This book intends to prepare you to define Unified Communications (UC) for yourself and then get it to work for you. Each vendor pulls together from its available products a package of features Related to voice, data, messaging, and image communications. That’s UC for one vendor, but it’s unlikely to match exactly the UC from another vendor. You need a detailed specification to know what you’ll see installed.
标签： Communications Unified VoIP and
上传时间： 2020-06-01
上传用户：shancjb
Electrostatic discharge (ESD) is one of the most prevalent threats to the reliability of electronic components. It is an event in which a finite amount of charge is trans- ferred from one object (i.e., human body) to another (i.e., microchip). This process can result in a very high current passing through the microchip within a very short period of time, and, hence, more than 35% of chip damages can be attributed to an ESD-Related event. As such, designing on-chip ESD structures to protect integrated circuits against the ESD stresses is a high priority in the semiconductor industry.
标签： Electrostatic Protection Discharge
上传时间： 2020-06-05
上传用户：shancjb
In the seven years since the first edition of this book was completed, Electrostatic Discharge (ESD) phenomena in integrated circuits (IC) continues to be important as technologies shrink and the speed and size of the chips increases. The phenom- ena Related to ESD events in semiconductor devices take place outside the realm of normal device operation. Hence, the physics governing this behavior are not typ- ically found in general textbooks on semiconductors.
标签： Integrated Circuits Silicon ESD In
上传时间： 2020-06-05
上传用户：shancjb
ESD is a crucial factor for integrated circuits and influences their quality and reliability. Today increasingly sensitive processes with deep sub micron structures are developed. The integration of more and more functionality on a single chip and saving of chip area is required. Integrated circuits become more susceptible to ESD/EOS Related damages. However, the requirements on ESD robustness especially for automotive applications are increasing. ESD failures are very often the reason for redesigns. Much research has been conducted by semiconductor manufacturers on ESD robust design.
标签： Guidelines Design Basic ESD
上传时间： 2020-06-05
上传用户：shancjb
In the present era, low observability is one of the critical requirements in aerospace sector, especially Related to defense. The stealth technology essentially relates to shaping and usage of radar absorbing materials (RAM) or radar absorbing struc- tures (RAS). The performance of such radar cross section (RCS) reduction tech- niques is limited by the bandwidth constraints, payload requirements, and other structural issues. Moreover, with advancement of materials science, the structure geometry no longer remains key decisive factor toward stealth.
标签： Fundamentals Design Radar of EM
上传时间： 2020-06-06
上传用户：shancjb
With the rapid development of electric vehicles (EVs) as well as the promotion and application of vehicle-to-grid (V2G) technologies, EVs charging loads, as flexible loads, have the potential to participate in the grid services, including peak shaving and valley filling, frequency regulation (FR), emergency power, energy market participation, and so on. Therefore, great attention has been paid to EVs and V2G. Focusing on the interactions between EVs and power system, this book aims to bring readers with basic knowledge of electrical engineering promptly to the frontier of the EVs’ influence on power system and environment. This book may serve as a reference for scientists, electrical engineers, and postgraduate students majoring in electrical engineering or other Related fields.
标签： Electric Vehicles System Power on
上传时间： 2020-06-07
上传用户：shancjb
A revolution in power industries, including generation, transmission and distribution, driven by environmental and economic considerations, is taking place all over the world. The smart grid allows for integration of diverse generation and storage options, reduced losses, improved efficiencies, increased grid flexibility, reduced power outages, allowing for competitive electricity pricing and integration of electric vehicles and overall becoming more responsive to market, consumer and societal needs. It is bringing profound changes to both power systems and many Related industries.
标签： Measurement Innovative Solutions Testing and
上传时间： 2020-06-07
上传用户：shancjb
RFID networks are currently recognized as one a research area of priority. Research activities Related to RFID technology have been booming recently. A number of ongoing projects are being funded in Europe, Asia, and North America. According to leading market analysts, the development of the RFID market is projected to increase from approximately $3 billion in 2005 to $25 billion in 2015. Several countries have dedicated innovation programs to support and develop RFID systems and Related technologies: the RFID initiative in Taiwan, Ubiquitous Japan and the NSF SBIR program in the USA. The EU has recently advertised its Strategic Research Roadmap concerning the Internet of Things, which first of all refers to the RFID technology before being extended to commu- nicating devices as in M2M (Machine to Machine). In this roadmap, several application domains have been identified:
上传时间： 2020-06-08
上传用户：shancjb
INTERNATIONAL STANDARD NORME INTERNATIONALEPart 4-2: Testing and measurement techniques – Electrostatic discharge immunity test.About the IEC The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes International Standards for all electrical, electronic and Related technologies.About IEC publications The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the latest edition, a corrigenda or an amendment might have been published.
标签： IEC
上传时间： 2022-04-19
上传用户：fliang
说明： 基于51单片机的数字直流电压表相关材料，内容有原理图，仿真文件，论文材料，程序源码等。(The Related materials of digital DC voltmeter based on 51 single chip computer include schematic simulation files, paper materials, program source code, etc.)
上传时间： 2022-05-16
上传用户：fliang
