PCI ExpressTM Architecture Add-in Card Compliance Checklist for the PCI Express Base 1.0a SpecificationThe PCI Special Interest Group disclaims all warranties and liability for the use of this document and the information contained herein and assumes no responsibility for any errors that may appear in this document, nor does the PCI Special Interest Group make a commitment to update the information contained herein.Contact the PCI Special Interest Group office to obtain the latest revision of this checklistQuestions regarding the ths document or membership in the PCI Special Interest Group may be forwarded tPCI Special Interest Group5440 SW Westgate Drive #217Portland, OR 97221Phone: 503-291-2569Fax: 503-297-1090 DISCLAIMERThis document is provided "as is" with no warranties whatsoever, including any warranty of merchantability, noninfringement, fitness for any particular purpose, or any warranty otherwise arising out of any proposal, specification, or sample. The PCI SIG disclaims all liability for infringement of proprietary rights, relating to use of information in this specification. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted herein.
标签： Architecture ExpressTM PCI
上传时间： 2013-11-03
上传用户：gy592333
This document provides practical, common guidelines for incorporating PCI Express interconnect layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10- layer or more server baseboard designs. Guidelines and constraints in this document are intended for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI Express devices located on the same baseboard (chip-to-chip routing) and interconnects between a PCI Express device located “down” on the baseboard and a device located “up” on an add-in card attached through a connector. This document is intended to cover all major components of the physical interconnect including design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card edge-finger and connector considerations. The intent of the guidelines and examples is to help ensure that good high-speed signal design practices are used and that the timing/jitter and loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect. However, while general physical guidelines and suggestions are given, they may not necessarily guarantee adequate performance of the interconnect for all layouts and implementations. Therefore, designers should consider modeling and simulation of the interconnect in order to ensure compliance to all applicable specifications. The document is composed of two main sections. The first section provides an overview of general topology and interconnect guidelines. The second section concentrates on physical layout constraints where bulleted items at the beginning of a topic highlight important constraints, while the narrative that follows offers additional insight.
上传时间： 2013-10-15
上传用户：busterman
PCI ExpressTM is the third generation of PCI (PeripheralComponent Interconnect) technology used to connect I/Operhipheral devices in computer systems. It is intended asa general purpose I/O device interconnect that meets theneeds of a wide variety of computing platforms such asdesktop, mobile, server and communications. It alsospecifies the electrical and mechanical attributes of thebackplane, connectors and removable cards in thesesystems.
上传时间： 2013-11-17
上传用户：squershop
In this document, the term Ô60xÕ is used to denote a 32-bit microprocessor from the PowerPC architecture family that conforms to the bus interface of the PowerPC 601ª, PowerPC 603ª, or PowerPC 604 microprocessors. Note that this does not include the PowerPC 602ª microprocessor which has a multiplexed address/data bus. 60x processors implement the PowerPC architecture as it is speciÞed for 32-bit addressing, which provides 32-bit effective (logical) addresses, integer data types of 8, 16, and 32 bits,and ßoating-point data types of 32 and 64 bits (single-precision and double-precision).1.1 Overview The MPC106 provides an integrated high-bandwidth, high-performance, TTL-compatible interface between a 60x processor, a secondary (L2) cache or additional (up to four total) 60x processors, the PCI bus,and main memory. This section provides a block diagram showing the major functional units of the 106 and describes brießy how those units interact.Figure 1 shows the major functional units within the 106. Note that this is a conceptual block diagram intended to show the basic features rather than an attempt to show how these features are physically implemented on the device.
