BGA CHIP placement AND ROUTING RUL
标签： placement ROUTING CHIP BGA
上传时间： 2015-11-05
上传用户：asdfasdfd
An Efficient and Effective Detailed placement Algorithm Global Swap To identify a pair of cells that can be swapped to reduce wirelength (others are fixed). 2. Vertical Swap Swap a cell with a nearby cell in the segment above or below. 3. Local Re-ordering Re-order consecutive cells locally to reduce wirelength. 4. Single-Segment Clustering Place cells optimally within a segment.
标签： Algorithm Efficient Effective placement
上传时间： 2013-12-18
上传用户：ukuk
Sudoku is a logic-based number placement puzzle. A deceptively simple game of logic, Sudoku is puzzling players all over world.
标签： Sudoku deceptively logic-based placement
上传时间： 2017-07-04
上传用户：dragonhaixm
BGA布线指南 BGA CHIP placement AND ROUTING RULE BGA是PCB上常用的组件，通常CPU、NORTH BRIDGE、SOUTH BRIDGE、AGP CHIP、CARD BUS CHIP…等，大多是以bga的型式包装，简言之，80﹪的高频信号及特殊信号将会由这类型的package内拉出。因此，如何处理BGA package的走线，对重要信号会有很大的影响。 通常环绕在BGA附近的小零件，依重要性为优先级可分为几类： 1. by pass。 2. clock终端RC电路。 3. damping（以串接电阻、排组型式出现；例如memory BUS信号） 4. EMI RC电路（以dampin、C、pull height型式出现；例如USB信号）。 5. 其它特殊电路（依不同的CHIP所加的特殊电路；例如CPU的感温电路）。 6. 40mil以下小电源电路组（以C、L、R等型式出现；此种电路常出现在AGP CHIP or含AGP功能之CHIP附近，透过R、L分隔出不同的电源组）。 7. pull low R、C。 8. 一般小电路组（以R、C、Q、U等型式出现；无走线要求）。 9. pull height R、RP。 中文DOC，共5页，图文并茂
上传时间： 2013-04-24
上传用户：cxy9698
Many CAD users dismiss schematic capture as a necessary evil in the process of creating\r\nPCB layout but we have always disputed this point of view. With PCB layout now offering\r\nautomation of both component placement and track routing, getting the des
标签： schematic necessary creating dismiss
上传时间： 2013-09-25
上传用户：baiom
LAYOUT REPORT .............. 1 目錄.................. 1 1. PCB LAYOUT 術語解釋(TERMS)......... 2 2. Test Point : ATE 測試點供工廠ICT 測試治具使用............ 2 3. 基準點 (光學點) -for SMD:........... 4 4. 標記 (LABEL ING)......... 5 5. VIA HOLE PAD................. 5 6. PCB Layer 排列方式...... 5 7.零件佈置注意事項 (placement NOTES)............... 5 8. PCB LAYOUT 設計............ 6 9. Transmission Line ( 傳輸線 )..... 8 10.General Guidelines – 跨Plane.. 8 11. General Guidelines – 繞線....... 9 12. General Guidelines – Damping Resistor. 10 13. General Guidelines - RJ45 to Transformer................. 10 14. Clock Routing Guideline........... 12 15. OSC & CRYSTAL Guideline........... 12 16. CPU
上传时间： 2013-12-20
上传用户：康郎
The LTM8020, LTM8021, LTM8022 and LTM8023 μModule®regulators are complete easy-to-use encapsulated stepdownDC/DC regulators intended to take the pain and aggravationout of implementing a switching power supplyonto a system board. With a μModule regulator, you onlyneed an input cap, output cap and one or two resistorsto complete the design. As one might imagine, this highlevel of integration greatly simplifi es the task of printedcircuit board design, reducing the effort to four categories:component footprint generation, component placement,routing the nets, and thermal vias.
上传时间： 2014-01-18
上传用户：laomv123
中文版详情浏览：http://www.elecfans.com/emb/fpga/20130715324029.html Xilinx UltraScale:The Next-Generation Architecture for Your Next-Generation Architecture The Xilinx® UltraScale™ architecture delivers unprecedented levels of integration and capability with ASIC-class system- level performance for the most demanding applications. The UltraScale architecture is the industr y's f irst application of leading-edge ASIC architectural enhancements in an All Programmable architecture that scales from 20 nm planar through 16 nm FinFET technologies and beyond, in addition to scaling from monolithic through 3D ICs. Through analytical co-optimization with the X ilinx V ivado® Design Suite, the UltraScale architecture provides massive routing capacity while intelligently resolving typical bottlenecks in ways never before possible. This design synergy achieves greater than 90% utilization with no performance degradation. Some of the UltraScale architecture breakthroughs include: • Strategic placement (virtually anywhere on the die) of ASIC-like system clocks, reducing clock skew by up to 50% • Latency-producing pipelining is virtually unnecessary in systems with massively parallel bus architecture, increasing system speed and capability • Potential timing-closure problems and interconnect bottlenecks are eliminated, even in systems requiring 90% or more resource utilization • 3D IC integration makes it possible to build larger devices one process generation ahead of the current industr y standard • Greatly increased system performance, including multi-gigabit serial transceivers, I/O, and memor y bandwidth is available within even smaller system power budgets • Greatly enhanced DSP and packet handling The Xilinx UltraScale architecture opens up whole new dimensions for designers of ultra-high-capacity solutions.
标签： UltraScale Xilinx 架构
上传时间： 2013-11-13
上传用户：瓦力瓦力hong
多远程二极管温度传感器-Design Considerations for pc thermal management Multiple RDTS (remote diode temperature sensing) provides the most accurate method of sensing an IC’s junction temperature. It overcomes thermal gradient and placement issues encountered when trying to place external sensors. PCB component count decreases when using a device that provides multiple inputs.Better temperature sensing improves product performance and reliability. Disk drive data integrity suffers at elevated temperatures. IBM published an article stating that a 5°C rise in operating temperature causes a 15% increase in the drive’s failure rate. The overall performance of a system can be improved by providing a more accurate temperature measurement of the most critical devices allowing them to run just a few degrees hotter.The LM83 directly senses its own temperature and the temperature of three external PN junctions. One is dedicated to the CPU of choice, the other two go to other parts of your system that need thermal monitoring such as the disk drive or graphics chip. The SMBus-compatible LM83 supports SMBus timeout and logic levels. The LM83 has two interrupt outputs; one for user-programmable limits and WATCHDOG capability (INT), the other is a Critical Temperature Alarm output (T_CRIT_A) for system power supply shutdown.
标签： Considerat Design 远程 二极管
上传时间： 2014-12-21
上传用户：ljd123456
完整性高的FPGA-PCB系统化协同设计工具 Cadence OrCAD and Allegro FPGA System Planner便可满足较复杂的设计及在设计初级产生最佳的I/O引脚规划，并可透过FSP做系统化的设计规划，同时整合logic、schematic、PCB同步规划单个或多个FPGA pin的最佳化及layout placement，借由整合式的界面以减少重复在design及PCB Layout的测试及修正的过程及沟通时间，甚至透过最佳化的pin mapping、placement后可节省更多的走线空间或叠构。 Specifying Design Intent 在FSP整合工具内可直接由零件库选取要摆放的零件，而这些零件可直接使用PCB内的包装，预先让我们同步规划FPGA设计及在PCB的placement。
标签： Allegro Planner System FPGA
上传时间： 2013-11-06
上传用户：wwwe
