为了在CDMA系统中更好地应用QDPSK数字调制方式，在分析四相相对移相（QDPSK)信号调制解调原理的基础上，设计了一种QDPSK调制解调电路，它包括串并转换、差分编码、四相载波产生和选相、相干解调、差分译码和并串转换电路。在MAX+PLUSⅡ软件平台上，进行了编译和波形仿真。综合后下载到复杂可编程逻辑器件EPM7128SLC84-15中，测试结果表明，调制电路能正确选相，解调电路输出数据与QDPSK调制输入数据完全一致，达到了预期的设计要求。 Abstract: In order to realize the better application of digital modulation mode QDPSK in the CDMA system， a sort of QDPSK modulation-demodulation circuit was designed based on the analysis of QDPSK signal modulation-demodulation principles. It included serial/parallel conversion circuit, differential encoding circuit, four-phase carrier wave produced and phase chosen circuit, coherent demodulation circuit, difference decoding circuit and parallel/serial conversion circuit. And it was compiled and simulated on the MAX+PLUSⅡ software platform,and downloaded into the CPLD of EPM7128SLC84-15.The test result shows that the modulation circuit can exactly choose the phase，and the output data of the demodulator circuit is the same as the input data of the QDPSK modulate. The circuit achieves the prospective requirement of the design.
上传时间： 2013-10-28
上传用户：jyycc
波长信号的解调是实现光纤光栅传感网络的关键，基于现有的光纤光栅传感器解调方法，提出一种基于FPGA的双匹配光纤光栅解调方法，此系统是一种高速率、高精度、低成本的解调系统，并且通过引入双匹配光栅有效地克服了双值问题同时扩大了检测范围。分析了光纤光栅的测温原理并给出了该方案软硬件设计，综合考虑系统的解调精度和FPGA的处理速度给出了基于拉格朗日的曲线拟合算法。 Abstract: Sensor is one of the most important application of the fiber grating. Wavelength signal demodulating is the key techniques to carry out fiber grating sensing network， based on several existing methods of fiber grating sensor demodulation inadequate， a two-match fiber grating demodulation method was presented. This system is a high-speed， high precision， low-cost demodulation system. And by introducing a two-match grating effectively overcomes the problem of double value while expands the scope of testing. This paper analyzes the principle of fiber Bragg grating temperature and gives the software and hardware design of the program. Considering the system of demodulation accuracy and processing speed of FPGA，this paper gives the curve fitting algorithm based on Lagrange.
上传时间： 2013-10-10
上传用户：zxc23456789
第一部分 信号完整性知识基础.................................................................................5第一章 高速数字电路概述.....................................................................................51.1 何为高速电路...............................................................................................51.2 高速带来的问题及设计流程剖析...............................................................61.3 相关的一些基本概念...................................................................................8第二章 传输线理论...............................................................................................122.1 分布式系统和集总电路.............................................................................122.2 传输线的RLCG 模型和电报方程...............................................................132.3 传输线的特征阻抗.....................................................................................142.3.1 特性阻抗的本质.................................................................................142.3.2 特征阻抗相关计算.............................................................................152.3.3 特性阻抗对信号完整性的影响.........................................................172.4 传输线电报方程及推导.............................................................................182.5 趋肤效应和集束效应.................................................................................232.6 信号的反射.................................................................................................252.6.1 反射机理和电报方程.........................................................................252.6.2 反射导致信号的失真问题.................................................................302.6.2.1 过冲和下冲.....................................................................................302.6.2.2 振荡：.............................................................................................312.6.3 反射的抑制和匹配.............................................................................342.6.3.1 串行匹配.........................................................................................352.6.3.1 并行匹配.........................................................................................362.6.3.3 差分线的匹配.................................................................................392.6.3.4 多负载的匹配.................................................................................41第三章 串扰的分析...............................................................................................423.1 串扰的基本概念.........................................................................................423.2 前向串扰和后向串扰.................................................................................433.3 后向串扰的反射.........................................................................................463.4 后向串扰的饱和.........................................................................................463.5 共模和差模电流对串扰的影响.................................................................483.6 连接器的串扰问题.....................................................................................513.7 串扰的具体计算.........................................................................................543.8 避免串扰的措施.........................................................................................57第四章 EMI 抑制....................................................................................................604.1 EMI/EMC 的基本概念..................................................................................604.2 EMI 的产生..................................................................................................614.2.1 电压瞬变.............................................................................................614.2.2 信号的回流.........................................................................................624.2.3 共模和差摸EMI ..................................................................................634.3 EMI 的控制..................................................................................................654.3.1 屏蔽.....................................................................................................654.3.1.1 电场屏蔽.........................................................................................654.3.1.2 磁场屏蔽.........................................................................................674.3.1.3 电磁场屏蔽.....................................................................................674.3.1.4 电磁屏蔽体和屏蔽效率.................................................................684.3.2 滤波.....................................................................................................714.3.2.1 去耦电容.........................................................................................714.3.2.3 磁性元件.........................................................................................734.3.3 接地.....................................................................................................744.4 PCB 设计中的EMI.......................................................................................754.4.1 传输线RLC 参数和EMI ........................................................................764.4.2 叠层设计抑制EMI ..............................................................................774.4.3 