Nios II 软件开发人员手册中的缓存和紧耦合存储器部分 Nios® II embedded processor cores can contain instruction and data caches. This chapter discusses cache-related issues that you need to consider to guarantee that your program executes correctly on the Nios II processor. Fortunately, most software based on the Nios II hardware abstraction layer (HAL) works correctly without any special accommodations for caches. However, some software must manage the cache directly. For code that needs direct control over the cache, the Nios II architecture provides facilities to perform the following actions:
上传时间： 2013-10-25
上传用户：虫虫虫虫虫虫
第一步，拿到一块PCB，首先在纸上记录好所有元气件的型号，参数，以及位置，尤其是二极管，三极管的方向，IC缺口的方向。最好用数码相机拍两张元气件位置的照片。 第二步，拆掉所有器件，并且将PAD孔里的锡去掉。用酒精将PCB清洗干净，然后放入扫描仪内，启动POHTOSHOP，用彩色方式将丝印面扫入，并打印出来备用。 第三步，用水纱纸将TOP LAYER 和BOTTOM LAYER两层轻微打磨，打磨到铜膜发亮，放入扫描仪，启动PHOTOSHOP，用彩色方式将两层分别扫入。注意，PCB在扫描仪内摆放一定要横平树直，否则扫描的图象就无法使用，扫描仪分辨率请选为600。 需要的朋友请下载哦！
上传时间： 2014-03-04
上传用户：tianming222
Today’s digital systems combine a myriad of chips with different voltage configurations.Designers must interface 2.5V processors with 3.3V memories—both RAM and ROM—as wellas 5V buses and multiple peripheral chips. Each chip has specific power supply needs. CPLDsare ideal for handling the multi-voltage interfacing, but do require forethought to ensure correctoperation.
上传时间： 2013-11-10
上传用户：yy_cn
MP3 portable players are the trend in music-listening technology. These players do not includeany mechanical movements, thereby making them ideal for listening to music during any type ofactivity. MP3 is a digital compression technique based on MPEG Layer 3 which stores music ina lot less space than current CD technology. Software is readily available to create MP3 filesfrom an existing CD, and the user can then download these files into a portable MP3 player tobe enjoyed in almost any environment.
上传时间： 2013-11-23
上传用户：nanxia
第一步，拿到一块PCB，首先在纸上记录好所有元气件的型号，参数，以及位置，尤其是二极管，三机管的方向，IC缺口的方向。最好用数码相机拍两张元气件位置的照片。第二步，拆掉所有器件，并且将PAD孔里的锡去掉。用酒精将PCB清洗干净，然后放入扫描仪内，启动POHTOSHOP，用彩色方式将丝印面扫入，并打印出来备用。第三步，用水纱纸将TOP LAYER 和BOTTOM LAYER两层轻微打磨，打磨到铜膜发亮，放入扫描仪，启动PHOTOSHOP，用彩色方式将两层分别扫入。注意，PCB在扫描仪内摆放一定要横平树直，否则扫描的图象就无法使用。第四步，调整画布的对比度，明暗度，使有铜膜的部分和没有铜膜的部分对比强烈，然后将次图转为黑白色，检查线条是否清晰，如果不清晰，则重复本步骤。如果清晰，将图存为黑白BMP格式文件TOP.BMP和BOT.BMP。第五步，将两个BMP格式的文件分别转为PROTEL格式文件，在PROTEL中调入两层，如过两层的PAD和VIA的位置基本重合，表明前几个步骤做的很好，如果有偏差，则重复第三步。第六，将TOP。BMP转化为TOP。PCB，注意要转化到SILK层，就是黄色的那层，然后你在TOP层描线就是了，并且根据第二步的图纸放置器件。画完后将SILK层删掉。 第七步，将BOT。BMP转化为BOT。PCB，注意要转化到SILK层，就是黄色的那层，然后你在BOT层描线就是了。画完后将SILK层删掉。第八步，在PROTEL中将TOP。PCB和BOT。PCB调入，合为一个图就OK了。第九步，用激光打印机将TOP LAYER， BOTTOM LAYER分别打印到透明胶片上（1：1的比例），把胶片放到那块PCB上，比较一下是否有误，如果没错，你就大功告成了。
上传时间： 2013-11-24
上传用户：ynzfm
PCB LAYOUT 術語解釋(TERMS)1. COMPONENT SIDE(零件面、正面)︰大多數零件放置之面。2. SOLDER SIDE(焊錫面、反面)。3. SOLDER MASK(止焊膜面)︰通常指Solder Mask Open 之意。4. TOP PAD︰在零件面上所設計之零件腳PAD，不管是否鑽孔、電鍍。5. BOTTOM PAD：在銲錫面上所設計之零件腳PAD，不管是否鑽孔、電鍍。6. POSITIVE LAYER：單、雙層板之各層線路；多層板之上、下兩層線路及內層走線皆屬之。7. NEGATIVE LAYER：通常指多層板之電源層。8. INNER PAD：多層板之POSITIVE LAYER 內層PAD。9. ANTI-PAD：多層板之NEGATIVE LAYER 上所使用之絕緣範圍，不與零件腳相接。10. THERMAL PAD：多層板內NEGATIVE LAYER 上必須零件腳時所使用之PAD，一般稱為散熱孔或導通孔。11. PAD (銲墊)：除了SMD PAD 外，其他PAD 之TOP PAD、BOTTOM PAD 及INNER PAD 之形狀大小皆應相同。12. Moat : 不同信號的 Power& GND plane 之間的分隔線13. Grid : 佈線時的走線格點2. Test Point : ATE 測試點供工廠ICT 測試治具使用ICT 測試點 LAYOUT 注意事項:PCB 的每條TRACE 都要有一個作為測試用之TEST PAD(測試點)，其原則如下：1. 一般測試點大小均為30-35mil，元件分布較密時，測試點最小可至30mil.測試點與元件PAD 的距離最小為40mil。2. 測試點與測試點間的間距最小為50-75mil，一般使用75mil。密度高時可使用50mil,3. 測試點必須均勻分佈於PCB 上，避免測試時造成板面受力不均。4. 多層板必須透過貫穿孔(VIA)將測試點留於錫爐著錫面上(Solder Side)。5. 測試點必需放至於Bottom Layer6. 輸出test point report(.asc 檔案powerpcb v3.5)供廠商分析可測率7. 測試點設置處:Setuppadsstacks
上传时间： 2013-11-17
上传用户：cjf0304
