Abstract: Standard PCB design and mounting processes can adversely influence MEMS inertial sensors.This application note contains guidelines for the layout, soldering, and mounting of MEMS inertialsensors in LGA packages in order to reduce stresses and improve functionality.
标签:
MEMS
惯性传感器
焊接
上传时间:
2014-01-15
上传用户:sjb555