在综合分析谐波励磁无刷同步发电机励磁控制系统的基础上,对其励磁控制策略进行了研究,开发了一套基于DSP( TMS320F2812) 控制的新型柴油发电机励磁控制系统,该系统采用参数自适应模糊PID 控制励磁,选用交流采样方式实时检测各信号的瞬时特性,系统仿真结果以及在1 台25 kW 工频柴油发电机上的试验结果证明了该控制器具有较好的电压调节特性,系统稳态和暂态性能完全满足发电机对励磁系统的要求。关键词:励磁调节;模糊PID 控制;数字信号处理器;交流采样 Abstract :According to the general analysis of the excitation cont rol system of the harmonious wave excitation brushless synchronous generator and it s characteristics ,a new type of diesel generator excitation cont rol system based on DSP( TMS320F2812) was designed. An adaptive fuzzy PID cont rol of excitation is used in this system. To detect the t ransient characteristics of the signals in a timely manner ,AC sampling was applied.The system simulation result s and the testing result s f rom a 25 kW diesel generator (50 Hz) can prove that the voltage regulation characteristics of the excitation cont rol system are very well ,and both the steadyOstate performance and the t ransient performance of the generator are also good.Key words :excitation cont rol ;fuzzy PID cont rol ;digital signal processor (DSP) ;AC sampling
上传时间： 2013-10-29
上传用户：fxf126@126.com
设计一种应用于某全地形ATV车载武器装置中的中控系统，该系统设计是以TMS320F2812型DSP为核心，采用模块化设计思想，对其硬件部分进行系统设计，能够完成对武器装置高低、回转方向的运动控制，实现静止或行进状态中对目标物的测距，自动瞄准以及按既定发射模式发射弹丸和各项安全性能检测等功能。通过编制相应的软件，对其进行系统调试，验证了该设计运行稳定。 Abstract: A central control system applied to an ATV vehicle weapons is designed. The system design is based on TMS320F2812 DSP as the core， uses modular design for its hardware parts. The central control system can complete the motion control of the level of weapons and equipment， rotation direction， to achieve a state of static or moving objects on the target ranging， auto-targeting and according to the established target and the projectile and the launch of the security performance testing and other functions. Through the development of appropriate software and to carry out system testing to verify the stability of this design and operation.
上传时间： 2013-11-02
上传用户：jshailingzzh
中文版详情浏览：http://www.elecfans.com/emb/fpga/20130715324029.html Xilinx UltraScale:The Next-Generation Architecture for Your Next-Generation Architecture The Xilinx® UltraScale™ architecture delivers unprecedented levels of integration and capability with ASIC-class system- level performance for the most demanding applications. The UltraScale architecture is the industr y's f irst application of leading-edge ASIC architectural enhancements in an All Programmable architecture that scales from 20 nm planar through 16 nm FinFET technologies and beyond, in addition to scaling from monolithic through 3D ICs. Through analytical co-optimization with the X ilinx V ivado® Design Suite, the UltraScale architecture provides massive routing capacity while intelligently resolving typical bottlenecks in ways never before possible. This design synergy achieves greater than 90% utilization with no performance degradation. Some of the UltraScale architecture breakthroughs include: • Strategic placement (virtually anywhere on the die) of ASIC-like system clocks, reducing clock skew by up to 50% • Latency-producing pipelining is virtually unnecessary in systems with massively parallel bus architecture, increasing system speed and capability • Potential timing-closure problems and interconnect bottlenecks are eliminated, even in systems requiring 90% or more resource utilization • 3D IC integration makes it possible to build larger devices one process generation ahead of the current industr y standard • Greatly increased system performance, including multi-gigabit serial transceivers, I/O, and memor y bandwidth is available within even smaller system power budgets • Greatly enhanced DSP and packet handling The Xilinx UltraScale architecture opens up whole new dimensions for designers of ultra-high-capacity solutions.
