Visible light communications (VLC) is the name given to an optical wireless communication system that carries information by modulating light in the visible spectrum (400–700 nm) that is principally used for illumination [1–3]. The communications signal is encoded on top of the illumination light. Interest in VLC has grown rapidly with the growth of high power light emitting diodes (LEDs) in the visible spectrum. The motivation to use the illumination light for communication is to save energy by exploiting the illumination to carry information and, at the same time, to use technology that is “green” in comparison to radio frequency (RF) technology, while using the existing infrastructure of the lighting system.
标签： Communication Visible Light
上传时间： 2020-06-01
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Second-generation telecommunication systems, such as the Global System for Mobile Communications (GSM), enabled voice traffic to go wireless: the number of mobile phones exceeds the number of landline phones and the mobile phone penetration is approaching 100% in several markets. The data-handling capabilities of second-generation systems are limited, however, and third-generation systems are needed to provide the high bit-rate services that enable high-quality images and video to be transmitted and received, and to provide access to the Web with higher data rates.
标签： Evolution WCDMA UMTS HSPA LTE for and
上传时间： 2020-06-01
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Wireless Mesh Networks (WMN) are believed to be a highly promising technology and will play an increasingly important role in future generation wireless mobile networks. WMN is characterized by dynamic self-organization, self-configuration and self-healing to enable quick deployment, easy maintenance, low cost, high scalability and reliable services, as well as enhancing network capacity, connect- ivity and resilience.
标签： Networking Wireless Mesh
上传时间： 2020-06-01
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Electrostatic discharge (ESD) is one of the most prevalent threats to the reliability of electronic components. It is an event in which a finite amount of charge is trans- ferred from one object (i.e., human body) to another (i.e., microchip). This process can result in a very high current passing through the microchip within a very short period of time, and, hence, more than 35% of chip damages can be attributed to an ESD-related event. As such, designing on-chip ESD structures to protect integrated circuits against the ESD stresses is a high priority in the semiconductor industry.
标签： Electrostatic Protection Discharge
上传时间： 2020-06-05
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In the seven years since the first edition of this book was completed, Electrostatic Discharge (ESD) phenomena in integrated circuits (IC) continues to be important as technologies shrink and the speed and size of the chips increases. The phenom- ena related to ESD events in semiconductor devices take place outside the realm of normal device operation. Hence, the physics governing this behavior are not typ- ically found in general textbooks on semiconductors.
标签： Integrated Circuits Silicon ESD In
上传时间： 2020-06-05
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Electrostatic discharge (ESD) events can have serious detrimental effects on the manufacture and performance of microelectronic devices, the systems that contain them, and the manufacturing facilities used to produce them. Submicron device technologies, high system operating speeds, and factory automation are making ESD control programs a critical factor in the quality and reliability of ESD-sensitive products.
标签： Management Program ESD
上传时间： 2020-06-05
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The goal of this book is to introduce the simulation methods necessary to describe the behaviour of semiconductor devices during an electrostatic discharge (ESD). The challenge of this task is the correct description of semiconductor devices under very high current density and high temperature transients. As it stands, the book can be no more than a snapshot and a summary of the research in this field during the past few years. The authors hope that the book will provide the basis for further development of simulation methods at this current frontier of device physics.
标签： Development Protection ESD
上传时间： 2020-06-05
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The challenges associated with the design and implementation of Electro- static Discharge (ESD) protection circuits become increasingly complex as technology is scaled well into nano-metric regime. One must understand the behavior of semiconductor devices under very high current densities, high temperature transients in order to surmount the nano-meter ESD challenge. As a consequence, the quest for suitable ESD solution in a given technology must start from the device level. Traditional approaches of ESD design may not be adequate as the ESD damages occur at successively lower voltages in nano-metric dimensions.
标签： Protection Circuit Device Design ESD and
上传时间： 2020-06-05
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The planarization technology of Chemical-Mechanical-Polishing (CMP), used for the manufacturing of multi- level metal interconnects for high-density Integrated Circuits (IC), is also readily adaptable as an enabling technology in MicroElectroMechanical Systems (MEMS) fabrication, particularly polysilicon surface micromachining. CMP not only eases the design and manufacturability of MEMS devices by eliminating several photolithographic and film issues generated by severe topography, but also enables far greater flexibility with process complexity and associated designs. T
标签： mechanical polishing Chemical
上传时间： 2020-06-06
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Micro-Electro-Mechanical Systems (MEMS) are miniature systems composed ofintegratedelectricalandmechanicalpartstosenseand/orcontrolthingsonaµmscale. The concept of MEMS is attributed to Richard Feynman’s famous talk on December 29th, 1959 [2,3]. Dr. Feynman foresaw many aspects of future MEMS development with his insight in microphysics. In particular, material properties in the µm scale are differentfrombulkpropertiesandthescalingdownofintegratedcircuits(IC)fabrication technology has been a major driving force of MEMS development.
标签： Performance High MEMS RF
上传时间： 2020-06-06
上传用户：shancjb
