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  • 寄生电容在升压变压器中的设计应用

    One of the most critical components in a step-up design like Figure 1 is the transformer. Transformers have parasitic components that can cause them to deviate from their ideal characteristics, and the parasitic capacitance associated with the secondary can cause large resonating current spikes on the leading edge of the switch current waveform.

    标签: 寄生电容 升压变压器 中的设计

    上传时间: 2013-11-22

    上传用户:15070202241

  • 高性能DCDC控制器

    We provide complete power solutions with a full lineup of power managementproducts. This brochure provides an overview of our high performance DC/DC switching regulatorcontrollers for applications including datacom, telecom, industrial, automotive, medical, avionicsand control systems. We make power design easier with our industry-leading field applicationengineering support; a broad selection of demonstration boards with schematics, layout filesand parts lists; SwitcherCAD® software for simulation, application notes and comprehensivetechnical documentation.

    标签: DCDC 性能 控制器

    上传时间: 2013-10-15

    上传用户:lz4v4

  • Xilinx UltraScale:新一代架构满足您的新一代架构需求(EN)

      中文版详情浏览:http://www.elecfans.com/emb/fpga/20130715324029.html   Xilinx UltraScale:The Next-Generation Architecture for Your Next-Generation Architecture    The Xilinx® UltraScale™ architecture delivers unprecedented levels of integration and capability with ASIC-class system- level performance for the most demanding applications.   The UltraScale architecture is the industr y's f irst application of leading-edge ASIC architectural enhancements in an All Programmable architecture that scales from 20 nm planar through 16 nm FinFET technologies and beyond, in addition to scaling from monolithic through 3D ICs. Through analytical co-optimization with the X ilinx V ivado® Design Suite, the UltraScale architecture provides massive routing capacity while intelligently resolving typical bottlenecks in ways never before possible. This design synergy achieves greater than 90% utilization with no performance degradation.   Some of the UltraScale architecture breakthroughs include:   • Strategic placement (virtually anywhere on the die) of ASIC-like system clocks, reducing clock skew by up to 50%    • Latency-producing pipelining is virtually unnecessary in systems with massively parallel bus architecture, increasing system speed and capability   • Potential timing-closure problems and interconnect bottlenecks are eliminated, even in systems requiring 90% or more resource utilization   • 3D IC integration makes it possible to build larger devices one process generation ahead of the current industr y standard    • Greatly increased system performance, including multi-gigabit serial transceivers, I/O, and memor y bandwidth is available within even smaller system power budgets   • Greatly enhanced DSP and packet handling   The Xilinx UltraScale architecture opens up whole new dimensions for designers of ultra-high-capacity solutions.

    标签: UltraScale Xilinx 架构

    上传时间: 2013-11-13

    上传用户:瓦力瓦力hong

  • ARM_Embedded Seminar in July_Tools_Hope

    ARM is the world’s leading semiconductor IP company with 22 Million processors entering the market each day.

    标签: July_Tools_Hope ARM_Embedded Seminar in

    上传时间: 2013-11-04

    上传用户:Bert520

  • ARM Embedded Development_FSL Kinetis L Series

    ARM is the world’s leading semiconductor IP company with 22 Million processors entering the market each day.

    标签: Development_FSL Embedded Kinetis Series

    上传时间: 2013-11-01

    上传用户:kaixinxin196

  • Xilinx UltraScale:新一代架构满足您的新一代架构需求(EN)

