提出一种高频时钟电路的设计方案。利用一款先进的可编程时钟合成器MPC92433，基于FPGA的控制，实现4对LVDS信号输出。系统经过测试，输出时钟信号频率达到1 GHz，可以广泛应用到各种数字电路设计中。
上传时间： 2013-10-18
上传用户：123456wh
第一部分 信号完整性知识基础.................................................................................5第一章 高速数字电路概述.....................................................................................51.1 何为高速电路...............................................................................................51.2 高速带来的问题及设计流程剖析...............................................................61.3 相关的一些基本概念...................................................................................8第二章 传输线理论...............................................................................................122.1 分布式系统和集总电路.............................................................................122.2 传输线的RLCG 模型和电报方程...............................................................132.3 传输线的特征阻抗.....................................................................................142.3.1 特性阻抗的本质.................................................................................142.3.2 特征阻抗相关计算.............................................................................152.3.3 特性阻抗对信号完整性的影响.........................................................172.4 传输线电报方程及推导.............................................................................182.5 趋肤效应和集束效应.................................................................................232.6 信号的反射.................................................................................................252.6.1 反射机理和电报方程.........................................................................252.6.2 反射导致信号的失真问题.................................................................302.6.2.1 过冲和下冲.....................................................................................302.6.2.2 振荡：.............................................................................................312.6.3 反射的抑制和匹配.............................................................................342.6.3.1 串行匹配.........................................................................................352.6.3.1 并行匹配.........................................................................................362.6.3.3 差分线的匹配.................................................................................392.6.3.4 多负载的匹配.................................................................................41第三章 串扰的分析...............................................................................................423.1 串扰的基本概念.........................................................................................423.2 前向串扰和后向串扰.................................................................................433.3 后向串扰的反射.........................................................................................463.4 后向串扰的饱和.........................................................................................463.5 共模和差模电流对串扰的影响.................................................................483.6 连接器的串扰问题.....................................................................................513.7 串扰的具体计算.........................................................................................543.8 避免串扰的措施.........................................................................................57第四章 EMI 抑制....................................................................................................604.1 EMI/EMC 的基本概念..................................................................................604.2 EMI 的产生..................................................................................................614.2.1 电压瞬变.............................................................................................614.2.2 信号的回流.........................................................................................624.2.3 共模和差摸EMI ..................................................................................634.3 EMI 的控制..................................................................................................654.3.1 屏蔽.....................................................................................................654.3.1.1 电场屏蔽.........................................................................................654.3.1.2 磁场屏蔽.........................................................................................674.3.1.3 电磁场屏蔽.....................................................................................674.3.1.4 电磁屏蔽体和屏蔽效率.................................................................684.3.2 滤波.....................................................................................................714.3.2.1 去耦电容.........................................................................................714.3.2.3 磁性元件.........................................................................................734.3.3 接地.....................................................................................................744.4 PCB 设计中的EMI.......................................................................................754.4.1 传输线RLC 参数和EMI ........................................................................764.4.2 叠层设计抑制EMI ..............................................................................774.4.3 电容和接地过孔对回流的作用.........................................................784.4.4 布局和走线规则.................................................................................79第五章 电源完整性理论基础...............................................................................825.1 电源噪声的起因及危害.............................................................................825.2 电源阻抗设计.............................................................................................855.3 同步开关噪声分析.....................................................................................875.3.1 芯片内部开关噪声.............................................................................885.3.2 