标签： UltraScale Xilinx 架构
上传时间： 2013-11-13
上传用户：瓦力瓦力hong
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
上传时间： 2013-10-22
上传用户：ztj182002
This application note describes how to implement the Bus LVDS (BLVDS) interface in the supported Altera ® device families for high-performance multipoint applications. This application note also shows the performance analysis of a multipoint application with the Cyclone III BLVDS example.
标签： Implementing LVDS 522 Bus
上传时间： 2013-11-10
上传用户：frank1234
Design techniques for electronic systems areconstantly changing. In industries at the heart of thedigital revolution, this change is especially acute.Functional integration, dramatic increases incomplexity, new standards and protocols, costconstraints, and increased time-to-market pressureshave bolstered both the design challenges and theopportunities to develop modern electronic systems.One trend driving these changes is the increasedintegration of core logic with previously discretefunctions to achieve higher performance and morecompact board designs.
上传时间： 2014-12-28
上传用户：康郎
Xilinx Next Generation 28 nm FPGA Technology Overview Xilinx has chosen 28 nm high-κ metal gate (HKMG) highperformance,low-power process technology and combined it with a new unified ASMBL™ architecture to create a new generation of FPGAs that offer lower power and higher performance. These devices enable unprecedented levels of integration and bandwidth and provide system architects and designers a fully programmable alternative to ASSPs and ASICs.
上传时间： 2014-12-28
上传用户：zhang97080564
WP369可扩展式处理平台-各种嵌入式系统的理想解决方案 ：Delivering unrivaled levels of system performance,flexibility, scalability, and integration to developers,Xilinx's architecture for a new Extensible Processing Platform is optimized for system power, cost, and size. Based on ARM's dual-core Cortex™-A9 MPCore processors and Xilinx’s 28 nm programmable logic,the Extensible Processing Platform takes a processor-centric approach by defining a comprehensive processor system implemented with standard design methods. This approach provides Software Developers a familiar programming environment within an optimized, full featured,powerful, yet low-cost, low-power processing platform.
上传时间： 2013-10-22
上传用户：685
This application note covers the design considerations of a system using the performance features of the LogiCORE™ IP Advanced eXtensible Interface (AXI) Interconnect core. The design focuses on high system throughput through the AXI Interconnect core with F MAX and area optimizations in certain portions of the design. The design uses five AXI video direct memory access (VDMA) engines to simultaneously move 10 streams (five transmit video streams and five receive video streams), each in 1920 x 1080p format, 60 Hz refresh rate, and up to 32 data bits per pixel. Each VDMA is driven from a video test pattern generator (TPG) with a video timing controller (VTC) block to set up the necessary video timing signals. Data read by each AXI VDMA is sent to a common on-screen display (OSD) core capable of multiplexing or overlaying multiple video streams to a single output video stream. The output of the OSD core drives the DVI video display interface on the board. Performance monitor blocks are added to capture performance data. All 10 video streams moved by the AXI VDMA blocks are buffered through a shared DDR3 SDRAM memory and are controlled by a MicroBlaze™ processor. The reference system is targeted for the Virtex-6 XC6VLX240TFF1156-1 FPGA on the Xilinx® ML605 Rev D evaluation board
上传时间： 2013-11-14
上传用户：fdmpy
XAPP520将符合2.5V和3.3V I/O标准的7系列FPGA高性能I/O Bank进行连接 The I/Os in Xilinx® 7 series FPGAs are classified as either high range (HR) or high performance (HP) banks. HR I/O banks can be operated from 1.2V to 3.3V, whereas HP I/O banks are optimized for operation between 1.2V and 1.8V. In circumstances that require an HP 1.8V I/O bank to interface with 2.5V or 3.3V logic, a range of options can be deployed. This application note describes methodologies for interfacing 7 series HP I/O banks with 2.5V and 3.3V systems
上传时间： 2013-11-19
上传用户：yyyyyyyyyy