电容和接地过孔对回流的作用.........................................................784.4.4 布局和走线规则.................................................................................79第五章 电源完整性理论基础...............................................................................825.1 电源噪声的起因及危害.............................................................................825.2 电源阻抗设计.............................................................................................855.3 同步开关噪声分析.....................................................................................875.3.1 芯片内部开关噪声.............................................................................885.3.2 芯片外部开关噪声.............................................................................895.3.3 等效电感衡量SSN ..............................................................................905.4 旁路电容的特性和应用.............................................................................925.4.1 电容的频率特性.................................................................................935.4.3 电容的介质和封装影响.....................................................................955.4.3 电容并联特性及反谐振.....................................................................955.4.4 如何选择电容.....................................................................................975.4.5 电容的摆放及Layout ........................................................................99第六章 系统时序.................................................................................................1006.1 普通时序系统...........................................................................................1006.1.1 时序参数的确定...............................................................................1016.1.2 时序约束条件...................................................................................1063.2 高速设计的问题.......................................................................................2093.3 SPECCTRAQuest SI Expert 的组件.......................................................2103.3.1 SPECCTRAQuest Model Integrity .................................................2103.3.2 SPECCTRAQuest Floorplanner/Editor .........................................2153.3.3 Constraint Manager .......................................................................2163.3.4 SigXplorer Expert Topology Development Environment .......2233.3.5 SigNoise 仿真子系统......................................................................2253.3.6 EMControl .........................................................................................2303.3.7 SPECCTRA Expert 自动布线器.......................................................2303.4 高速设计的大致流程...............................................................................2303.4.1 拓扑结构的探索...............................................................................2313.4.2 空间解决方案的探索.......................................................................2313.4.3 使用拓扑模板驱动设计...................................................................2313.4.4 时序驱动布局...................................................................................2323.4.5 以约束条件驱动设计.......................................................................2323.4.6 设计后分析.......................................................................................233第四章 SPECCTRAQUEST SIGNAL EXPLORER 的进阶运用..........................................2344.1 SPECCTRAQuest Signal Explorer 的功能包括：................................2344.2 图形化的拓扑结构探索...........................................................................2344.3 全面的信号完整性(Signal Integrity)分析.......................................2344.4 完全兼容 IBIS 模型...............................................................................2344.5 PCB 设计前和设计的拓扑结构提取.......................................................2354.6 仿真设置顾问...........................................................................................2354.7 改变设计的管理.......................................................................................2354.8 关键技术特点...........................................................................................2364.8.1 拓扑结构探索...................................................................................2364.8.2 SigWave 波形显示器........................................................................2364.8.3 集成化的在线分析(Integration and In-process Analysis) .236第五章 部分特殊的运用...............................................................................2375.1 Script 指令的使用..................................................................................2375.2 差分信号的仿真.......................................................................................2435.3 眼图模式的使用.......................................................................................249第四部分：HYPERLYNX 仿真工具使用指南............................................................251第一章 使用LINESIM 进行前仿真.......................................................................2511.1 用LineSim 进行仿真工作的基本方法...................................................2511.2 处理信号完整性原理图的具体问题.......................................................2591.3 在LineSim 中如何对传输线进行设置...................................................2601.4 在LineSim 中模拟IC 元件.....................................................................2631.5 在LineSim 中进行串扰仿真...................................................................268第二章 使用BOARDSIM 进行后仿真......................................................................2732.1 用BOARDSIM 进行后仿真工作的基本方法...................................................2732.2 BoardSim 的进一步介绍..........................................................................2922.3 BoardSim 中的串扰仿真..........................................................................309
上传时间： 2013-11-07
上传用户：aa7821634
This document provides practical, common guidelines for incorporating PCI Express interconnect layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10- layer or more server baseboard designs. Guidelines and constraints in this document are intended for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI Express devices located on the same baseboard (chip-to-chip routing) and interconnects between a PCI Express device located “down” on the baseboard and a device located “up” on an add-in card attached through a connector. This document is intended to cover all major components of the physical interconnect including design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card edge-finger and connector considerations. The intent of the guidelines and examples is to help ensure that good high-speed signal design practices are used and that the timing/jitter and loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect. However, while general physical guidelines and suggestions are given, they may not necessarily guarantee adequate performance of the interconnect for all layouts and implementations. Therefore, designers should consider modeling and simulation of the interconnect in order to ensure compliance to all applicable specifications. The document is composed of two main sections. The first section provides an overview of general topology and interconnect guidelines. The second section concentrates on physical layout constraints where bulleted items at the beginning of a topic highlight important constraints, while the narrative that follows offers additional insight.
