Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
上传时间： 2013-10-22
上传用户：ztj182002
在车载自组网中，路由协议很大程度上决定了整个网络的性能。如何有效的利用车流信息提高传输质量是改善路由性能的一个关键问题。本文基于速度-密度线性模型，提出了一种实时车流密度的路由协议RVDR（Real-time Vehicle Density Routing）。该协议通过与邻居节点交换的速度信息，对相关道路车流密度进行预测，并给出基于车流密度信息的路径选择方法。仿真结果表明，与现有协议相比，RVDR协议在实时性和高效性等性能方面得到改进。
上传时间： 2014-07-10
上传用户：ZJX5201314
随着多媒体时代的深入，各种令人眼花缭乱的视频显示技术迅猛发展，与此同时，层出不穷的新兴应用也对产品音频性能提出了更高的要求，比如用电脑直接拨打IP电话、进行视频会议、仪器操作语音控制等场合都需要高质量的语音效果。在市场推动下，不仅传统模拟与混合信号器件供应商继续深耕不懈，一些新进入该领域的公司也推出多种创新性方案应对市场需求。本文提出了利用ARM7微控制器，uC/OS-II实时操作系统和DSP处理内核的音频处理芯片的音频处理方案。该方案能有效改善音质，提供清晰、自然的语音。 音频方面LPC2214+VS1003
上传时间： 2013-10-14
上传用户：1318695663
通过对ARM7TDMI体系结构、LPC2000系列ARM、μC/OS-II微小内核分析与程序设计基础的深入学习之后，对嵌入式系统有了清晰的了解。本课件将结合一个具体的实例－－电脑自动打铃器来阐述嵌入式应用系统的工程设计方法。
上传时间： 2013-10-14
上传用户：tom_man2008
详细介绍了以LPC1788 ARM Cortex-M3微处理器为目标硬件平台，在IAR Embedded Workbench for ARM 6.3集成开发环境下μC/OS-II 实时操作系统的详细移植过程，重点阐述移植代码中堆栈初始化、任务切换、时钟中断服务程序的编写方法，并在评估板上验证了在该嵌入式实时操作系统上实现多任务操作。
上传时间： 2014-01-22
上传用户：HGH77P99
When I started writing the first edition of RF Power Amplifiers for Wireless Communications,some time back in 1997, it seemed that I was roaming a largely uninhabitedlandscape. For reasons still not clear to me there were few, if any, otherbooks dedicated to the subject of RF power amplifiers. Right at the same time, however,hundreds of engineers were being assigned projects to design PAs for wirelesscommunications products. It was not, therefore, especially difficult to be successfulwith a book that was fortuitously at the right place and the right time.
标签： Communications Amplifiers Wireless Edition
上传时间： 2013-11-12
上传用户：YYRR
ExpressPCB 是一款免费的PCB设计软件，简单实使。可以画双层板。 Our Free PCB software is a snap to learn and use. For the first time, designing circuit boards is simple for the beginner and efficient for the professional. Our board manufacturing service makes top quality two and four layer PCBs. Use our MiniBoard service and pay only $51 for three boards (plus $8 shipping).
标签： ExpressPCB PCB 设计软件
上传时间： 2013-11-15
上传用户：lchjng
ExpressPCB 是一款免费的PCB设计软件，简单实使。可以画双层板。 Our Free PCB software is a snap to learn and use. For the first time, designing circuit boards is simple for the beginner and efficient for the professional. Our board manufacturing service makes top quality two and four layer PCBs. Use our MiniBoard service and pay only $51 for three boards (plus $8 shipping).
标签： ExpressPCB PCB 设计软件
上传时间： 2013-10-09
上传用户：1047385479
SOPC嵌入式系统实验教程（一）【作者：周立功；出版社：北京航空航天大学出版社】(因网上资料有限，所以本资料为周立功 SOPC嵌入式系统实验教程（一）部分章节及实验代码，真心想学的可以买一本书看看。) 该书是与《SOPC嵌入式系统基础教程》相配套的实验教材。设计开发了 45个实验，包括SOPC硬件系统的基础实验，基于Nios II外设的基础编程实验，基于实验箱外设的Nios II高级编程实验，在Nios II系统中进行基于μ C/OS-II操作系统的应用程序开发实验和SOPC硬件系统的高级实验。各种实验的安排由浅人深，由硬件到软件，相对完整，使读者很容易学习和掌握SO PC嵌入式系统的开发应用。
上传时间： 2013-11-01
上传用户：superman111
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
上传时间： 2013-11-21
上传用户：不懂夜的黑
