资料说明介绍 PCB Translator_CAMCAD转换器3.95版本，里面含CAMCAD_3.9.5a_crack文件，可以对软件进行破解 （需要安装PCB Translator后才能进行破解） 针对PCB设计文件的RSI转换器能够转换PCB设计和生产所需要的所有信息。它们包括：库，布置位置，插入属性信息，网表，走线，文字和铜箔，以及其它相关的项目。不需要执行"导入Gerber"和"交叉参考"就可以完成所有这些工作。事实上，根本不需要定义参考，因为软件可以从原始文件格式中提取出CAD数据，并把它直接输出到新的文件格式中。只需要注意CAD系统本身的限制就可以了。 CAMCAD PCB 转换器 CAMCAD PCB 转换器是一个功能完善的PCB CAD 转换器，图形用户界面也很浅显易懂。CAMCAD PCB 转换器支持大多数流行的CAD格式，比如Cadence Allegro, Orcad, Mentor and Accel EDA,也支持工业标准格式，比如GenCAM, GenCAD, and IPC-D-356.CAMCAD PCB 转换器允许导入CAD文件到CAMCAD图形用户环境中，校验数据，修改数据，然后可以把数据导出为任意格式的文件。这些特性意味着用户可以完全控制所有的事情，比如层的转换，也能解决CAD格式之间不兼容的问题。 一个案例,如果要转换Cadence Allegro文件到PADS,所有必须的设计信息都会包含在新的文件中。不过，Cadence Allegro允许板子上的铜箔重叠，PADS却不允许。Allegro 文件可以正常导入到CAMCAD。如果要立即把这个文件导出到PADS，程序会有错误提示。这时，可以使用CAMCAD的数据处理特性来改变有问题的铜箔，解决问题后再导出到PADS。 下面的矩阵表格，列出了CAMCAD PCB 转换器所支持的当前PCB的转换组合。Import Modules 一列中列出了可以被导入（读取）的所有ECAD文件格式。Export Modules一行中列出了可以被导出（写）的文件格式。在这个矩阵中的任意输入和输出模块组合转换都是可行的。当然，没有任何ECAD到ECAD的转换器是绝对完美的。由于ECAD layout系统有自己独特的特性，而这些可能不能直接转换到另一个有自己独特特性的ECAD系统中。 CAMCAD PCB 转换器支持的组合 建议配置：Windows 2000 或者 XP Professional，800 MHZ 处理器，512MB RAM 17"显示器，1024×768分辨率 Copyright 2004 Router SOLUTIONs Incorporated RSI Reserves the right to make changes to its specifications and products without prior notice. CAMCAD is a registered trademark of Router SOLUTIONs Incorporated. All rights reserved. RSI recognizes other brand and product names as trademarks or registered trademarks of their respective holders.
标签： Translator_CAMCAD PCB 转换器
上传时间： 2014-12-31
上传用户：wvbxj
中文版详情浏览：http://www.elecfans.com/emb/fpga/20130715324029.html Xilinx UltraScale:The Next-Generation Architecture for Your Next-Generation Architecture The Xilinx® UltraScale™ architecture delivers unprecedented levels of integration and capability with ASIC-class system- level performance for the most demanding applications. The UltraScale architecture is the industr y's f irst application of leading-edge ASIC architectural enhancements in an All Programmable architecture that scales from 20 nm planar through 16 nm FinFET technologies and beyond, in addition to scaling from monolithic through 3D ICs. Through analytical co-optimization with the X ilinx V ivado® Design Suite, the UltraScale architecture provides massive routing capacity while intelligently resolving typical bottlenecks in ways never before possible. This design synergy achieves greater than 90% utilization with no performance degradation. Some of the UltraScale architecture breakthroughs include: • Strategic placement (virtually anywhere on the die) of ASIC-like system clocks, reducing clock skew by up to 50% • Latency-producing pipelining is virtually unnecessary in systems with massively parallel bus architecture, increasing system speed and capability • Potential timing-closure problems and interconnect bottlenecks are eliminated, even in systems requiring 90% or more resource utilization • 3D IC integration makes it possible to build larger devices one process generation ahead of the current industr y standard • Greatly increased system performance, including multi-gigabit serial transceivers, I/O, and memor y bandwidth is available within even smaller system power budgets • Greatly enhanced DSP and packet handling The Xilinx UltraScale architecture opens up whole new dimensions for designers of ultra-high-capacity SOLUTIONs.