芯片外部开关噪声.............................................................................895.3.3 等效电感衡量SSN ..............................................................................905.4 旁路电容的特性和应用.............................................................................925.4.1 电容的频率特性.................................................................................935.4.3 电容的介质和封装影响.....................................................................955.4.3 电容并联特性及反谐振.....................................................................955.4.4 如何选择电容.....................................................................................975.4.5 电容的摆放及Layout ........................................................................99第六章 系统时序.................................................................................................1006.1 普通时序系统...........................................................................................1006.1.1 时序参数的确定...............................................................................1016.1.2 时序约束条件...................................................................................1063.2 高速设计的问题.......................................................................................2093.3 SPECCTRAQuest SI Expert 的组件.......................................................2103.3.1 SPECCTRAQuest Model Integrity .................................................2103.3.2 SPECCTRAQuest Floorplanner/Editor .........................................2153.3.3 Constraint Manager .......................................................................2163.3.4 SigXplorer Expert Topology Development Environment .......2233.3.5 SigNoise 仿真子系统......................................................................2253.3.6 EMControl .........................................................................................2303.3.7 SPECCTRA Expert 自动布线器.......................................................2303.4 高速设计的大致流程...............................................................................2303.4.1 拓扑结构的探索...............................................................................2313.4.2 空间解决方案的探索.......................................................................2313.4.3 使用拓扑模板驱动设计...................................................................2313.4.4 时序驱动布局...................................................................................2323.4.5 以约束条件驱动设计.......................................................................2323.4.6 设计后分析.......................................................................................233第四章 SPECCTRAQUEST SIGNAL EXPLORER 的进阶运用..........................................2344.1 SPECCTRAQuest Signal Explorer 的功能包括：................................2344.2 图形化的拓扑结构探索...........................................................................2344.3 全面的信号完整性(Signal Integrity)分析.......................................2344.4 完全兼容 IBIS 模型...............................................................................2344.5 PCB 设计前和设计的拓扑结构提取.......................................................2354.6 仿真设置顾问...........................................................................................2354.7 改变设计的管理.......................................................................................2354.8 关键技术特点...........................................................................................2364.8.1 拓扑结构探索...................................................................................2364.8.2 SigWave 波形显示器........................................................................2364.8.3 集成化的在线分析(Integration and In-process Analysis) .236第五章 部分特殊的运用...............................................................................2375.1 Script 指令的使用..................................................................................2375.2 差分信号的仿真.......................................................................................2435.3 眼图模式的使用.......................................................................................249第四部分：HYPERLYNX 仿真工具使用指南............................................................251第一章 使用LINESIM 进行前仿真.......................................................................2511.1 用LineSim 进行仿真工作的基本方法...................................................2511.2 处理信号完整性原理图的具体问题.......................................................2591.3 在LineSim 中如何对传输线进行设置...................................................2601.4 在LineSim 中模拟IC 元件.....................................................................2631.5 在LineSim 中进行串扰仿真...................................................................268第二章 使用BOARDSIM 进行后仿真......................................................................2732.1 用BOARDSIM 进行后仿真工作的基本方法...................................................2732.2 BoardSim 的进一步介绍..........................................................................2922.3 BoardSim 中的串扰仿真..........................................................................309
上传时间： 2014-04-18
上传用户：wpt
!方波信号是数字电路中非常重要的信号源!其产生方法有很多途径"本设计是基于MPLAB平台通过对方波信号发生器的电路分析!介绍了方波信号的产生原理和软件实现过程!并利用’:.单片机的定时器#计数器技术对PIC16F877A进行编程$通过对TMRO模块进行设置!使其分频比改变!产生V种不同频率的方波信号!同时改变初始值!产生任意频率的方波信号"
上传时间： 2013-10-23
上传用户：c12228
在单片机应用系统中，有时需要采集大量的开关信号，由于信号多且接入方式不同，使得电路较复杂，占用了单片机大量资源，数据采集软件的开发量也较大。笔者用纯数字电路设计了一个特别适合于远程大数据量采集的电路（最大可采集１０２４个开关量，附图所示电路可采集１９２个开关量）。 电路由双二进制加法计数器ＣＤ４５２０、译码器７４ＬＳ１３８、缓冲驱动器７４ＬＳ２４４等组成。ＮＥ５５５产生的脉冲加到计数器Ｄ１的ＣＰ１端，由于Ｄ１的Ｑ４同时也接Ｄ１的ＥＮ２，所以Ｄ１的双计数器构成级联计数电路，其输出Ｑ２～Ｑ７作为开关输入量的地址送Ｄ５的输入端。Ｑ１作为片选信号接Ｄ５，Ｑ５～Ｑ７接Ｄ２输入端，为Ｄ３、Ｄ４等译码器提供片选信号，而Ｑ２～Ｑ４接Ｄ３、Ｄ４等译码器的输入端，译码器的输出作为Ｄ７、Ｄ８等的片选信号。Ｄ７、Ｄ８等的输入接采样的开关信号（图中开关接通表示输入为低位），其输出接Ｄ６输入端。当Ｄ６片选有效时（Ｑ１为低电位），输出的数据地址线上为开关量信号。当Ｄ５片选有效时（Ｑ１为高电位）输出的数据地址线上为开关量信号的地址。８条数据地址线可直接接单片机Ｐ１口或通过７４ＬＳ２４５接单片机总线，１条数据地址选择线也可直接接单片机Ｐ２或Ｐ３口。
上传时间： 2013-10-14
上传用户：tonyshao
摘 要:简要介绍了图像边缘检测的基本概念,针对其硬件实现的基本模型进行探讨;分析其关键算术单元,采用了多种优化措施并引入了流水线的设计方法以满足高速应用的要求;提出了3种不同的FIR滤波器实现结构;最终完成FPGA和ASIC设计,对不同结构的实现数据进行比较并给出了结论,实现结果表明该设计可以满足高速系统应用场合。关键词:边缘检测;FIR滤波器;流水线设计;超前进位加法;FPGA