LAYOUT REPORT .............. 1 目錄.................. 1 1. PCB LAYOUT 術語解釋(TERMS)......... 2 2. Test Point : ATE 測試點供工廠ICT 測試治具使用............ 2 3. 基準點 (光學點) -for SMD:........... 4 4. 標記 (LABEL ING)......... 5 5. VIA HOLE PAD................. 5 6. PCB Layer 排列方式...... 5 7.零件佈置注意事項 (PLACEMENT NOTES)............... 5 8. PCB LAYOUT 設計............ 6 9. Transmission Line ( 傳輸線 )..... 8 10.General Guidelines – 跨Plane.. 8 11. General Guidelines – 繞線....... 9 12. General Guidelines – Damping Resistor. 10 13. General Guidelines - RJ45 to Transformer................. 10 14. Clock Routing Guideline........... 12 15. OSC & CRYSTAL Guideline........... 12 16. CPU
上传时间： 2013-10-29
上传用户：1234xhb
This document provides practical, common guidelines for incorporating PCI Express interconnect layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10- layer or more server baseboard designs. Guidelines and constraints in this document are intended for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI Express devices located on the same baseboard (chip-to-chip routing) and interconnects between a PCI Express device located “down” on the baseboard and a device located “up” on an add-in card attached through a connector. This document is intended to cover all major components of the physical interconnect including design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card edge-finger and connector considerations. The intent of the guidelines and examples is to help ensure that good high-speed signal design practices are used and that the timing/jitter and loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect. However, while general physical guidelines and suggestions are given, they may not necessarily guarantee adequate performance of the interconnect for all layouts and implementations. Therefore, designers should consider modeling and simulation of the interconnect in order to ensure compliance to all applicable specifications. The document is composed of two main sections. The first section provides an overview of general topology and interconnect guidelines. The second section concentrates on physical layout constraints where bulleted items at the beginning of a topic highlight important constraints, while the narrative that follows offers additional insight.
上传时间： 2014-01-24
上传用户：s363994250
The data plane of the reference design consists of a configurable multi-channel XBERT modulethat generates and checks high-speed serial data transmitted and received by the MGTs. Eachchannel in the XBERT module consists of two MGTs (MGTA and MGTB), which physicallyoccupy one MGT tile in the Virtex-4 FPGA. Each MGT has its own pattern checker, but bothMGTs in a channel share the same pattern generator. Each channel can load a differentpattern. The MGT serial rate depends on the reference clock frequency and the internal PMAdivider settings. The reference design can be scaled anywhere from one channel (two MGTs)to twelve channels (twenty-four MGTs).
上传时间： 2013-12-25
上传用户：jkhjkh1982
ARM通讯 H-JTAG 是一款简单易用的的调试代理软件，功能和流行的MULTI-ICE 类似。H-JTAG 包括两个工具软件：H-JTAG SERVER 和H-FLASHER。其中，H-JTAG SERVER 实现调试代理的功能，而H-FLASHER则实现了FLASH 烧写的功能。H-JTAG 的基本结构如下图1-1所示。 H-JTAG支持所有基于ARM7 和ARM9的芯片的调试，并且支持大多数主流的ARM调试软件，如ADS、RVDS、IAR 和KEIL。通过灵活的接口配置，H-JTAG 可以支持WIGGLER，SDT-JTAG 和用户自定义的各种JTAG 调试小板。同时，附带的H-FLASHER 烧写软件还支持常用片内片外FLASH 的烧写。使用H-JTAG，用户能够方便的搭建一个简单易用的ARM 调试开发平台。H-JTAG 的功能和特定总结如下： 1. 支持 RDI 1.5.0 以及 1.5.1； 2. 支持所有ARM7 以及 ARM9 芯片； 3. 支持 THUMB 以及ARM 指令； 4. 支持 LITTLE-ENDIAN 以及 BIG-ENDIAN； 5. 支持 SEMIHOSTING； 6. 支持 WIGGLER， SDT-JTAG和用户自定义JTAG调试板； 7. 支持 WINDOWS 9.X/NT/2000/XP； 8．支持常用FLASH 芯片的编程烧写； 9. 支持LPC2000 和AT91SAM 片内FLASH 的自动下载；
上传时间： 2013-11-19
上传用户：水中浮云
