Abstract: Using a wafer-level package (WLP) can reduce the overall size and cost of your solution.However when using a WLP IC, the printed circuit board (PCB) Layout can become more complex and, ifnot carefully planned, result in an unreliable design. This article presents some PCB designconsiderations and general recommendations for choosing a 0.4mm- or 0.5mm-pitch WLP for yourapplication.
Abstract: This application note explains how to Layout the MAX20021/MAX20022 automotive quad powermanagementICs (PMICs) to maximize performance and minimize emissions. Example images of a fourlayerLayout are provided.
