Power conversion by virtue of its basic role produces harmonics due to theslicing of either voltages or currents. To a large extent the pollution in theutility supply and the deterioration of the power quality has been generatedor created by non-linear converters. It is therefore ironic that power convertersshould now be used to clean up the pollution that they helped to create inthe first place.In a utility system, it is desirable to prevent harmonic currents (which resultin EMI and resonance problems) and limit reactive power flows (whichresult in transmission losses).Traditionally, shunt passive filters, comprised of tuned LC elements andcapacitor banks, were used to filter the harmonics and to compensate forreactive current due to non-linear loads. However, in practical applicationsthese methods have many disadvantages.
上传时间： 2013-11-05
上传用户：AISINI005
This reference design (RD) features a fullyassembled and tested surface-mount printed circuitboard (PCB). The RD board utilizes the MAX48851:2 or 2:1 multiplexer and other ICs to implement acomplete video graphics array (VGA) 8:1multiplexer.VGA input/output connections are provided to easilyinterface the MAX4885 RD board with VGAcompatibledevices. The RD board gives the optionto use a single 5V DC power supply (V+), or this RDboard can be powered from any one of the eight VGA sources.
标签： multiplexer reference VGA
上传时间： 2013-11-09
上传用户：ANRAN
Finite state machines are widely used in digital circuit designs. Generally, when designing a state machine using an HDL, the synthesis tools will optimize away all states that cannot be reached and generate a highly optimized circuit. Sometimes, however, the optimization is not acceptable. For example, if the circuit powers up in an invalid state, or the circuit is in an extreme working environment and a glitch sends it into an undesired state, the circuit may never get back to its normal operating condition.
标签： Creating Machines Mentor State
上传时间： 2013-10-08
上传用户：wangzhen1990
good good study ，day day up
上传时间： 2014-05-15
上传用户：wvbxj
讨论、研究高性能覆铜板对它所用的环氧树脂的性能要求，应是立足整个产业链的角度去观察、分析。特别应从HDI多层板发展对高性能CCL有哪些主要性能需求上着手研究。HDI多层板有哪些发展特点，它的发展趋势如何——这都是我们所要研究的高性能CCL发展趋势和重点的基本依据。而HDI多层板的技术发展，又是由它的应用市场——终端电子产品的发展所驱动（见图1）。 图1 在HDI多层板产业链中各类产品对下游产品的性能需求关系图 1．HDI多层板发展特点对高性能覆铜板技术进步的影响1.1 HDI多层板的问世，对传统PCB技术及其基板材料技术是一个严峻挑战20世纪90年代初，出现新一代高密度互连（High Density Interconnection，简称为 HDI）印制电路板——积层法多层板（Build—Up Multiplayer printed board，简称为 BUM）的最早开发成果。它的问世是全世界几十年的印制电路板技术发展历程中的重大事件。积层法多层板即HDI多层板，至今仍是发展HDI的PCB的最好、最普遍的产品形式。在HDI多层板之上，将最新PCB尖端技术体现得淋漓尽致。HDI多层板产品结构具有三大突出的特征：“微孔、细线、薄层化”。其中“微孔”是它的结构特点中核心与灵魂。因此，现又将这类HDI多层板称作为“微孔板”。HDI多层板已经历了十几年的发展历程，但它在技术上仍充满着朝气蓬勃的活力，在市场上仍有着前程广阔的空间。
上传时间： 2013-11-22
上传用户：gundan
This document provides practical, common guidelines for incorporating PCI Express interconnect layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10- layer or more server baseboard designs. Guidelines and constraints in this document are intended for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI Express devices located on the same baseboard (chip-to-chip routing) and interconnects between a PCI Express device located “down” on the baseboard and a device located “up” on an add-in card attached through a connector. This document is intended to cover all major components of the physical interconnect including design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card edge-finger and connector considerations. The intent of the guidelines and examples is to help ensure that good high-speed signal design practices are used and that the timing/jitter and loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect. However, while general physical guidelines and suggestions are given, they may not necessarily guarantee adequate performance of the interconnect for all layouts and implementations. Therefore, designers should consider modeling and simulation of the interconnect in order to ensure compliance to all applicable specifications. The document is composed of two main sections. The first section provides an overview of general topology and interconnect guidelines. The second section concentrates on physical layout constraints where bulleted items at the beginning of a topic highlight important constraints, while the narrative that follows offers additional insight.
上传时间： 2013-10-15
上传用户：busterman
The LTP5900 includes sufficient power supply filtering and decoupling capacitancesuch that additional filtering should not be necessary for most battery-powereddesigns. Care must be taken to avoid large transient voltages on the supply as theM2510 steps up its current consumption (see the section on Supply Design below).