标签： UltraScale Xilinx 架构
上传时间： 2013-11-21
上传用户：wxqman
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip SOLUTIONs. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
上传时间： 2013-11-21
上传用户：不懂夜的黑
Designing withProgrammable Logicin an Analog WorldProgrammable logic devices revolutionizeddigital design over 25 years ago,promising designers a blank chip todesign literally any function and programit in the field. PLDs can be low-logicdensity devices that use nonvolatilesea-of-gates cells called complexprogrammable logic devices (CPLDs)or they can be high-density devicesbased on SRAM look-up tables (LUTs)
标签： SOLUTIONs Analog Altera FPGAs
上传时间： 2013-10-27
上传用户：fredguo
Designing withProgrammable Logicin an Analog WorldProgrammable logic devicesrevolutionized digital design over 25years ago, promising designers a blankchip to design literally any functionand program it in the field. PLDs canbe low-logic density devices that usenonvolatile sea-of-gates cells calledcomplex programmable logic devices(CPLDs) or they can be high-densitydevices based on SRAM look-up tables
标签： SOLUTIONs Analog Xilinx FPGAs
上传时间： 2013-11-07
上传用户：suicone
This application note contains a reference design consisting of HDL IP and Xilinx AdvancedConfiguration Environment (ACE) software utilities that give designers great flexibility increating in-system programming (ISP) SOLUTIONs. In-system programming support allowsdesigners to revise existing designs, package the new bitstream programming files with theprovided software utilities, and update the remote system through the JTAG interface using theEmbedded JTAG ACE Player.
上传时间： 2013-10-22
上传用户：gai928943
The Xilinx Zynq-7000 Extensible Processing Platform (EPP) redefines the possibilities for embedded systems, giving system and software architects and developers a flexible platform to launch their new SOLUTIONs and traditional ASIC and ASSP users an alternative that aligns with today’s programmable imperative. The new class of product elegantly combines an industrystandard ARMprocessor-based system with Xilinx 28nm programmable logic—in a single device. The processor boots first, prior to configuration of the programmable logic. This, along with a streamlined workflow, saves time and effort and lets software developers and hardware designers start development simultaneously.
上传时间： 2013-10-09
上传用户：evil
解压密码：www.elecfans.com 随着微电子技术的迅速发展以及集成电路规模不断提高，对电路性能的设计 要求越来越严格，这势必对用于大规模集成电路设计的EDA 工具提出越来越高的 要求。自1972 年美国加利福尼亚大学柏克莱分校电机工程和计算机科学系开发 的用于集成电路性能分析的电路模拟程序SPICE（Simulation Program with IC Emphasis）诞生以来，为适应现代微电子工业的发展，各种用于集成电路设计的 电路模拟分析工具不断涌现。HSPICE 是Meta-Software 公司为集成电路设计中 的稳态分析，瞬态分析和频域分析等电路性能的模拟分析而开发的一个商业化通 用电路模拟程序，它在柏克莱的SPICE（1972 年推出），MicroSim公司的PSPICE （1984 年推出）以及其它电路分析软件的基础上，又加入了一些新的功能，经 过不断的改进，目前已被许多公司、大学和研究开发机构广泛应用。HSPICE 可 与许多主要的EDA 设计工具，诸如Candence,Workview 等兼容，能提供许多重要 的针对集成电路性能的电路仿真和设计结果。采用HSPICE 软件可以在直流到高 于100MHz 的微波频率范围内对电路作精确的仿真、分析和优化。在实际应用中， HSPICE能提供关键性的电路模拟和设计方案，并且应用HSPICE进行电路模拟时， 其电路规模仅取决于用户计算机的实际存储器容量。 The HSPICE Integrator Program enables qualified EDA vendors to integrate their products with the de facto standard HSPICE simulator, HSPICE RF simulator, and WaveView Analyzer™. In addition, qualified HSPICE Integrator Program members have access to HSPICE integrator application programming interfaces (APIs). Collaboration between HSPICE Integrator Program members will enable customers to achieve more thorough design verification in a shorter period of time from the improvements offered by inter-company EDA design SOLUTIONs.
上传时间： 2013-10-18
上传用户：s363994250
The revolution of automation on factory floors is a key driver for the seemingly insatiable demand for higher productivity， lower total cost of ownership，and high safety. As a result， industrial applications drive an insatiable demand of higher data bandwidth and higher system-level performance. This white paper describes the trends and challenges seen by designers and how FPGAs enable SOLUTIONs to meet their stringent design goals.
上传时间： 2013-11-08
上传用户：yan2267246
Abstract: As industrial control systems (ICSs) have become increasingly connected and use more off-the-shelfcomponents, new vulnerabilities to cyber attacks have emerged. This tutorial looks at three types of ICSs:programmable logic controllers (PLCs), supervisory control and data acquisition (SCADA) systems, anddistributed control systems (DCSs), and then discusses security issues and remedies. This document alsoexplains the benefits and limitations of two cryptographic SOLUTIONs (digital signatures and encryption) andelaborates on the reasons for using security ICs in an ICS to support cryptography.
上传时间： 2013-10-09
上传用户：woshinimiaoye
