The #1 Step-by-Step Guide to labviewNow Completely Updated for labview 8! Master labview 8 with the industry's friendliest, most intuitive tutorial: labview for Everyone, Third Edition. Top labview experts Jeffrey Travis and Jim Kring teach labview the easy way: through carefully explained, step-by-step examples that give you reusable code for your own projects! This brand-new Third Edition has been fully revamped and expanded to reflect new features and techniques introduced in labview 8. You'll find two new chapters, plus dozens of new topics, including Project Explorer, AutoTool, XML, event-driven programming, error handling, regular expressions, polymorphic VIs, timed structures, advanced reporting, and much more. Certified labview Developer (CLD) candidates will find callouts linking to key objectives on NI's newest exam, making this book a more valuable study tool than ever. Not just what to d why to do it! Use labview to build your own virtual workbench Master labview's foundations: wiring, creating, editing, and debugging VIs; using controls and indicators; working with data structures; and much more Learn the "art" and best practices of effective labview development NEW: Streamline development with labview Express VIs NEW: Acquire data with NI-DAQmx and the labview DAQmx VIs NEW: Discover design patterns for error handling, control structures, state machines, queued messaging, and more NEW: Create sophisticated user interfaces with tree and tab controls, drag and drop, subpanels, and more Whatever your application, whatever your role, whether you've used labview or not, labview for Everyone, Third Edition is the fastest, easiest way to get the results you're after!
上传时间： 2013-10-14
上传用户：shawvi
一篇长90页的PPT和10个左右的示例源程序，对于自学能力强且有一定计算机编程基础的人来说上手还是很快的。 •Understand the components of a Virtual Instrument •Introduce labview and common labview functions •build a simple data acquisition application •Create a subroutine in labview
上传时间： 2013-11-21
上传用户：yeling1919
用MDK 生成bin 文件1用MDK 生成bin 文件Embest 徐良平在RV MDK 中，默认情况下生成*.hex 的可执行文件，但是当我们要生成*.bin 的可执行文件时怎么办呢？答案是可以使用RVCT 的fromelf.exe 工具进行转换。也就是说首先将源文件编译链接成*.axf 的文件，然后使用fromelf.exe 工具将*.axf 格式的文件转换成*.bin格式的文件。下面将具体说明这个操作步骤：1. 打开Axf_To_Bin 文件中的Axf_To_Bin.uv2 工程文件；2. 打开Options for Target ‘Axf_To_Bin’对话框，选择User 标签页；3. 构选Run User Programs After build/Rebuild 框中的Run #1 多选框，在后边的文本框中输入C:\Keil\ARM\BIN31\fromelf.exe --bin -o ./output/Axf_To_Bin.bin ./output/Axf_To_Bin.axf 命令行；4. 重新编译文件，在./output/文件夹下生成了Axf_To_Bin.bin 文件。在上面的步骤中，有几点值得注意的是：1. C:\Keil\ARM\BIN31\表示RV MDK 的安装目录；2. fromelf.exe 命令的具体语法格式如下：命令的格式为：fromelf [options] input_file命令选项如下：--help 显示帮助信息--vsn 显示版本信息--output file 输出文件(默认的输出为文本格式)--nodebug 在生成的映象中不包含调试信息--nolinkview 在生成的映象中不包含段的信息二进制输出格式：--bin 生成Plain Binary 格式的文件--m32 生成Motorola 32 位十六进制格式的文件--i32 生成Intel 32 位十六进制格式的文件--vhx 面向字节的位十六进制格式的文件t--base addr 设置m32，i32 格式文件的基地址--text 显示文本信息文本信息的标志-v 打印详细信息-a 打印数据地址(针对带调试信息的映象)-d 打印数据段的内容-e 打印表达式表print exception tables-f 打印消除虚函数的信息-g 打印调试表print debug tables-r 打印重定位信息-s 打印字符表-t 打印字符串表-y 打印动态段的内容-z 打印代码和数据大小的信息
上传时间： 2013-12-17
上传用户：AbuGe
Abstract: When people want portable music, they usually rely on battery-powered audio devices. With a bit of engineeringblood (or curiosity) running in your veins, it is not difficult to build a wireless Bluetooth® stereo audio system that can becontrolled with any device that has a Bluetooth connection and a music player
上传时间： 2013-10-09
上传用户：天空说我在
中文版详情浏览：http://www.elecfans.com/emb/fpga/20130715324029.html Xilinx UltraScale:The Next-Generation Architecture for Your Next-Generation Architecture The Xilinx® UltraScale™ architecture delivers unprecedented levels of integration and capability with ASIC-class system- level performance for the most demanding applications. The UltraScale architecture is the industr y's f irst application of leading-edge ASIC architectural enhancements in an All Programmable architecture that scales from 20 nm planar through 16 nm FinFET technologies and beyond, in addition to scaling from monolithic through 3D ICs. Through analytical co-optimization with the X ilinx V ivado® Design Suite, the UltraScale architecture provides massive routing capacity while intelligently resolving typical bottlenecks in ways never before possible. This design synergy achieves greater than 90% utilization with no performance degradation. Some of the UltraScale architecture breakthroughs include: • Strategic placement (virtually anywhere on the die) of ASIC-like system clocks, reducing clock skew by up to 50% • Latency-producing pipelining is virtually unnecessary in systems with massively parallel bus architecture, increasing system speed and capability • Potential timing-closure problems and interconnect bottlenecks are eliminated, even in systems requiring 90% or more resource utilization • 3D IC integration makes it possible to build larger devices one process generation ahead of the current industr y standard • Greatly increased system performance, including multi-gigabit serial transceivers, I/O, and memor y bandwidth is available within even smaller system power budgets • Greatly enhanced DSP and packet handling The Xilinx UltraScale architecture opens up whole new dimensions for designers of ultra-high-capacity solutions.
