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  • 基于(英蓓特)STM32V100的看门狗程序

    This example shows how to update at regulate period the WWDG counter using theEarly Wakeup interrupt (EWI). The WWDG timeout is set to 262ms, refresh window set to 41h and the EWI isenabled. When the WWDG counter reaches 40h the EWI is generated and in the WWDGISR the counter is refreshed to prevent a WWDG reset and led connected to PC.07is toggled.The EXTI line9 is connected to PB.09 pin and configured to generate an interrupton falling edge.In the NVIC, EXTI line9 to 5 interrupt vector is enabled with priority equal to 0and the WWDG interrupt vector is enabled with priority equal to 1 (EXTI IT > WWDG IT). The EXTI Line9 will be used to simulate a software failure: once the EXTI line9event occurs (by pressing Key push-button on EVAL board) the correspondent interruptis served, in the ISR the led connected to PC.07 is turned off and the EXTI line9pending bit is not cleared. So the CPU will execute indefinitely EXTI line9 ISR andthe WWDG ISR will never be entered(WWDG counter not updated). As result, when theWWDG counter falls to 3Fh the WWDG reset occurs.If the EXTI line9 event don抰 occurs the WWDG counter is indefinitely refreshed inthe WWDG ISR which prevent from WWDG reset. If the WWDG reset is generated, after resuming from reset a led connected to PC.06is turned on. In this example the system is clocked by the HSE(8MHz).

    标签: V100 STM 100 32V

    上传时间: 2013-11-11

    上传用户:gundamwzc

  • 【PPT】Board(印刷电路板)的缩写

    Board(印刷电路板)的缩写。

    标签: Board 印刷电路板

    上传时间: 2015-01-01

    上传用户:ppeyou

  • Spartan-3E Starter Kit Board User Guide

    Spartan-3E Starter Kit Board User Guide英语版的介绍,很适合初学者学习学习

    标签: Spartan Starter Board Guide

    上传时间: 2013-11-19

    上传用户:ruan2570406

  • 《器件封装用户向导》赛灵思产品封装资料

    Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.

    标签: 封装 器件 用户 赛灵思

    上传时间: 2013-11-21

    上传用户:不懂夜的黑

  • XAPP740利用AXI互联设计高性能视频系统

    This application note covers the design considerations of a system using the performance features of the LogiCORE™ IP Advanced eXtensible Interface (AXI) Interconnect core. The design focuses on high system throughput through the AXI Interconnect core with F MAX  and area optimizations in certain portions of the design. The design uses five AXI video direct memory access (VDMA) engines to simultaneously move 10 streams (five transmit video streams and five receive video streams), each in 1920 x 1080p format, 60 Hz refresh rate, and up to 32 data bits per pixel. Each VDMA is driven from a video test pattern generator (TPG) with a video timing controller (VTC) block to set up the necessary video timing signals. Data read by each AXI VDMA is sent to a common on-screen display (OSD) core capable of multiplexing or overlaying multiple video streams to a single output video stream. The output of the OSD core drives the DVI video display interface on the board. Performance monitor blocks are added to capture performance data. All 10 video streams moved by the AXI VDMA blocks are buffered through a shared DDR3 SDRAM memory and are controlled by a MicroBlaze™ processor. The reference system is targeted for the Virtex-6 XC6VLX240TFF1156-1 FPGA on the Xilinx® ML605 Rev D evaluation board

    标签: XAPP 740 AXI 互联

    上传时间: 2013-11-23

    上传用户:shen_dafa

  • 扩频通信芯片STEL-2000A的FPGA实现

    针对传统集成电路(ASIC)功能固定、升级困难等缺点,利用FPGA实现了扩频通信芯片STEL-2000A的核心功能。使用ISE提供的DDS IP核实现NCO模块,在下变频模块调用了硬核乘法器并引入CIC滤波器进行低通滤波,给出了DQPSK解调的原理和实现方法,推导出一种简便的引入?仔/4固定相移的实现方法。采用模块化的设计方法使用VHDL语言编写出源程序,在Virtex-II Pro 开发板上成功实现了整个系统。测试结果表明该系统正确实现了STEL-2000A的核心功能。 Abstract:  To overcome drawbacks of ASIC such as fixed functionality and upgrade difficulty, FPGA was used to realize the core functions of STEL-2000A. This paper used the DDS IP core provided by ISE to realize the NCO module, called hard core multiplier and implemented CIC filter in the down converter, described the principle and implementation detail of the demodulation of DQPSK, and derived a simple method to introduce a fixed phase shift of ?仔/4. The VHDL source code was designed by modularity method , and the complete system was successfully implemented on Virtex-II Pro development board. Test results indicate that this system successfully realize the core function of the STEL-2000A.

