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On-chip

  • Employing a Single-Chip Transceiver in Femtocell Base-Station Applications

    Abstract: This application note discusses the development and deployment of 3G cellular femtocell base stations. The technicalchallenges for last-mile residential connectivity and adding system capacity in dense urban environments are discussed, with 3Gfemtocell base stations as a cost-effective solution. Maxim's 3GPP TS25.104-compliant transceiver solution is presented along withcomplete radio reference designs such as RD2550. For more information on the RD2550, see reference design 5364, "FemtocellRadio Reference Designs Using the MAX2550–MAX2553 Transceivers."

    标签: Base-Station Applications Single-Chip Transceiver

    上传时间: 2013-11-07

    上传用户:songrui

  • Analog Solutions for Altera FPGAs

    Designing withProgrammable Logicin an Analog WorldProgrammable logic devices revolutionizeddigital design over 25 years ago,promising designers a blank chip todesign literally any function and programit in the field. PLDs can be low-logicdensity devices that use nonvolatilesea-of-gates cells called complexprogrammable logic devices (CPLDs)or they can be high-density devicesbased on SRAM look-up tables (LUTs)

    标签: Solutions Analog Altera FPGAs

    上传时间: 2013-11-08

    上传用户:虫虫虫虫虫虫

  • 71M6541演示板用户手册

    The Maxim Integrated 71M6541-DB REV 3.0 Demo Board is a demonstration board for evaluating the 71M6541 device for single-phase electronic energy metering applications in conjunction with the Remote Sensor Inter-face. It incorporates a 71M6541 integrated circuit, a 71M6601 Remote Interface IC, peripheral circuitry such as a serial EEPROM, emulator port, and on-board power supply. A serial to USB converter allows communication to a PC through a USB port. The Demo Board allows the evaluation of the 71M6541 energy meter chip for measurement accuracy and overall system use.

    标签: 71M6541 演示板 用户手册

    上传时间: 2013-11-06

    上传用户:雨出惊人love

  • C8051F020数据手册

      The C8051F020/1/2/3 devices are fully integrated mixed-signal System-on-a-Chip MCUs with 64 digital I/O pins (C8051F020/2) or 32 digital I/O pins (C8051F021/3). Highlighted features are listed below; refer to Table 1.1 for specific product feature selection.

    标签: C8051F020 数据手册

    上传时间: 2013-11-08

    上传用户:lwq11

  • lpc2292/lpc2294 pdf datasheet

    The LPC2292/2294 microcontrollers are based on a 16/32-bit ARM7TDMI-S CPU with real-time emulation and embedded trace support, together with 256 kB of embedded high-speed flash memory. A 128-bit wide memory interface and a unique accelerator architecture enable 32-bit code execution at the maximum clock rate. For critical code size applications, the alternative 16-bit Thumb mode reduces code by more than 30 pct with minimal performance penalty. With their 144-pin package, low power consumption, various 32-bit timers, 8-channel 10-bit ADC, 2/4 (LPC2294) advanced CAN channels, PWM channels and up to nine external interrupt pins these microcontrollers are particularly suitable for automotive and industrial control applications as well as medical systems and fault-tolerant maintenance buses. The number of available fast GPIOs ranges from 76 (with external memory) through 112 (single-chip). With a wide range of additional serial communications interfaces, they are also suited for communication gateways and protocol converters as well as many other general-purpose applications. Remark: Throughout the data sheet, the term LPC2292/2294 will apply to devices with and without the /00 or /01 suffix. The suffixes /00 and /01 will be used to differentiate from other devices only when necessary.