标签： Integration Hardware Guide 5900
上传时间： 2014-12-24
上传用户：youmo81
模块电源的电气性能是通过一系列测试来呈现的，下列为一般的功能性测试项目，详细说明如下： 电源调整率(Line Regulation) 负载调整率(Load Regulation) 综合调整率(Conmine Regulation) 输出涟波及杂讯(Ripple & Noise) 输入功率及效率(Input Power, Efficiency) 动态负载或暂态负载(Dynamic or Transient Response) 起动(Set-Up)及保持(Hold-Up)时间 常规功能(Functions)测试 1. 电源调整率 电源调整率的定义为电源供应器于输入电压变化时提供其稳定输出电压的能力。测试步骤如下：于待测电源供应器以正常输入电压及负载状况下热机稳定后，分别于低输入电压(Min)，正常输入电压(Normal)，及高输入电压(Max)下测量并记录其输出电压值。 电源调整率通常以一正常之固定负载(Nominal Load)下，由输入电压变化所造成其输出电压偏差率(deviation)的百分比，如下列公式所示： [Vo(max)-Vo(min)] / Vo(normal) 2. 负载调整率 负载调整率的定义为开关电源于输出负载电流变化时，提供其稳定输出电压的能力。测试步骤如下：于待测电源供应器以正常输入电压及负载状况下热机稳定后，测量正常负载下之输出电压值，再分别于轻载(Min)、重载(Max)负载下，测量并记录其输出电压值(分别为Vo(max)与Vo(min))，负载调整率通常以正常之固定输入电压下，由负载电流变化所造成其输出电压偏差率的百分比，如下列公式所示： [Vo(max)-Vo(min)] / Vo(normal) 3. 综合调整率 综合调整率的定义为电源供应器于输入电压与输出负载电流变化时，提供其稳定输出电压的能力。这是电源调整率与负载调整率的综合，此项测试系为上述电源调整率与负载调整率的综合，可提供对电源供应器于改变输入电压与负载状况下更正确的性能验证。 综合调整率用下列方式表示：于输入电压与输出负载电流变化下，其输出电压之偏差量须于规定之上下限电压范围内(即输出电压之上下限绝对值以内)或某一百分比界限内。 4. 输出杂讯 输出杂讯(PARD)系指于输入电压与输出负载电流均不变的情况下，其平均直流输出电压上的周期性与随机性偏差量的电压值。输出杂讯是表示在经过稳压及滤波后的直流输出电压上所有不需要的交流和噪声部份(包含低频之50/60Hz电源倍频信号、高于20 KHz之高频切换信号及其谐波，再与其它之随机性信号所组成))，通常以mVp-p峰对峰值电压为单位来表示。 一般的开关电源的规格均以输出直流输出电压的1%以内为输出杂讯之规格，其频宽为20Hz到20MHz。电源实际工作时最恶劣的状况(如输出负载电流最大、输入电源电压最低等)，若电源供应器在恶劣环境状况下，其输出直流电压加上杂讯后之输出瞬时电压，仍能够维持稳定的输出电压不超过输出高低电压界限情形，否则将可能会导致电源电压超过或低于逻辑电路(如TTL电路)之承受电源电压而误动作，进一步造成死机现象。 同时测量电路必须有良好的隔离处理及阻抗匹配，为避免导线上产生不必要的干扰、振铃和驻波，一般都采用双同轴电缆并以50Ω于其端点上，并使用差动式量测方法(可避免地回路之杂讯电流)，来获得正确的测量结果。 5. 输入功率与效率 电源供应器的输入功率之定义为以下之公式： True Power = Pav(watt) = Vrms x Arms x Power Factor 即为对一周期内其输入电压与电流乘积之积分值，需注意的是Watt≠VrmsArms而是Watt=VrmsArmsxP.F.，其中P.F.为功率因素(Power Factor)，通常无功率因素校正电路电源供应器的功率因素在0.6～0.7左右，其功率因素为1～0之间。 电源供应器的效率之定义为为输出直流功率之总和与输入功率之比值。效率提供对电源供应器正确工作的验证，若效率超过规定范围，即表示设计或零件材料上有问题，效率太低时会导致散热增加而影响其使用寿命。 6. 动态负载或暂态负载 一个定电压输出的电源，于设计中具备反馈控制回路，能够将其输出电压连续不断地维持稳定的输出电压。由于实际上反馈控制回路有一定的频宽，因此限制了电源供应器对负载电流变化时的反应。若控制回路输入与输出之相移于增益(Unity Gain)为1时，超过180度，则电源供应器之输出便会呈现不稳定、失控或振荡之现象。实际上，电源供应器工作时的负载电流也是动态变化的，而不是始终维持不变(例如硬盘、软驱、CPU或RAM动作等)，因此动态负载测试对电源供应器而言是极为重要的。可编程序电子负载可用来模拟电源供应器实际工作时最恶劣的负载情况，如负载电流迅速上升、下降之斜率、周期等，若电源供应器在恶劣负载状况下，仍能够维持稳定的输出电压不产生过高激(Overshoot)或过低(Undershoot)情形，否则会导致电源之输出电压超过负载组件(如TTL电路其输出瞬时电压应介于4.75V至5.25V之间，才不致引起TTL逻辑电路之误动作)之承受电源电压而误动作，进一步造成死机现象。 7. 启动时间与保持时间 启动时间为电源供应器从输入接上电源起到其输出电压上升到稳压范围内为止的时间，以一输出为5V的电源供应器为例，启动时间为从电源开机起到输出电压达到4.75V为止的时间。 保持时间为电源供应器从输入切断电源起到其输出电压下降到稳压范围外为止的时间，以一输出为5V的电源供应器为例，保持时间为从关机起到输出电压低于4.75V为止的时间，一般值为17ms或20ms以上，以避免电力公司供电中于少了半周或一周之状况下而受影响。 8. 其它 在电源具备一些特定保护功能的前提下，还需要进行保护功能测试，如过电压保护(OVP)测试、短路保护测试、过功保护等
上传时间： 2013-10-22
上传用户：zouxinwang
Abstract: This application note details a step-by-step design process for the MAX16833 high-voltagehigh-brightness LED driver. This process can speed up prototyping and increase the chance for firstpass
上传时间： 2013-10-09
上传用户：tianjinfan
Abstract: This document details the Oceanside (MAXREFDES9#) subsystem reference design, a 3.3V to 15V input,±15V (±12V) output, isolated power supply. The Oceanside design includes a high-efficiency step-up controller, a36V H-bridge transformer driver for isolated supplies, a wide input range, and adjustable output low-dropout linearregulator (LDO). Test results and hardware files are included.
上传时间： 2013-10-12
上传用户：jinyao