上传时间： 2013-10-08
上传用户：18711024007
The Motorola MPC106 PCI bridge/memory controller provides a PowerPCªmicroprocessor common hardware reference platform (CHRPª) compliant bridgebetween the PowerPC microprocessor family and the Peripheral Component Interconnect(PCI) bus. In this document, the term Ô106Õ is used as an abbreviation for the phraseÔMPC106 PCI bridge/memory controllerÕ. This document contains pertinent physicalcharacteristics of the 106. For functional characteristics refer to theMPC106 PCI Bridge/Memory Controller UserÕs Manual.This document contains the following topics:Topic PageSection 1.1, ÒOverviewÓ 2Section 1.2, ÒFeaturesÓ 3Section 1.3, ÒGeneral ParametersÓ 5Section 1.4, ÒElectrical and Thermal CharacteristicsÓ 5Section 1.5, ÒPin AssignmentsÓ 17Section 1.6, ÒPinout Listings 18Section 1.7, ÒPackage DescriptionÓ 22Section 1.8, ÒSystem Design InformationÓ 24Section 1.9, ÒDocument Revision HistoryÓ 29Section 1.10, ÒOrdering InformationÓ 29
上传时间： 2013-11-04
上传用户：as275944189
The PCI Special Interest Group disclaims all warranties and liability for the use of this document and the information contained herein and assumes no responsibility for any errors that may appear in this document, nor does the PCI Special Interest Group make a commitment to update the information contained herein.
上传时间： 2013-11-01
上传用户：KSLYZ
The Virtex-4 features, such as the programmable IDELAY and built-in FIFO support, simplifythe bridging of a high-speed, PCI-X core to large amounts of DDR-SDRAM memory. Onechallenge is meeting the PCI-X target initial latency specification. PCI-X Protocol Addendum tothe PCI Local Bus Specification Revision 2.0a ([Ref 6]) dictates that when a target signals adata transfer, "the target must do so within 16 clocks of the assertion of FRAME#." PCItermination transactions, such as Split Response/Complete, are commonly used to meet thelatency specifications. This method adds complexity to the design, as well as additional systemlatency. Another solution is to increase the ratio of the memory frequency to the PCI-X busfrequency. However, this solution increases the required power and clock resource usage.
上传时间： 2013-11-24
上传用户：18707733937
This document provides practical, common guidelines for incorporating PCI Express interconnect layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10- layer or more server baseboard designs. Guidelines and constraints in this document are intended for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI Express devices located on the same baseboard (chip-to-chip routing) and interconnects between a PCI Express device located “down” on the baseboard and a device located “up” on an add-in card attached through a connector. This document is intended to cover all major components of the physical interconnect including design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card edge-finger and connector considerations. The intent of the guidelines and examples is to help ensure that good high-speed signal design practices are used and that the timing/jitter and loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect. However, while general physical guidelines and suggestions are given, they may not necessarily guarantee adequate performance of the interconnect for all layouts and implementations. Therefore, designers should consider modeling and simulation of the interconnect in order to ensure compliance to all applicable specifications. The document is composed of two main sections. The first section provides an overview of general topology and interconnect guidelines. The second section concentrates on physical layout constraints where bulleted items at the beginning of a topic highlight important constraints, while the narrative that follows offers additional insight.
上传时间： 2014-01-24
上传用户：s363994250
PCI设计指南The Xilinx LogiCORE PCI interface is a fully verified, pre-implemented PCI Bus interface. This interface is available in 32-bit and 64- bit versions, with support for multiple Xilinx FPGA device families. It is designed to support both Verilog-HDL and VHDL. The design examples in this book are provided in Verilog.
标签： interface PCI pre-implemented LogiCORE
上传时间： 2016-04-03
上传用户：清风冷雨
The Cyclone® III PCI development board provides a hardware platform for developing and prototyping low-power, high-performance, logic-intensive PCI-based designs. The board provides a high-density of the memory to facilitate the design and development of FPGA designs which need huge memory storage, and also includes Low-Voltage Differential Signaling (LVDS) interface of the High-Speed Terasic Connectors (HSTCs) for extra high-speed interface application.
标签： development developing prototypi provides
上传时间： 2017-01-29
上传用户：jjj0202
