F型端子的压接与检验
标签： 端子
上传时间： 2013-06-05
上传用户：eeworm
·Ive been working with Windows CE for almost as long as its been in existence. A Windows programmer for many years, Im amazed by the number of different, typically quite small, systems to which I can a
上传时间： 2013-04-24
上传用户：Zxcvbnm
·无线经典教材《无线通信》by Goldsmith 英文版
上传时间： 2013-06-27
上传用户：zklh8989
PCI Arbitor by VHDL
上传时间： 2013-08-18
上传用户：h886166
提出了一种基于FPGA的高阶高速F IR滤波器的设计与实现方法。通过一个169阶的均方根\r\n升余弦滚降滤波器的设计,介绍了如何应用流水线技术来设计高阶高速F IR滤波器,并且对所设计的\r\nFIR滤波器性能、资源占用进行了分析。
上传时间： 2013-08-31
上传用户：小火车啦啦啦
* DESCRIPTION: DDS design BY PLD DEVICES.\r\n *\r\n * AUTHOR: Sun Yu\r\n *\r\n * HISTORY: 12/06/2002 \r\n *
标签： DESCRIPTION DEVICES design DDS
上传时间： 2013-09-09
上传用户：jokey075
Altium Designer Guide by Univ of Nevada
标签： Designer Altium Nevada Guide
上传时间： 2013-09-11
上传用户：qingzhuhu
Accessing IDE Hard disk by ATmega32 microcontroller (Proteus simulation include)
标签： microcontroller simulation Accessing Proteus
上传时间： 2013-09-21
上传用户：18888888888
Integrated EMI/Thermal Design forSwitching Power SuppliesWei ZhangThesis submitted to the Faculty of theVirginia Polytechnic Institute and State Universityin partial fulfillment of the requirements for the degree of Integrated EMI/Thermal Design forSwitching Power SuppliesWei Zhang(ABSTRACT)This work presents the modeling and analysis of EMI and thermal performancefor switch power supply by using the CAD tools. The methodology and design guidelinesare developed.By using a boost PFC circuit as an example, an equivalent circuit model is builtfor EMI noise prediction and analysis. The parasitic elements of circuit layout andcomponents are extracted analytically or by using CAD tools. Based on the model, circuitlayout and magnetic component design are modified to minimize circuit EMI. EMI filtercan be designed at an early stage without prototype implementation.In the second part, thermal analyses are conducted for the circuit by using thesoftware Flotherm, which includes the mechanism of conduction, convection andradiation. Thermal models are built for the components. Thermal performance of thecircuit and the temperature profile of components are predicted. Improved thermalmanagement and winding arrangement are investigated to reduce temperature.In the third part, several circuit layouts and inductor design examples are checkedfrom both the EMI and thermal point of view. Insightful information is obtained.
上传时间： 2013-11-10
上传用户：1595690
Abstract: Investment in smart meters and smart grid end equipment continues to grow worldwide as countriestry to make their electric delivery systems more efficient. However, as critical as the electric deliveryinfrastructure is, it is normally not secured and thus subject to attack. This article describes the concept oflife-cycle security—the idea that embedded equipment in the smart grid must have security designed into theentire life of the product, even back to the contract manufacturer. We also talk about how life-cycle securityapplies to embedded equipment in the smart grid. Potential threats are discussed, as are potential solutionsto mitigate the risks posed by those threats.
上传时间： 2014-12-24
上传用户：熊少锋