      中文版详情浏览:http://www.elecfans.com/emb/fpga/20130715324029.html   Xilinx UltraScale:The Next-Generation Architecture for Your Next-Generation Architecture    The Xilinx® UltraScale™ architecture delivers unprecedented levels of integration and capability with ASIC-class system- level performance for the most demanding applications.   The UltraScale architecture is the industr y's f irst application of leading-edge ASIC architectural enhancements in an All Programmable architecture that scales from 20 nm planar through 16 nm FinFET technologies and beyond, in addition to scaling from monolithic through 3D ICs. Through analytical co-optimization with the X ilinx V ivado® Design Suite, the UltraScale architecture provides massive routing capacity while intelligently resolving typical bottlenecks in ways never before possible. This design synergy achieves greater than 90% utilization with no performance degradation.   Some of the UltraScale architecture breakthroughs include:   • Strategic placement (virtually anywhere on the die) of ASIC-like system clocks, reducing clock skew by up to 50%    • Latency-producing pipelining is virtually unnecessary in systems with massively parallel bus architecture, increasing system speed and capability   • Potential timing-closure problems and interconnect bottlenecks are eliminated, even in systems requiring 90% or more resource utilization   • 3D IC integration makes it possible to build larger devices one process generation ahead of the current industr y standard    • Greatly increased system performance, including multi-gigabit serial transceivers, I/O, and memor y bandwidth is available within even smaller system power budgets   • Greatly enhanced DSP and packet handling   The Xilinx UltraScale architecture opens up whole new dimensions for designers of ultra-high-capacity solutions.

    标签: UltraScale Xilinx 架构

    上传时间: 2013-11-21

    上传用户:wxqman

  • CAM350软件的学习笔记

    CAM350软件的学习笔记目录1. CAM3501. 一. Gerber知识2. 二.CAM3503. 三.CAM350操作4. 附录Gerber知识l Gerber 文件的格式包括:¡ RS-274-X (常用)¡ RS-274-D (常用)¡ RS-274¡ Fire 9000¡ Mda 9000¡ Barco DPFl 标准的gerber file 格式可分为RS-274 与RS-274X 两种,其不同在于:¡ RS-274 格式的gerber file 与aperture 是分开的不同文件。¡ RS-274X 格式的aperture 是整合在gerber file 中的,因此不需要aperture文件(即,内含D 码)。PCB生成Gerber最好就是选用RS-274x格式,既标准,又兼容性高。l 数据格式:整数位+小数位 。常用:¡ 3:3(公制,整数3 位,小数3 位)¡ 2:4(英制,整数2 位,小数4 位)¡ 2:3(英制,整数2 位,小数3 位)¡ 3:3(英制,整数3 位,小数3 位)l 前导零、后导零和不导零:¡ 例:025690 前导零后变为:25690 (leading)¡ 025690 后导零后变为:02569 (Trailing)¡ 025690 不导零后变为:025690 (None)l 单位:¡ METRIC(mm)¡ ENGLISH(inch or mil)l 单位换算:¡ 1 inch = 1000 mil = 2.54 cm = 25.4 mm¡ 1 mm = 0.03937 inch = 39.37 mill GERBER 格式的数据特点:

    标签: CAM 350 软件

    上传时间: 2013-10-17

    上传用户:yzy6007

  • 数字运算

    数字运算,判断一个数是否接近素数 A Niven number is a number such that the sum of its digits divides itself. For example, 111 is a Niven number because the sum of its digits is 3, which divides 111. We can also specify a number in another base b, and a number in base b is a Niven number if the sum of its digits divides its value. Given b (2 <= b <= 10) and a number in base b, determine whether it is a Niven number or not. Input Each line of input contains the base b, followed by a string of digits representing a positive integer in that base. There are no leading zeroes. The input is terminated by a line consisting of 0 alone. Output For each case, print "yes" on a line if the given number is a Niven number, and "no" otherwise. Sample Input 10 111 2 110 10 123 6 1000 8 2314 0 Sample Output yes yes no yes no

    标签: 数字 运算

    上传时间: 2015-05-21

    上传用户:daguda

  • FFmpeg is a complete solution to record, convert and stream audio and video. It includes libavcodec,

    FFmpeg is a complete solution to record, convert and stream audio and video. It includes libavcodec, the leading audio/video codec library. FFmpeg is developed under Linux, but it can compiled under most operating systems, including Windows.

    标签: libavcodec and complete includes

    上传时间: 2015-09-09

    上传用户:zhichenglu

  • This review classifies genetic algorithm environments into application-oriented systems,algorithmori

    This review classifies genetic algorithm environments into application-oriented systems,algorithmoriented systems, and toolkits. It also presents detailed case studies of leading environments.

    标签: application-oriented algorithmori environments classifies

    上传时间: 2013-12-19

    上传用户:tyler