上传时间： 2014-12-27
上传用户：xingisme
数字密码锁设计:本文的电子密码锁利用数字逻辑电路，实现对门的电子控制，并且有各种附加电路保证电路能够安 工作，有极高的安全系数。 关键词 电子密码锁 电压比较器 555单稳态电路 计数器 JK触发器 UPS电源。 1 引言 随着人们生活水平的提高，如何实现家庭防盗这一问题也变的尤其的突出，传统的机械锁由于其构造的简单，被撬的事件屡见不鲜，电子锁由于其保密性高，使用灵活性好，安全系数高，受到了广大用户的亲呢。 设计本课题时构思了两种方案：一种是用以AT89C2051为核心的单片机控制方案；另一种是用以74LS112双JK触发器构成的数字逻辑电路控制方案。考虑到单片机方案原理复杂，而且调试较为繁琐，所以本文采用后一种方案。 2 总体方案设计 2.1设计思路 共设了9个用户输入键，其中只有4个是有效的密码按键，其它的都是干扰按键，若按下干扰键，键盘输入电路自动清零，原先输入的密码无效，需要重新输入；如果用户输入密码的时间超过40秒（一般情况下，用户不会超过40秒，若用户觉得不便，还可以修改）电路将报警80秒，若电路连续报警三次，电路将锁定键盘5分钟，防止他人的非法操作。
上传时间： 2013-11-13
上传用户：ligi201200
quartus ii 数字钟设计 东南大学大二电路实验验收资料
上传时间： 2013-10-14
上传用户：diets
quartus ii 数字钟设计 东南大学大二电路实验验收资料
上传时间： 2013-10-20
上传用户：dengzb84
第一部分 信号完整性知识基础.................................................................................5第一章 高速数字电路概述.....................................................................................51.1 何为高速电路...............................................................................................51.2 高速带来的问题及设计流程剖析...............................................................61.3 相关的一些基本概念...................................................................................8第二章 传输线理论...............................................................................................122.1 分布式系统和集总电路.............................................................................122.2 传输线的RLCG 模型和电报方程...............................................................132.3 传输线的特征阻抗.....................................................................................142.3.1 特性阻抗的本质.................................................................................142.3.2 特征阻抗相关计算.............................................................................152.3.3 特性阻抗对信号完整性的影响.........................................................172.4 传输线电报方程及推导.............................................................................182.5 趋肤效应和集束效应.................................................................................232.6 信号的反射.................................................................................................252.6.1 反射机理和电报方程.........................................................................252.6.2 反射导致信号的失真问题.................................................................302.6.2.1 过冲和下冲.....................................................................................302.6.2.2 振荡：.............................................................................................312.6.3 反射的抑制和匹配.............................................................................342.6.3.1 串行匹配.........................................................................................352.6.3.1 并行匹配.........................................................................................362.6.3.3 差分线的匹配.................................................................................392.6.3.4 多负载的匹配.................................................................................41第三章 串扰的分析...............................................................................................423.1 串扰的基本概念.........................................................................................423.2 前向串扰和后向串扰.................................................................................433.3 后向串扰的反射.........................................................................................463.4 后向串扰的饱和.........................................................................................463.5 共模和差模电流对串扰的影响.................................................................483.6 连接器的串扰问题.....................................................................................513.7 串扰的具体计算.........................................................................................543.8 避免串扰的措施.........................................................................................57第四章 EMI 抑制....................................................................................................604.1 EMI/EMC 的基本概念..................................................................................604.2 EMI 的产生..................................................................................................614.2.1 电压瞬变.............................................................................................614.2.2 信号的回流.........................................................................................624.2.3 共模和差摸EMI ..................................................................................634.3 EMI 的控制..................................................................................................654.3.1 屏蔽.....................................................................................................654.3.1.1 电场屏蔽.........................................................................................654.3.1.2 磁场屏蔽.........................................................................................674.3.1.3 电磁场屏蔽.....................................................................................674.3.1.4 电磁屏蔽体和屏蔽效率.................................................................684.3.2 滤波.....................................................................................................714.3.2.1 去耦电容.........................................................................................714.3.2.3 磁性元件.........................................................................................734.3.3 接地.....................................................................................................744.4 PCB 设计中的EMI.......................................................................................754.4.1 传输线RLC 参数和EMI ........................................................................764.4.2 叠层设计抑制EMI ..............................................................................774.4.3 电容和接地过孔对回流的作用.........................................................784.4.4 