We present a particle filter construction for a system that exhibits time-scale separation. The separation of time-scales allows two simplifications that we exploit: i) The use of the averaging principle for the dimensional reduction of the system needed to solve for each particle and ii) the factorization of the transition probability which allows the Rao-Blackwellization of the filtering step. Both simplifications can be implemented using the coarse projective integration framework. The resulting particle filter is faster and has smaller variance than the particle filter based on the original system. The convergence of the new particle filter to the analytical filter for the original system is proved and some numerical results are provided.
标签： construction separation time-scale particle
上传时间： 2016-01-02
上传用户：fhzm5658
Software Engineering is a discipline applied by teams to produce high-quality, large-scale, cost-effective software that satisfies the users’ needs, and can be maintained over time Software Development is a weaker term where standards, tools, processes, etc. may not be applied
标签： high-quality Engineering large-scale discipline
上传时间： 2014-01-09
上传用户：bcjtao
从时域分析比较了ofdm和stbc与ofdm结合的性能差别-from time-domain analysis and comparison of OFDM stbc OFDM combined wi
上传时间： 2013-06-05
上传用户：caozhizhi
ANALOG INPUT BANDWIDTH is a measure of the frequencyat which the reconstructed output fundamental drops3 dB below its low frequency value for a full scale input. Thetest is performed with fIN equal to 100 kHz plus integer multiplesof fCLK. The input frequency at which the output is −3dB relative to the low frequency input signal is the full powerbandwidth.APERTURE JITTER is the variation in aperture delay fromsample to sample. Aperture jitter shows up as input noise.APERTURE DELAY See Sampling Delay.BOTTOM OFFSET is the difference between the input voltagethat just causes the output code to transition to the firstcode and the negative reference voltage. Bottom Offset isdefined as EOB = VZT–VRB, where VZT is the first code transitioninput voltage and VRB is the lower reference voltage.Note that this is different from the normal Zero Scale Error.CONVERSION LATENCY See PIPELINE DELAY.CONVERSION TIME is the time required for a completemeasurement by an analog-to-digital converter. Since theConversion Time does not include acquisition time, multiplexerset up time, or other elements of a complete conversioncycle, the conversion time may be less than theThroughput Time.DC COMMON-MODE ERROR is a specification which appliesto ADCs with differential inputs. It is the change in theoutput code that occurs when the analog voltages on the twoinputs are changed by an equal amount. It is usually expressed in LSBs.
上传时间： 2013-11-12
上传用户：pans0ul
HT47R20A-1时基(Time Base)使用介绍 HT47 系列单片机的时基可提供一个周期性超时时间周期以产生规则性的内部中断。时基的时钟来源可由掩膜选择设定为WDT 时钟、RTC 时钟或指令时钟（系统时钟/4）；其超时时间范围可由掩膜选择设定为“时钟来源”/212~“时钟来源”/215。如果时基发生超时现象，则其对应的中断请求标志（TBF）会被置位，如果中断允许，则产生一个中断服务到08H 的地址。
上传时间： 2013-11-15
上传用户：13925096126
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
上传时间： 2013-10-22
上传用户：ztj182002
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
上传时间： 2013-11-21
上传用户：不懂夜的黑
Backpropagation Network Time-Series Forecasting 源码, 经典的BPN人工神经网络例子源码
标签： Backpropagation Forecasting Time-Series Network
上传时间： 2015-01-05
上传用户：tb_6877751
Unix和NT上NetWork Time网络协议（4.0版本）
上传时间： 2014-01-01
上传用户：凤临西北
rtai-3.1-test3的源代码(Real-Time Application Interface )
标签： Application Real-Time Interface rtai
上传时间： 2014-11-22
上传用户：lps11188