    标签: STEL 2000 FPGA 扩频通信

    上传时间: 2013-11-19

    上传用户:neu_liyan

  • PCB设计问题集锦

    PCB设计问题集锦 问:PCB图中各种字符往往容易叠加在一起,或者相距很近,当板子布得很密时,情况更加严重。当我用Verify Design进行检查时,会产生错误,但这种错误可以忽略。往往这种错误很多,有几百个,将其他更重要的错误淹没了,如何使Verify Design会略掉这种错误,或者在众多的错误中快速找到重要的错误。    答:可以在颜色显示中将文字去掉,不显示后再检查;并记录错误数目。但一定要检查是否真正属于不需要的文字。 问: What’s mean of below warning:(6230,8330 L1) Latium Rule not checked: COMPONENT U26 component rule.答:这是有关制造方面的一个检查,您没有相关设定,所以可以不检查。 问: 怎样导出jop文件?答:应该是JOB文件吧?低版本的powerPCB与PADS使用JOB文件。现在只能输出ASC文件,方法如下STEP:FILE/EXPORT/选择一个asc名称/选择Select ALL/在Format下选择合适的版本/在Unit下选Current比较好/点击OK/完成然后在低版本的powerPCB与PADS产品中Import保存的ASC文件,再保存为JOB文件。 问: 怎样导入reu文件?答:在ECO与Design 工具盒中都可以进行,分别打开ECO与Design 工具盒,点击右边第2个图标就可以。 问: 为什么我在pad stacks中再设一个via:1(如附件)和默认的standardvi(如附件)在布线时V选择1,怎么布线时按add via不能添加进去这是怎么回事,因为有时要使用两种不同的过孔。答:PowerPCB中有多个VIA时需要在Design Rule下根据信号分别设置VIA的使用条件,如电源类只能用Standard VIA等等,这样操作时就比较方便。详细设置方法在PowerPCB软件通中有介绍。 问:为什么我把On-line DRC设置为prevent..移动元时就会弹出(图2),而你们教程中也是这样设置怎么不会呢?答:首先这不是错误,出现的原因是在数据中没有BOARD OUTLINE.您可以设置一个,但是不使用它作为CAM输出数据. 问:我用ctrl+c复制线时怎设置原点进行复制,ctrl+v粘帖时总是以最下面一点和最左边那一点为原点 答: 复制布线时与上面的MOVE MODE设置没有任何关系,需要在右键菜单中选择,这在PowerPCB软件通教程中有专门介绍. 问:用(图4)进行修改线时拉起时怎总是往左边拉起(图5),不知有什么办法可以轻易想拉起左就左,右就右。答: 具体条件不明,请检查一下您的DESIGN GRID,是否太大了. 问: 好不容易拉起右边但是用(图6)修改线怎么改怎么下面都会有一条不能和在一起,而你教程里都会好好的(图8)答:这可能还是与您的GRID 设置有关,不过没有问题,您可以将不需要的那段线删除.最重要的是需要找到布线的感觉,每个软件都不相同,所以需要多练习。 问: 尊敬的老师:您好!这个图已经画好了,但我只对(如图1)一种的完全间距进行检查,怎么错误就那么多,不知怎么改进。请老师指点。这个图在附件中请老师帮看一下,如果还有什么问题请指出来,本人在改进。谢!!!!!答:请注意您的DRC SETUP窗口下的设置是错误的,现在选中的SAME NET是对相同NET进行检查,应该选择NET TO ALL.而不是SAME NET有关各项参数的含义请仔细阅读第5部教程. 问: U101元件已建好,但元件框的拐角处不知是否正确,请帮忙CHECK 答:元件框等可以通过修改编辑来完成。问: U102和U103元件没建完全,在自动建元件参数中有几个不明白:如:SOIC--》silk screen栏下spacing from pin与outdent from first pin对应U102和U103元件应写什么数值,还有这两个元件SILK怎么自动设置,以及SILK内有个圆圈怎么才能画得与该元件参数一致。 答:Spacing from pin指从PIN到SILK的Y方向的距离,outdent from first pin是第一PIN与SILK端点间的距离.请根据元件资料自己计算。

    标签: PCB 设计问题 集锦

    上传时间: 2014-01-03

    上传用户:Divine

  • PQP is a library for performing three types of proximity queries on a pair of geometric models compo

    PQP is a library for performing three types of proximity queries on a pair of geometric models composed of triangles:

    标签: performing geometric proximity library

    上传时间: 2014-01-13

    上传用户:love_stanford

  • uClinux on ARM7TDMI(ppt)

    uClinux on ARM7TDMI(ppt)

    标签: ARM7TDMI uClinux on

    上传时间: 2013-12-11

    上传用户:shizhanincc

  • TheTool is highy customizable map editor(based on QT) which can be extended via LUA scripts. A first

    TheTool is highy customizable map editor(based on QT) which can be extended via LUA scripts. A first implentation is ready and can be published to the public. The editor is the perfect tool who wants to design some 3d games but don t have time to write

    标签: customizable extended TheTool scripts

    上传时间: 2013-12-12

    上传用户:lanwei