中文版详情浏览：http://www.elecfans.com/emb/fpga/20130715324029.html Xilinx UltraScale:The Next-Generation Architecture for Your Next-Generation Architecture The Xilinx® UltraScale™ architecture delivers unprecedented levels of integration and capability with ASIC-class system- level performance for the most demanding applications. The UltraScale architecture is the industr y's f irst application of leading-edge ASIC architectural enhancements in an All Programmable architecture that scales from 20 nm planar through 16 nm FinFET technologies and beyond, in addition to scaling from monolithic through 3D ICs. Through analytical co-optimization with the X ilinx V ivado® Design Suite, the UltraScale architecture provides massive routing capacity while intelligently resolving typical bottlenecks in ways never before possible. This design synergy achieves greater than 90% utilization with no performance degradation. Some of the UltraScale architecture breakthroughs include: • Strategic placement (virtually anywhere on the die) of ASIC-like system clocks, reducing clock skew by up to 50% • Latency-producing pipelining is virtually unnecessary in systems with massively parallel bus architecture, increasing system speed and capability • Potential timing-closure problems and interconnect bottlenecks are eliminated, even in systems requiring 90% or more resource utilization • 3D IC integration makes it possible to build larger devices one process generation ahead of the current industr y standard • Greatly increased system performance, including multi-gigabit serial transceivers, I/O, and memor y bandwidth is available within even smaller system power budgets • Greatly enhanced DSP and packet handling The Xilinx UltraScale architecture opens up whole new dimensions for designers of ultra-high-capacity solutions.
标签： UltraScale Xilinx 架构
上传时间： 2013-11-21
上传用户：wxqman
Abstract: Using a wafer-level package (WLP) can reduce the overall size and cost of your solution.However when using a WLP IC, the printed circuit board (PCB) layout can become more complex and, ifnot carefully planned, result in an unreliable design. This article presents some PCB designconsiderations and general recommendations for choosing a 0.4mm- or 0.5mm-pitch WLP for yourapplication.
标签： Considerations Guidelines and Design
上传时间： 2013-11-09
上传用户：ls530720646
使用Nios II软件构建工具 This chapter describes the Nios® II Software Build Tools (SBT), a set of utilities and scripts that creates and builds embedded C/C++ application projects, user library projects, and board support packages (BSPs). The Nios II SBT supports a repeatable, scriptable, and archivable process for creating your software product. You can invoke the Nios II SBT through either of the following user interfaces: ■ The Eclipse™ GUI ■ The Nios II Command Shell The purpose of this chapter is to make you familiar with the internal functionality of the Nios II SBT, independent of the user interface employed.
上传时间： 2013-10-12
上传用户：china97wan
Nios II定制指令用户指南：With the Altera Nios II embedded processor, you as the system designer can accelerate time-critical software algorithms by adding custom instructions to the Nios II processor instruction set. Using custom instructions, you can reduce a complex sequence of standard instructions to a single instruction implemented in hardware. You can use this feature for a variety of applications, for example, to optimize software inner loops for digital signal processing (DSP), packet header processing, and computation-intensive applications. The Nios II configuration wizard,part of the Quartus® II software’s SOPC Builder, provides a graphical user interface (GUI) used to add up to 256 custom instructions to the Nios II processor. The custom instruction logic connects directly to the Nios II arithmetic logic unit (ALU) as shown in Figure 1–1.
上传时间： 2013-10-12
上传用户：kang1923
Nios II 系列处理器配置选项:This chapter describes the Nios® II Processor parameter editor in Qsys and SOPC Builder. The Nios II Processor parameter editor allows you to specify the processor features for a particular Nios II hardware system. This chapter covers the features of the Nios II processor that you can configure with the Nios II Processor parameter editor; it is not a user guide for creating complete Nios II processor systems.
