虫虫首页| 资源下载| 资源专辑| 精品软件
登录| 注册

As-IPC

  • 开关电源EMI设计(英文版)

    Integrated EMI/Thermal Design forSwitching Power SuppliesWei ZhangThesis submitted to the Faculty of theVirginia Polytechnic Institute and State Universityin partial fulfillment of the requirements for the degree of Integrated EMI/Thermal Design forSwitching Power SuppliesWei Zhang(ABSTRACT)This work presents the modeling and analysis of EMI and thermal performancefor switch power supply by using the CAD tools. The methodology and design guidelinesare developed.By using a boost PFC circuit as an example, an equivalent circuit model is builtfor EMI noise prediction and analysis. The parasitic elements of circuit layout andcomponents are extracted analytically or by using CAD tools. Based on the model, circuitlayout and magnetic component design are modified to minimize circuit EMI. EMI filtercan be designed at an early stage without prototype implementation.In the second part, thermal analyses are conducted for the circuit by using thesoftware Flotherm, which includes the mechanism of conduction, convection andradiation. Thermal models are built for the components. Thermal performance of thecircuit and the temperature profile of components are predicted. Improved thermalmanagement and winding arrangement are investigated to reduce temperature.In the third part, several circuit layouts and inductor design examples are checkedfrom both the EMI and thermal point of view. Insightful information is obtained.

    标签: EMI 开关电源 英文

    上传时间: 2013-11-16

    上传用户:萍水相逢

  • pci e PCB设计规范

    This document provides practical, common guidelines for incorporating PCI Express interconnect layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10- layer or more server baseboard designs. Guidelines and constraints in this document are intended for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI Express devices located on the same baseboard (chip-to-chip routing) and interconnects between a PCI Express device located “down” on the baseboard and a device located “up” on an add-in card attached through a connector. This document is intended to cover all major components of the physical interconnect including design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card edge-finger and connector considerations. The intent of the guidelines and examples is to help ensure that good high-speed signal design practices are used and that the timing/jitter and loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect. However, while general physical guidelines and suggestions are given, they may not necessarily guarantee adequate performance of the interconnect for all layouts and implementations. Therefore, designers should consider modeling and simulation of the interconnect in order to ensure compliance to all applicable specifications. The document is composed of two main sections. The first section provides an overview of general topology and interconnect guidelines. The second section concentrates on physical layout constraints where bulleted items at the beginning of a topic highlight important constraints, while the narrative that follows offers additional insight.  

    标签: pci PCB 设计规范

    上传时间: 2014-01-24

    上传用户:s363994250

  • 8259 VHDL代码

    a8259 可编程中断控制 altera提供 The a8259 is designed to simplify the implementation of the interrupt interface  in 8088 and 8086  based microcomputer systems. The device is known as a programmable interrupt controller.  The a8259 receives and prioritizes up to 8 interrupts,  and in the cascade mode, this can be expanded up to  64 interrupts. An asynchronous reset and a clock input have been added to improve operation and reliability.

    标签: 8259 VHDL 代码

    上传时间: 2015-01-02

    上传用户:panpanpan

  • 赛灵思电机控制开发套件简介(英文版)

      The power of programmability gives industrial automation designers a highly efficient, cost-effective alternative to traditional motor control units (MCUs)。 The parallel-processing power, fast computational speeds, and connectivity versatility of Xilinx® FPGAs can accelerate the implementation of advanced motor control algorithms such as Field Oriented Control (FOC)。   Additionally, Xilinx devices lower costs with greater on-chip integration of system components and shorten latencies with high-performance digital signal processing (DSP) that can tackle compute-intensive functions such as PID Controller, Clark/Park transforms, and Space Vector PWM.   The Xilinx Spartan®-6 FPGA Motor Control Development Kit gives designers an ideal starting point for evaluating time-saving, proven, motor-control reference designs. The kit also shortens the process of developing custom control capabilities, with integrated peripheral functions (Ethernet, PowerLink, and PCI® Express), a motor-control FPGA mezzanine card (FMC) with built-in Texas Instruments motor drivers and high-precision Delta-Sigma modulators, and prototyping support for evaluating alternative front-end circuitry.