    标签: lpc datasheet 2292 2294

    上传时间: 2014-12-30

    上传用户:aysyzxzm

  • 接口选择指南

    LVDS、xECL、CML(低电压差分信号传输、发射级耦合逻辑、电流模式逻辑)………4多点式低电压差分信号传输(M-LVDS) ……………………………………………………8数字隔离器 ………………………………………………………………………………10RS-485/422 …………………………………………………………………………………11RS-232………………………………………………………………………………………13UART(通用异步收发机)…………………………………………………………………16CAN(控制器局域网)……………………………………………………………………18FlatLinkTM 3G ………………………………………………………………………………19SerDes(串行G 比特收发机及LVDS)……………………………………………………20DVI(数字视频接口)/PanelBusTM ………………………………………………………22TMDS(最小化传输差分信号) …………………………………………………………24USB 集线器控制器及外设器件 …………………………………………………………25USB 接口保护 ……………………………………………………………………………26USB 电源管理 ……………………………………………………………………………27PCI Express® ………………………………………………………………………………29PCI 桥接器 …………………………………………………………………………………33卡总线 (CardBus) 电源开关 ………………………………………………………………341394 (FireWire®, 火线®) ……………………………………………………………………36GTLP (Gunning Transceiver Logic Plus,体效应收发机逻辑+) ………………………………39VME(Versa Module Eurocard)总线 ………………………………………………………41时钟分配电路 ……………………………………………………………………………42交叉参考指南 ……………………………………………………………………………43器件索引 …………………………………………………………………………………47技术支持 …………………………………………………………………………………48 德州仪器(TI)为您提供了完备的接口解决方案,使得您的产品别具一格,并加速了产品面市。凭借着在高速、复合信号电路、系统级芯片 (system-on-a-chip ) 集成以及先进的产品开发工艺方面的技术专长,我们将能为您提供硅芯片、支持工具、软件和技术文档,使您能够按时的完成并将最佳的产品推向市场,同时占据一个具有竞争力的价格。本选择指南为您提供与下列器件系列有关的设计考虑因素、技术概述、产品组合图示、参数表以及资源信息:

    标签: 接口 选择指南

    上传时间: 2013-10-21

    上传用户:Jerry_Chow

  • 基于SOPC技术的异步串行通信IP核的设计

    介绍了SoPC(System on a Programmable Chip)系统的概念和特点,给出了基于PLB总线的异步串行通信(UART)IP核的硬件设计和实现。通过将设计好的UART IP核集成到SoPC系统中加以验证,证明了所设计的UART IP核可以正常工作。该设计方案为其他基于SoPC系统IP核的开发提供了一定的参考。

    标签: SOPC IP核 异步串行通信

    上传时间: 2013-11-12

    上传用户:894448095

  • 《器件封装用户向导》赛灵思产品封装资料

    Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.

    标签: 封装 器件 用户 赛灵思

    上传时间: 2013-11-21

    上传用户:不懂夜的黑

  • Employing a Single-Chip Transceiver in Femtocell Base-Station Applications

    Abstract: This application note discusses the development and deployment of 3G cellular femtocell base stations. The technicalchallenges for last-mile residential connectivity and adding system capacity in dense urban environments are discussed, with 3Gfemtocell base stations as a cost-effective solution. Maxim's 3GPP TS25.104-compliant transceiver solution is presented along withcomplete radio reference designs such as RD2550. For more information on the RD2550, see reference design 5364, "FemtocellRadio Reference Designs Using the MAX2550–MAX2553 Transceivers."

    标签: Base-Station Applications Single-Chip Transceiver

    上传时间: 2013-11-05

    上传用户:超凡大师

  • Analog Solutions for Altera FPGAs

    Designing withProgrammable Logicin an Analog WorldProgrammable logic devices revolutionizeddigital design over 25 years ago,promising designers a blank chip todesign literally any function and programit in the field. PLDs can be low-logicdensity devices that use nonvolatilesea-of-gates cells called complexprogrammable logic devices (CPLDs)or they can be high-density devicesbased on SRAM look-up tables (LUTs)

    标签: Solutions Analog Altera FPGAs

    上传时间: 2013-10-27

    上传用户:fredguo