上传时间： 2015-01-01
上传用户：mahone
Verilog_HDL的基本语法详解（夏宇闻版）:Verilog HDL是一种用于数字逻辑电路设计的语言。用Verilog HDL描述的电路设计就是该电路的Verilog HDL模型。Verilog HDL既是一种行为描述的语言也是一种结构描述的语言。这也就是说，既可以用电路的功能描述也可以用元器件和它们之间的连接来建立所设计电路的Verilog HDL模型。Verilog模型可以是实际电路的不同级别的抽象。这些抽象的级别和它们对应的模型类型共有以下五种： 系统级（system）：用高级语言结构实现设计模块的外部性能的模型。 算法级（algorithm）：用高级语言结构实现设计算法的模型。 RTL级（Register Transfer Level）：描述数据在寄存器之间流动和如何处理这些数据的模型。 门级（gate-level）：描述逻辑门以及逻辑门之间的连接的模型。 开关级（switch-level）：描述器件中三极管和储存节点以及它们之间连接的模型。 一个复杂电路系统的完整Verilog HDL模型是由若干个Verilog HDL模块构成的，每一个模块又可以由若干个子模块构成。其中有些模块需要综合成具体电路，而有些模块只是与用户所设计的模块交互的现存电路或激励信号源。利用Verilog HDL语言结构所提供的这种功能就可以构造一个模块间的清晰层次结构来描述极其复杂的大型设计，并对所作设计的逻辑电路进行严格的验证。 Verilog HDL行为描述语言作为一种结构化和过程性的语言，其语法结构非常适合于算法级和RTL级的模型设计。这种行为描述语言具有以下功能： · 可描述顺序执行或并行执行的程序结构。 · 用延迟表达式或事件表达式来明确地控制过程的启动时间。 · 通过命名的事件来触发其它过程里的激活行为或停止行为。 · 提供了条件、if-else、case、循环程序结构。 · 提供了可带参数且非零延续时间的任务（task）程序结构。 · 提供了可定义新的操作符的函数结构（function）。 · 提供了用于建立表达式的算术运算符、逻辑运算符、位运算符。 · Verilog HDL语言作为一种结构化的语言也非常适合于门级和开关级的模型设计。因其结构化的特点又使它具有以下功能： - 提供了完整的一套组合型原语（primitive）; - 提供了双向通路和电阻器件的原语; - 可建立MOS器件的电荷分享和电荷衰减动态模型。 Verilog HDL的构造性语句可以精确地建立信号的模型。这是因为在Verilog HDL中，提供了延迟和输出强度的原语来建立精确程度很高的信号模型。信号值可以有不同的的强度，可以通过设定宽范围的模糊值来降低不确定条件的影响。 Verilog HDL作为一种高级的硬件描述编程语言，有着类似C语言的风格。其中有许多语句如：if语句、case语句等和C语言中的对应语句十分相似。如果读者已经掌握C语言编程的基础，那么学习Verilog HDL并不困难，我们只要对Verilog HDL某些语句的特殊方面着重理解，并加强上机练习就能很好地掌握它，利用它的强大功能来设计复杂的数字逻辑电路。下面我们将对Verilog HDL中的基本语法逐一加以介绍。
标签： Verilog_HDL
上传时间： 2014-12-04
上传用户：cppersonal
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
上传时间： 2013-11-21
上传用户：不懂夜的黑
This application note describes how to retrieve user-defined data from Xilinx configurationPROMs (XC18V00 and Platform Flash devices) after the same PROM has configured theFPGA. The method to add user-defined data to the configuration PROM file is also discussed.The reference design described in this application note can be used in any of the followingXilinx FPGA architectures: Spartan™-II, Spartan-IIE, Spartan-3, Virtex™, Virtex-E, Virtex-II,and Virtex-II Pro.
上传时间： 2013-10-09
上传用户：guojin_0704
This application note provides a detailed description of the Spartan™-3 configurationarchitecture. It explains the composition of the bitstream file and how this bitstream isinterpreted by the configuration logic to program the part. Additionally, a methodology ispresented that will guide the user through the readback process. This information can be usedfor partial reconfiguration or partial readback.
上传时间： 2013-11-16
上传用户：qingdou
Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the developmentof designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit theDocumentation in any form or by any means including, but not limited to, electronic, mechanical, photocopying, recording, or otherwise,without the prior written consent of Xilinx. Xilinx expressly disclaims any liability arising out of your use of the Documentation. Xilinx reservesthe right, at its sole discretion, to change the Documentation without notice at any time. Xilinx assumes no obligation to correct any errorscontained in the Documentation, or to advise you of any corrections or updates. Xilinx expressly disclaims any liability in connection withtechnical support or assistance that may be provided to you in connection with the Information.
上传时间： 2013-11-11
上传用户：zwei41