上传时间： 2014-01-24
上传用户：s363994250
研究一种基于TMS320F28335 DSP（Digital Signal Processor）的全数字飞行器控制系统的硬件设计，分析了其结构组成：主控制器电路、舵面位置检测电路和通讯等硬件电路设计。经过多次试验调试，所设计的硬件系统可以满足飞行器性能要求。
上传时间： 2013-10-10
上传用户：z1191176801
The power of programmability gives industrial automation designers a highly efficient， cost-effective alternative to traditional motor control units （MCUs）。 The parallel-processing power， fast computational speeds， and connectivity versatility of Xilinx® FPGAs can accelerate the implementation of advanced motor control algorithms such as Field Oriented Control （FOC）。 Additionally， Xilinx devices lower costs with greater on-chip integration of system components and shorten latencies with high-performance digital signal processing （DSP） that can tackle compute-intensive functions such as PID Controller， Clark/Park transforms， and Space Vector PWM. The Xilinx Spartan®-6 FPGA Motor Control Development Kit gives designers an ideal starting point for evaluating time-saving， proven， motor-control reference designs. The kit also shortens the process of developing custom control capabilities， with integrated peripheral functions （Ethernet， PowerLink， and PCI® Express）， a motor-control FPGA mezzanine card （FMC） with built-in Texas Instruments motor drivers and high-precision Delta-Sigma modulators， and prototyping support for evaluating alternative front-end circuitry.
上传时间： 2013-10-28
上传用户：wujijunshi
Delta-sigma ADCs, with their high accuracy and high noiseimmunity, are ideal for directly measuring many typesof sensors. Nevertheless, input sampling currents canoverwhelm high source impedances or low-bandwidth,micropower signal conditioning circuits. The LTC®2484family of delta sigma converters solves this problem bybalancing the input currents, thussimplifying or eliminatingthe need for signal conditioning circuits.
上传时间： 2015-01-03
上传用户：潜水的三贡
在Multisim 10软件环境下，设计一种由运算放大器构成的精确可控矩形波信号发生器，结合系统电路原理图重点阐述了各参数指标的实现与测试方法。通过改变RC电路的电容充、放电路径和时间常数实现了占空比和频率的调节，通过多路开关投入不同数值的电容实现了频段的调节，通过电压取样和同相放大电路实现了输出电压幅值的调节并提高了电路的带负载能力，可作为频率和幅值可调的方波信号发生器。Multisim 10仿真分析及应用电路测试结果表明，电路性能指标达到了设计要求。 Abstract: Based on Multisim 10， this paper designed a kind of rectangular-wave signal generator which could be controlled exactly composed of operational amplifier， the key point was how to implement and test the parameter indicators based on the circuit diagram. The duty and the frequency were adjusted by changing the time constant and the way of charging and discharging of the capacitor， the width of frequency was adjusted by using different capacitors provided with multiple switch， the amplitude of output voltage was adjusted by sampling voltage and using in-phase amplifier circuit，the ability of driving loads was raised， the circuit can be used as squarewave signal generator whose frequency and amplitude can be adjusted. The final simulation results of Multisim 10 and the tests of applicable circuit show that the performance indicators of the circuit meets the design requirements.
上传时间： 2014-01-21
上传用户：shen007yue
利用EZ-USB接口芯片AN2131Q实现了基于TMS320C5409的水声信号采集及混沌特性研究系统中的高速数据通信，提出了一种采用FIFO缓存芯片实现AN2131Q与TMS320C5409的连接方法，深入研究了EZ-USB序列接口芯片的固件、设备驱动和用户程序开发过程。关键词：AN2131Q; TMS320C5409; IDT72V02；数据通信ABSTRACT: Using AN2131Q as the control chip, the communication between DSP and PC in the underwater acoustic signal acquisition and chaotic characteristics study system is realized. The method is proposed that using FIFO to realize the connectivity between AN2131Q and TMS320C5409. The development of programming Firmware、device driver and user application are thoroughly researched.Key words: AN2131Q; TMS320C5409; IDT72V02; data communication
上传时间： 2014-04-03
上传用户：hahayou
项目描述: Env_audit is a program that ferrets out everything it can about the environment. It looks for process IDs, UID, GID, signal masks, umask, priority, file descriptors, and environmental variables. It comes with test configurations for anacron, apache, atd, crond, GDB, inittab, logrotate, PHP, pppd, procmail, rsh, rxvt, sendmail, SSH, stunnel, sudo, xinetd, and xterm. env_audit是一个搜索有关环境的所有东西的程序。它查询进程IDs，UID, GID,信号掩码，umask,优先权，文件描述符，和环境变量。它提供了用于anacron, apache, atd, crond, GDB, inittab, logrotate, PHP, pppd, procmail, rsh, rxvt, sendmail, SSH, stunnel, sudo, xinetd, 和xterm的测试配置。 类别: Development Status: 5 - Production/Stable Environment: Console (Text Based) Intended Audience: System Administrators License: GNU General Public License (GPL) Operating System: POSIX Topic: Security
标签： environment everything Env_audit ferrets
上传时间： 2013-12-02
上传用户：qweqweqwe