布局和走线规则.................................................................................79第五章 电源完整性理论基础...............................................................................825.1 电源噪声的起因及危害.............................................................................825.2 电源阻抗设计.............................................................................................855.3 同步开关噪声分析.....................................................................................875.3.1 芯片内部开关噪声.............................................................................885.3.2 芯片外部开关噪声.............................................................................895.3.3 等效电感衡量SSN ..............................................................................905.4 旁路电容的特性和应用.............................................................................925.4.1 电容的频率特性.................................................................................935.4.3 电容的介质和封装影响.....................................................................955.4.3 电容并联特性及反谐振.....................................................................955.4.4 如何选择电容.....................................................................................975.4.5 电容的摆放及Layout ........................................................................99第六章 系统时序.................................................................................................1006.1 普通时序系统...........................................................................................1006.1.1 时序参数的确定...............................................................................1016.1.2 时序约束条件...................................................................................1063.2 高速设计的问题.......................................................................................2093.3 SPECCTRAQuest SI Expert 的组件.......................................................2103.3.1 SPECCTRAQuest Model Integrity .................................................2103.3.2 SPECCTRAQuest Floorplanner/Editor .........................................2153.3.3 Constraint Manager .......................................................................2163.3.4 SigXplorer Expert Topology Development Environment .......2233.3.5 SigNoise 仿真子系统......................................................................2253.3.6 EMControl .........................................................................................2303.3.7 SPECCTRA Expert 自动布线器.......................................................2303.4 高速设计的大致流程...............................................................................2303.4.1 拓扑结构的探索...............................................................................2313.4.2 空间解决方案的探索.......................................................................2313.4.3 使用拓扑模板驱动设计...................................................................2313.4.4 时序驱动布局...................................................................................2323.4.5 以约束条件驱动设计.......................................................................2323.4.6 设计后分析.......................................................................................233第四章 SPECCTRAQUEST SIGNAL EXPLORER 的进阶运用..........................................2344.1 SPECCTRAQuest Signal Explorer 的功能包括：................................2344.2 图形化的拓扑结构探索...........................................................................2344.3 全面的信号完整性(Signal Integrity)分析.......................................2344.4 完全兼容 IBIS 模型...............................................................................2344.5 PCB 设计前和设计的拓扑结构提取.......................................................2354.6 仿真设置顾问...........................................................................................2354.7 改变设计的管理.......................................................................................2354.8 关键技术特点...........................................................................................2364.8.1 拓扑结构探索...................................................................................2364.8.2 SigWave 波形显示器........................................................................2364.8.3 集成化的在线分析(Integration and In-process Analysis) .236第五章 部分特殊的运用...............................................................................2375.1 Script 指令的使用..................................................................................2375.2 差分信号的仿真.......................................................................................2435.3 眼图模式的使用.......................................................................................249第四部分：HYPERLYNX 仿真工具使用指南............................................................251第一章 使用LINESIM 进行前仿真.......................................................................2511.1 用LineSim 进行仿真工作的基本方法...................................................2511.2 处理信号完整性原理图的具体问题.......................................................2591.3 在LineSim 中如何对传输线进行设置...................................................2601.4 在LineSim 中模拟IC 元件.....................................................................2631.5 在LineSim 中进行串扰仿真...................................................................268第二章 使用BOARDSIM 进行后仿真......................................................................2732.1 用BOARDSIM 进行后仿真工作的基本方法...................................................2732.2 BoardSim 的进一步介绍..........................................................................2922.3 BoardSim 中的串扰仿真..........................................................................309
上传时间： 2013-11-07
上传用户：aa7821634
此频率计是用单片机89C51和几块数字电路几个三极管，和一个微波集成电路构成。可测量频率最高为2G！分辨力为1HZ！电路中R16---R27电阻阻值为1K。这文件包里有两符制作成功后的图片！ 二个SCH。一个PCB文件。一个PDF文件。和一个程序HEX文件。制作的时候只要按线路板接好元件，然后把程序HEX文件烧写到单片机内，就可以调试了，希望大家成功。其中高稳定振荡电路SCH文件是我新加上的。如果大家有条件用上这电路也不错。那样频率计将更稳定。频率计的PCB是我设计的。 设计得不太好，希望大家多多提出意见和建议。希望大家不要修改PCB文件。 注：解压密码deyiluntan
上传时间： 2014-01-11
上传用户：libinxny