标签： UltraScale Xilinx 架构
上传时间： 2013-11-21
上传用户：wxqman
Nios II软件构建工具入门 The Nios® II Software build Tools (SBT) allows you to construct a wide variety of complex embedded software systems using a command-line interface. From this interface, you can execute Software Built Tools command utilities, and use scripts other tools) to combine the command utilities in many useful ways. This chapter introduces you to project creation with the SBT at the command line This chapter includes the following sections: ■ “Advantages of Command-Line Software Development” ■ “Outline of the Nios II SBT Command-Line Interface” ■ “Getting Started in the SBT Command Line” ■ “Software build Tools Scripting Basics” on page 3–8
上传时间： 2013-11-15
上传用户：nanxia
使用Nios II软件构建工具 This chapter describes the Nios® II Software build Tools (SBT), a set of utilities and scripts that creates and builds embedded C/C++ application projects, user library projects, and board support packages (BSPs). The Nios II SBT supports a repeatable, scriptable, and archivable process for creating your software product. You can invoke the Nios II SBT through either of the following user interfaces: ■ The Eclipse™ GUI ■ The Nios II Command Shell The purpose of this chapter is to make you familiar with the internal functionality of the Nios II SBT, independent of the user interface employed.
上传时间： 2013-10-12
上传用户：china97wan
面向Eclips的Nios II软件构建工具手册 The Nios® II Software build Tools (SBT) for Eclipse™ is a set of plugins based on the Eclipse™ framework and the Eclipse C/C++ development toolkit (CDT) plugins. The Nios II SBT for Eclipse provides a consistent development platform that works for all Nios II embedded processor systems. You can accomplish all Nios II software development tasks within Eclipse, including creating, editing, building, running, debugging, and profiling programs.
上传时间： 2013-11-02
上传用户：瓦力瓦力hong
This application note describes how to build a system that can be used for determining theoptimal phase shift for a Double Data Rate (DDR) memory feedback clock. In this system, theDDR memory is controlled by a controller that attaches to either the OPB or PLB and is used inan embedded microprocessor application. This reference system also uses a DCM that isconfigured so that the phase of its output clock can be changed while the system is running anda GPIO core that controls that phase shift. The GPIO output is controlled by a softwareapplication that can be run on a PowerPC® 405 or Microblaze™ microprocessor.
上传时间： 2014-11-26
上传用户：erkuizhang
讨论、研究高性能覆铜板对它所用的环氧树脂的性能要求，应是立足整个产业链的角度去观察、分析。特别应从HDI多层板发展对高性能CCL有哪些主要性能需求上着手研究。HDI多层板有哪些发展特点，它的发展趋势如何——这都是我们所要研究的高性能CCL发展趋势和重点的基本依据。而HDI多层板的技术发展，又是由它的应用市场——终端电子产品的发展所驱动（见图1）。 图1 在HDI多层板产业链中各类产品对下游产品的性能需求关系图 1．HDI多层板发展特点对高性能覆铜板技术进步的影响1.1 HDI多层板的问世，对传统PCB技术及其基板材料技术是一个严峻挑战20世纪90年代初，出现新一代高密度互连（High Density Interconnection，简称为 HDI）印制电路板——积层法多层板（build—Up Multiplayer printed board，简称为 BUM）的最早开发成果。它的问世是全世界几十年的印制电路板技术发展历程中的重大事件。积层法多层板即HDI多层板，至今仍是发展HDI的PCB的最好、最普遍的产品形式。在HDI多层板之上，将最新PCB尖端技术体现得淋漓尽致。HDI多层板产品结构具有三大突出的特征：“微孔、细线、薄层化”。其中“微孔”是它的结构特点中核心与灵魂。因此，现又将这类HDI多层板称作为“微孔板”。HDI多层板已经历了十几年的发展历程，但它在技术上仍充满着朝气蓬勃的活力，在市场上仍有着前程广阔的空间。
上传时间： 2013-11-19
上传用户：zczc
