1.5mm间距接插件ZH1.5表贴直插 Altium PCB封装库2D3D元件库（3D视图库），共60个器件封装，型号如下：ZH1.5-LI-2pZH1.5-LI-3PZH1.5-LI-4PZH1.5-LI-5PZH1.5-LI-6PZH1.5-LI-7PZH1.5-LI-8PZH1.5-LI-9PZH1.5-LI-10PZH1.5-LI-11PZH1.5-LI-12pZH1.5-LI-13PZH1.5-LI-14PZH1.5-LI-15PZH1.5-LI-16PZH1.5-LS-2PZH1.5-LS-3PZH1.5-LS-4PZH1.5-LS-5PZH1.5-LS-6PZH1.5-LS-7PZH1.5-LS-8PZH1.5-LS-9PZH1.5-LS-10PZH1.5-LS-11PZH1.5-LS-12PZH1.5-LS-13pZH1.5-LS-14pZH1.5-LS-15PZH1.5-LS-16PZH1.5-WI-2PZH1.5-WI-3PZH1.5-WI-4PZH1.5-WI-5PZH1.5-WI-6PZH1.5-WI-7PZH1.5-WI-8PZH1.5-WI-9PZH1.5-WI-10PZH1.5-WI-11PZH1.5-WI-12PZH1.5-WI-13PZH1.5-WI-14PZH1.5-WI-15PZH1.5-WI-16PZH1.5-WS-2PZH1.5-WS-3PZH1.5-WS-4PZH1.5-WS-5PZH1.5-WS-6PZH1.5-WS-7PZH1.5-WS-8PZH1.5-WS-9PZH1.5-WS-10PZH1.5-WS-11PZH1.5-WS-12PZH1.5-WS-13PZH1.5-WS-14PZH1.5-WS-15PZH1.5-WS-16P
上传时间： 2021-11-21
上传用户：XuVshu
DB9 DB15 DB25 DB37 DB50 Altium AD元件库 PCB封装库,90个器件封装，可以直接用于你的项目设计。PCB Library : DB9~50封装 .PcbLibComponent Count : 90DB9DB9 公 90°DB9/MDB9/MADB9/MSDB9/P_ADB9/S_ADB9SLWDB15FLWDB15FSDB15FSWDB15HDPFVDB25/MDB25BSMDB25FLDB25FLEDB25FLWDB25FSDB25FSWDB25RA/FDB25RA/MDB25SLDB25SLEDB37FLDB37FLEDB37FLWDB37FSDB37FSWDB37RA/FDB37RA/MDB37SLDB37SLEDB37SLWDB37SSDB37SSMDB37SSWDB50FLDB50FLEDB50FLW
标签： AD元件库
上传时间： 2022-04-17
上传用户：kingwide
都是原理图库还用得着说明吗？不就是个说明吗！不用这么多的文字吧，不是程序也这样啊！
上传时间： 2013-07-14
上传用户：yare
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
上传时间： 2013-10-22
上传用户：ztj182002
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
上传时间： 2013-11-21
上传用户：不懂夜的黑
这不是源码，这是Protel99SE版本的 通用器件封装库，很多朋友在寻找
标签： 源码
上传时间： 2015-06-29
上传用户：电子世界
雷达高频接收机，通道板硬件原理图，PCB图以及器件封装库，开放工具为protel99se，密码111111。
上传时间： 2014-01-16
上传用户：Breathe0125
s3c2410开发板的pcb底板。pcb电路图，器件封装
上传时间： 2015-12-06
上传用户：牧羊人8920
恩智浦半导体选型，参数描述。主要包括：分立器件封装尺寸等。
上传时间： 2016-06-15
上传用户：ybdnj
10层电路板，完整的C6414+FPGA的PROTEL99工程，PCB和原理图，器件封装库。
上传时间： 2016-11-13
上传用户：小盖子1980
