The LTC®3207/LTC3207-1 is a 600mA LED/Camera driverwhich illuminates 12 Universal LEDs (ULEDs) and onecamera fl ash LED. The ULEDs are considered universalbecause they may be individually turned on or off, setin general purpose output (GPO) mode, set to blink at aselected on-time and period, or gradate on and off at aselected gradation rate. This device also has an externalenable (ENU) pin that may be used to blink, gradate, orturn on/off the LEDs without using the I2C bus. This may beuseful if the microprocessor is in sleep or standby mode. Ifused properly, these features may save valuable memoryspace, programming time, and reduce the I2C traffi c.
上传时间： 2014-01-04
上传用户：LANCE
The NXP LPC315x combine an 180 MHz ARM926EJ-S CPU core, High-speed USB 2.0OTG, 192 KB SRAM, NAND flash controller, flexible external bus interface, an integratedaudio codec, Li-ion charger, Real-Time Clock (RTC), and a myriad of serial and parallelinterfaces in a single chip targeted at consumer, industrial, medical, and communicationmarkets. To optimize system power consumption, the LPC315x have multiple powerdomains and a very flexible Clock Generation Unit (CGU) that provides dynamic clockgating and scaling.The LPC315x is implemented as multi-chip module with two side-by-side dies, one fordigital fuctions and one for analog functions, which include a Power Supply Unit (PSU),audio codec, RTC, and Li-ion battery charger.
上传时间： 2014-01-17
上传用户：Altman
解压密码：www.elecfans.com 随着微电子技术的迅速发展以及集成电路规模不断提高，对电路性能的设计 要求越来越严格，这势必对用于大规模集成电路设计的EDA 工具提出越来越高的 要求。自1972 年美国加利福尼亚大学柏克莱分校电机工程和计算机科学系开发 的用于集成电路性能分析的电路模拟程序SPICE（Simulation Program with IC Emphasis）诞生以来，为适应现代微电子工业的发展，各种用于集成电路设计的 电路模拟分析工具不断涌现。HSPICE 是Meta-Software 公司为集成电路设计中 的稳态分析，瞬态分析和频域分析等电路性能的模拟分析而开发的一个商业化通 用电路模拟程序，它在柏克莱的SPICE（1972 年推出），MicroSim公司的PSPICE （1984 年推出）以及其它电路分析软件的基础上，又加入了一些新的功能，经 过不断的改进，目前已被许多公司、大学和研究开发机构广泛应用。HSPICE 可 与许多主要的EDA 设计工具，诸如Candence,Workview 等兼容，能提供许多重要 的针对集成电路性能的电路仿真和设计结果。采用HSPICE 软件可以在直流到高 于100MHz 的微波频率范围内对电路作精确的仿真、分析和优化。在实际应用中， HSPICE能提供关键性的电路模拟和设计方案，并且应用HSPICE进行电路模拟时， 其电路规模仅取决于用户计算机的实际存储器容量。 The HSPICE Integrator Program enables qualified EDA vendors to integrate their products with the de facto standard HSPICE simulator, HSPICE RF simulator, and WaveView Analyzer™. In addition, qualified HSPICE Integrator Program members have access to HSPICE integrator application programming interfaces (APIs). Collaboration between HSPICE Integrator Program members will enable customers to achieve more thorough design verification in a shorter period of time from the improvements offered by inter-company EDA design solutions.
上传时间： 2013-11-10
上传用户：123312
ExpressPCB 是一款免费的PCB设计软件，简单实使。可以画双层板。 Our Free PCB software is a snap to learn and use. For the first time, designing circuit boards is simple for the beginner and efficient for the professional. Our board manufacturing service makes top quality two and four layer PCBs. Use our MiniBoard service and pay only $51 for three boards (plus $8 shipping).
标签： ExpressPCB PCB 设计软件
上传时间： 2013-11-15
上传用户：lchjng
ExpressPCB 是一款免费的PCB设计软件，简单实使。可以画双层板。 Our Free PCB software is a snap to learn and use. For the first time, designing circuit boards is simple for the beginner and efficient for the professional. Our board manufacturing service makes top quality two and four layer PCBs. Use our MiniBoard service and pay only $51 for three boards (plus $8 shipping).
标签： ExpressPCB PCB 设计软件
上传时间： 2013-10-09
上传用户：1047385479
This white paper discusses how market trends, the need for increased productivity, and new legislation have accelerated the use of safety systems in industrial machinery. This TÜV-qualified FPGA design methodology is changing the paradigms of safety designs and will greatly reduce development effort, system complexity, and time to market. This allows FPGA users to design their own customized safety controllers and provides a significant competitive advantage over traditional microcontroller or ASIC-based designs. Introduction The basic motivation of deploying functional safety systems is to ensure safe operation as well as safe behavior in cases of failure. Examples of functional safety systems include train brakes, proximity sensors for hazardous areas around machines such as fast-moving robots, and distributed control systems in process automation equipment such as those used in petrochemical plants. The International Electrotechnical Commission’s standard, IEC 61508: “Functional safety of electrical/electronic/programmable electronic safety-related systems,” is understood as the standard for designing safety systems for electrical, electronic, and programmable electronic (E/E/PE) equipment. This standard was developed in the mid-1980s and has been revised several times to cover the technical advances in various industries. In addition, derivative standards have been developed for specific markets and applications that prescribe the particular requirements on functional safety systems in these industry applications. Example applications include process automation (IEC 61511), machine automation (IEC 62061), transportation (railway EN 50128), medical (IEC 62304), automotive (ISO 26262), power generation, distribution, and transportation. 图Figure 1. Local Safety System
上传时间： 2013-11-14
上传用户：zoudejile
Nios II定制指令用户指南：With the Altera Nios II embedded processor, you as the system designer can accelerate time-critical software algorithms by adding custom instructions to the Nios II processor instruction set. Using custom instructions, you can reduce a complex sequence of standard instructions to a single instruction implemented in hardware. You can use this feature for a variety of applications, for example, to optimize software inner loops for digital signal processing (DSP), packet header processing, and computation-intensive applications. The Nios II configuration wizard,part of the Quartus® II software’s SOPC Builder, provides a graphical user interface (GUI) used to add up to 256 custom instructions to the Nios II processor. The custom instruction logic connects directly to the Nios II arithmetic logic unit (ALU) as shown in Figure 1–1.
上传时间： 2013-10-12
上传用户：kang1923
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
上传时间： 2013-11-21
上传用户：不懂夜的黑
本文详细介绍了有关FPGA的开发流程，对初学者会有很大的指导作用。
上传时间： 2013-11-12
上传用户：lps11188
In the past decade, the size and complexity of manyFPGA designs exceeds the time and resourcesavailable to most design teams, making the use andreuse of Intellectual Property (IP) imperative.However, integrating numerous IP blocks acquiredfrom both internal and external sources can be adaunting challenge that often extends, rather thanshortens, design time. As today's designs integrateincreasing amounts of functionality, it is vital thatdesigners have access to proven, up-to-date IP fromreliable sources.
上传时间： 2013-11-11
上传用户：csgcd001
