Most circuit designers are familiar with diode dynamiccharacteristics such as charge storage, voltage dependentcapacitance and reverse recovery time. Less commonlyacknowledged and manufacturer specifi ed is diode forwardturn-on time. This parameter describes the timerequired for a diode to turn on and clamp at its forwardvoltage drop. Historically, this extremely short time, unitsof nanoseconds, has been so small that user and vendoralike have essentially ignored it. It is rarely discussed andalmost never specifi ed. Recently, switching regulator clockrate and transition time have become faster, making diodeturn-on time a critical issue. Increased clock rates aremandated to achieve smaller magnetics size; decreasedtransition times somewhat aid overall effi ciency but areprincipally needed to minimize IC heat rise. At clock speedsbeyond about 1MHz, transition time losses are the primarysource of die heating.
上传时间： 2013-10-10
上传用户：谁偷了我的麦兜
As the performance of many handheld devices approachesthat of laptop computers, design complexity also increases.Chief among them is thermal management—how doyou meet increasing performance demands while keepinga compact and small product cool in the user’s hand?For instance, as battery capacities inevitably increase,charge currents will also increase to maintain or improvetheir charge times. Traditional linear regulator-based batterychargers will not be able to meet the charge currentand effi ciency demands necessary to allow a product torun cool. What is needed is a switching-based chargerthat takes just about the same amount of space as a linearsolution—but without the heat.
上传时间： 2013-11-23
上传用户：lu2767
In a recent discussion with a system designer, the requirementfor his power supply was to regulate 1.5Vand deliver up to 40A of current to a load that consistedof four FPGAs. This is up to 60W of power that must bedelivered in a small area with the lowest height profi lepossible to allow a steady fl ow of air for cooling. Thepower supply had to be surface mountable and operateat high enough effi ciency to minimize heat dissipation.He also demanded the simplest possible solution so histime could be dedicated to the more complex tasks. Asidefrom precise electrical performance, this solution had toremovethe heat generated during DC to DC conversionquickly so that the circuit and the ICs in the vicinity do notoverheat. Such a solution requires an innovative designto meet these criteria:
上传时间： 2013-11-24
上传用户：defghi010
Notebook and palmtop systems need a multiplicity ofregulated voltages developed from a single battery. Smallsize, light weight, and high efficiency are mandatory forcompetitive solutions in this area. Small increases inefficiency extend battery life, making the final productmuch more usable with no increase in weight. Additionally,high efficiency minimizes the heat sinks needed onthe power regulating components, further reducing systemweight and size.
上传时间： 2013-11-11
上传用户：大三三
将现行的供暖计费方式由按建筑面积计费变为按消耗的热能计费是供暖计费方式发展趋势，为了满足这一计费方式变化的需要，设计了基于IC卡的预付费式新型供暖计费系统，通过测量用户采暖系统进出口的温度和流量，计算用户消耗的热能，利用IC卡记录用户预付费的金额和当年热能的单价，根据热能消耗和当年热能的单价计算用户采暖费，根据实际发生的供暖费用和预付费金额控制供暖的开停，这一计费方式的变化使供暖计费更趋合理。 Abstract: It is trend that the mode of heat charging is changed from billing by building area to by thermal energy. In order to meet the needs of heat charging mode changing， a new system of heat charging based on IC card is proposed. The user?蒺s energy consumption is calculated by measuring the user inlet and outlet temperature and flow，using the IC card to record the prepaid amount and the current price of heat. The user?蒺s heating costs is calculated according to energy consumption and current price， according to actual heating costs and prepaid amount，the system controls the heating opening or stopping. It is more reasonable that calculated heating costs by user heat consumption
上传时间： 2013-10-14
上传用户：大融融rr
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
上传时间： 2013-10-22
上传用户：ztj182002
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
上传时间： 2013-11-21
上传用户：不懂夜的黑
OFELI is an object oriented library of C++ classes for development of finite element codes. Its main features are : * Various storage schemes of matrices (dense, sparse, skyline). * Direct methods of solution of linear systems of equations as well as various combinations of iterative solvers and preconditioners. * Shape functions of most "popular" finite elements * Element arrays of most popular problems (heat Transfer, Fluid Flow, Solid Mechanics, Electromagnetics, ...).
标签： development oriented classes element
上传时间： 2015-03-03
上传用户：kbnswdifs
The purpose of this project is to make it possible to remotely switch on a Webasto Thermo Top C water heater that is used to pre-heat the heating system of a car without starting the motor.
标签： possible remotely purpose Webasto
上传时间： 2013-12-28
上传用户：LouieWu
In engineering, compensation is planning for side effects or other unintended issues in a design. The design of an invention can itself also be to compensate for some other existing issue or exception. One example is in a voltage-controlled crystal oscillator (VCXO), which is normally affected not only by voltage, but to a lesser extent by temperature. A temperature-compensated version (a TCVCXO) is designed so that heat buildup within the enclosure of a transmitter or other such device will not alter the piezoelectric effect, thereby causing frequency drift. Another example is motion compensation on digital cameras and video cameras, which keep a picture steady and not blurry.
标签： compensation engineering unintended planning
上传时间： 2013-12-11
上传用户：z754970244