    标签: 赛灵思 电机控制 开发套件 英文

    上传时间: 2013-10-28

    上传用户:wujijunshi

  • xilinx FPGAs在工业中的应用

      The revolution of automation on factory floors is a key driver for the seemingly insatiable demand for higher productivity, lower total cost of ownership,and high safety. As a result, industrial applications drive an insatiable demand of higher data bandwidth and higher system-level performance.   This white paper describes the trends and challenges seen by designers and how FPGAs enable solutions to meet their stringent design goals.

    标签: xilinx FPGAs 工业 中的应用

    上传时间: 2013-11-08

    上传用户:yan2267246

  • 工业系统安全问题和解决办法

    Abstract: As industrial control systems (ICSs) have become increasingly connected and use more off-the-shelfcomponents, new vulnerabilities to cyber attacks have emerged. This tutorial looks at three types of ICSs:programmable logic controllers (PLCs), supervisory control and data acquisition (SCADA) systems, anddistributed control systems (DCSs), and then discusses security issues and remedies. This document alsoexplains the benefits and limitations of two cryptographic solutions (digital signatures and encryption) andelaborates on the reasons for using security ICs in an ICS to support cryptography.

    标签: 工业系统 安全问题

    上传时间: 2013-10-09

    上传用户:woshinimiaoye

  • HDMI一致性测试

      The high defi nition multimedia interface (HDMI) is fastbecoming the de facto standard for passing digitalaudio and video data in home entertainment systems.This standard includes an I2C type bus called a displaydata channel (DDC) that is used to pass extended digitalinterface data (EDID) from the sinkdevice (such as adigital TV) to the source device (such as a digital A/Vreceiver). EDID includes vital information on the digitaldata formats that the sink device can accept. The HDMIspecifi cation requires that devices have less than 50pFof input capacitance on their DDC bus lines, which canbe very diffi cult to meet. The LTC®4300A’s capacitancebuffering feature allows devices to pass the HDMI DDCinput capacitance compliance test with ease.

    标签: HDMI 测试

    上传时间: 2013-11-21

    上传用户:tian126vip

  • DN427开关控制器故障保护电压监测

      Have you had the exasperating experience of a laptop orPDA defi antly not responding to your commands? Youfrantically press key after key, but to no avail. As hopeturns to anger (but just before you throw the company’slaptop through the window) you slam your fi nger againstthe on/off power button. Ten seconds later, your laptopfi nally surrenders and the screen goes black in a highpitched whimper.

    标签: 427 DN 开关控制器 故障保护

    上传时间: 2013-12-10

    上传用户:Vici

  • IPC-9701A表面贴装锡焊件性能测试与鉴定

    此规范建立了专用的测试方法,用于评估电子组装件表面贴装焊接件的性能及可靠性。对应于刚性电路结构、挠性电路结构和半刚性电路结构,表面贴装焊接件的性能和可靠性被进一步划分为不同等级。此外,还提供了一种相似方法,可以在电子组装件的使用环境与条件下将这些性能测试结果与焊接件可靠性关联起来.

    标签: 9701 IPC 表面贴装 性能测试

    上传时间: 2013-11-10

    上传用户:ppeyou

  • LT5514三阶互调的精确测量

      Accurate measurement of the third order intercept pointfor low distortion IC products such as the LT5514 requirescertain precautions to be observed in the test setup andtesting procedure. The LT5514 linearity performance ishigh enough to push the test equipment and test set-up totheir limits. A method for accurate measurement of thirdorder intermodulation products, IM3, with standard testequipment is outlined below.It is also important to correctly interpret the LT5514specification with respect to ROUT, and the impact ofdemo-board transmission-line termination loss whenevaluating the linearity performance, as explained in theLT5514 Datasheet and in Note 1 of this document.

    标签: 5514 LT 三阶互调 精确测量

    上传时间: 2013-11-14

    上传用户:l254587896