户：shancjb
Recent work has shown that convolutional networks can be substantially deeper, more accurate, and efficient to train if they contain shorter connections between layers close to the input and those close to the output. In this paper, we embrace this observation and introduce the Dense Convo- lutional Network (DenseNet), which connects each layer to every other layer in a feed-forward fashion.
标签： Convolutional Connected Networks Densely
上传时间： 2020-06-10
上传用户：shancjb
如果 PCB 用排线连接，控制排线对应的插头插座必须成直线，不交叉、不扭曲。 连续的 40PIN 排针、排插必须隔开 2mm 以上。 考虑信号流向，合理安排布局，使信号流向尽可能保持一致。 输入、输出元件尽量远离。 电压的元器件应尽量放在调试时手不易触及的地方。 驱动芯片应靠近连接器。 有高频连线的元件尽可能靠近，以减少高频信号的分布参数和电磁干扰。 对于同一功能或模组电路，分立元件靠近芯片放置。 连接器根据实际情况必须尽量靠边放置。 开关电源尽量靠近输入电源座。 BGA 等封装的元器件不应放于 PCB 板正中间等易变形区 BGA 等阵列器件不能放在底面， PLCC 、 QFP 等器件不宜放在底层。 多个电感近距离放置时应相互垂直以消除互感。 元件的放置尽量做到模块化并连线最短。 在保证电气性能的前提下，尽量按照均匀分布、重心平衡、版面美观的标准优化布局。 按电路模块进行布局，实现同一功能的相关电路称为一个模块，电路模块中的元件应采用就近集 中原则，同时数字电路和模拟电路分开； 定位孔、标准孔等非安装孔周围 1.27mm 内不得贴装元、器件，螺钉等安装孔周围 紧固件安装孔、椭圆孔及板中其它方孔外侧距板边的尺寸大于 3mm ； 发热元件不能紧邻导线和热敏元件；高热器件要均衡分布；
上传时间： 2021-06-25
上传用户：xiangshuai
核心板说明（1）DDR模板：RK3288-LPDDR3P232SD6-V12-20140623HXS（2）适用的平台：RK3288；（3）支持的DDR类型：LPDDR3_2PCS*32BIT（4）最大支持容量：4G（2PCS*32BIT）；（5）板层：6 Layer；（6）贴片方式：DDR器件单面贴,其它器件双面贴；（7）面积：35mm*35mm；
上传时间： 2022-02-02
上传用户：
PW4203 is a 4.5-22V input, 2A multi-cell synchronous Buck Li-Ion battery charger, suitable forportable application. Select pin is convenient for multi-cell charging. 800 kHz synchronous buckregulator integrates of 22V rating FETs with ultra low on- resistance to achieve high efficiency andsimple circuit design.The PW4203 is available in an 8-pin SOP package, provides a very compact system solution andgood thermal conductance
标签： pw4203
上传时间： 2022-02-11
上传用户：
ST提供适用于SLC的NFTL（NAND Flash Translation Layer）和FAT类文件系统来解决NAND Flash存储的问题。
标签： flash
上传时间： 2022-02-21
上传用户：trh505
如果了解FAT的系统结构，并理解了FatSL的软件结构，那么文件系统移植并不困难（其实文件系统移植都是大同小异的）。本文给出的例子是基于STEVAL-CCM007V1硬件平台，通过NFTL层（NAND Flash Translation Layer）在NAND Flash上建立该文件系统的情况。
标签： fatsl
上传时间： 2022-02-21
上传用户：得之我幸78
