Many thermal metrics exist for integrated circuit (IC) packages ranging from θja to Ψjt.Often, these thermal metrics are misapplied by customers who try to use them to estimate junction temperatures in their systems.
上传时间： 2013-10-18
上传用户：猫爱薛定谔
PCB LAYOUT 術語解釋(TERMS)1. COMPONENT SIDE(零件面、正面)︰大多數零件放置之面。2. SOLDER SIDE(焊錫面、反面)。3. SOLDER MASK(止焊膜面)︰通常指Solder Mask Open 之意。4. TOP PAD︰在零件面上所設計之零件腳PAD，不管是否鑽孔、電鍍。5. BOTTOM PAD：在銲錫面上所設計之零件腳PAD，不管是否鑽孔、電鍍。6. POSITIVE LAYER：單、雙層板之各層線路；多層板之上、下兩層線路及內層走線皆屬之。7. NEGATIVE LAYER：通常指多層板之電源層。8. INNER PAD：多層板之POSITIVE LAYER 內層PAD。9. ANTI-PAD：多層板之NEGATIVE LAYER 上所使用之絕緣範圍，不與零件腳相接。10. THERMAL PAD：多層板內NEGATIVE LAYER 上必須零件腳時所使用之PAD，一般稱為散熱孔或導通孔。11. PAD (銲墊)：除了SMD PAD 外，其他PAD 之TOP PAD、BOTTOM PAD 及INNER PAD 之形狀大小皆應相同。12. Moat : 不同信號的 Power& GND plane 之間的分隔線13. Grid : 佈線時的走線格點2. Test Point : ATE 測試點供工廠ICT 測試治具使用ICT 測試點 LAYOUT 注意事項:PCB 的每條TRACE 都要有一個作為測試用之TEST PAD(測試點)，其原則如下：1. 一般測試點大小均為30-35mil，元件分布較密時，測試點最小可至30mil.測試點與元件PAD 的距離最小為40mil。2. 測試點與測試點間的間距最小為50-75mil，一般使用75mil。密度高時可使用50mil,3. 測試點必須均勻分佈於PCB 上，避免測試時造成板面受力不均。4. 多層板必須透過貫穿孔(VIA)將測試點留於錫爐著錫面上(Solder Side)。5. 測試點必需放至於Bottom Layer6. 輸出test point report(.asc 檔案powerpcb v3.5)供廠商分析可測率7. 測試點設置處:Setuppadsstacks
上传时间： 2013-10-22
上传用户：pei5
Integrated EMI/Thermal Design forSwitching Power SuppliesWei ZhangThesis submitted to the Faculty of theVirginia Polytechnic Institute and State Universityin partial fulfillment of the requirements for the degree of Integrated EMI/Thermal Design forSwitching Power SuppliesWei Zhang(ABSTRACT)This work presents the modeling and analysis of EMI and thermal performancefor switch power supply by using the CAD tools. The methodology and design guidelinesare developed.By using a boost PFC circuit as an example, an equivalent circuit model is builtfor EMI noise prediction and analysis. The parasitic elements of circuit layout andcomponents are extracted analytically or by using CAD tools. Based on the model, circuitlayout and magnetic component design are modified to minimize circuit EMI. EMI filtercan be designed at an early stage without prototype implementation.In the second part, thermal analyses are conducted for the circuit by using thesoftware Flotherm, which includes the mechanism of conduction, convection andradiation. Thermal models are built for the components. Thermal performance of thecircuit and the temperature profile of components are predicted. Improved thermalmanagement and winding arrangement are investigated to reduce temperature.In the third part, several circuit layouts and inductor design examples are checkedfrom both the EMI and thermal point of view. Insightful information is obtained.
上传时间： 2013-11-10
上传用户：1595690
Abstract: It is critically important that lithium-ion battery stacks have a good battery-management system for monitoring many cellvoltages and cell temperatures. Without that monitoring, thermal runaway can lead to a battery explosion. This design idea presentsa low-power circuit that measures the temperature of up to 12 thermistors. It powers and configures the multiplexers, and also putsthe muxes into shutdown to save power when not measuring temperatures.
上传时间： 2013-10-29
上传用户：xwd2010
As the performance of many handheld devices approachesthat of laptop computers, design complexity also increases.Chief among them is thermal management—how doyou meet increasing performance demands while keepinga compact and small product cool in the user’s hand?For instance, as battery capacities inevitably increase,charge currents will also increase to maintain or improvetheir charge times. Traditional linear regulator-based batterychargers will not be able to meet the charge currentand effi ciency demands necessary to allow a product torun cool. What is needed is a switching-based chargerthat takes just about the same amount of space as a linearsolution—but without the heat.
上传时间： 2013-11-23
上传用户：lu2767
Designers spend much time combating thermal effects incircuitry. The close relationship between temperature andelectronic devices is the source of more design headachesthan any other consideration.
上传时间： 2013-10-17
上传用户：风之骄子
AN22 details the theoretical and application aspects of the LT1088 thermal RMS/DC converter. The basic theory behind thermal RMS/DC conversion is discussed and design details of the LT1088 are presented. Circuitry for RMS/DC converters, wideband input buffers and heater protection is shown.
上传时间： 2013-10-16
上传用户：china97wan
The LTM4601 DC/DC μModule regulator is a completehigh power density stepdown regulator for up to 12Acontinuous (14A peak) loads. The device is housed ina small 15mm ¥ 15mm ¥ 2.8mm LGA surface mountpackage, thus the large power dissipation is a challengein some applications. This thermal application note willprovide guidelines for using the μModule regulator inambient environments with or without air fl ow. Loadcurrent derating curves are provided for several inputvoltages and output voltages versus ambient temperatureand air fl ow.
上传时间： 2013-10-19
上传用户：bakdesec
The LTM8020, LTM8021, LTM8022 and LTM8023 μModule®regulators are complete easy-to-use encapsulated stepdownDC/DC regulators intended to take the pain and aggravationout of implementing a switching power supplyonto a system board. With a μModule regulator, you onlyneed an input cap, output cap and one or two resistorsto complete the design. As one might imagine, this highlevel of integration greatly simplifi es the task of printedcircuit board design, reducing the effort to four categories:component footprint generation, component placement,routing the nets, and thermal vias.
上传时间： 2014-01-18
上传用户：laomv123
设计了一种基于PIC16C71单片机的数字水温配制阀。该配制阀采用NTC热敏电阻作温度传感器，与固定电阻组成简单分压电路作为水温测量电路，利用PIC16C71单片机内置的8位A/D转换器把热敏电阻上的模拟电压转换为数字量，PIC16C71单片机控制直流电机驱动混水阀调节冷热水的混合比例实现水温调节。给出了控制电路图，对水温测量电路的参数选择和测温精度作了详细讨论。实验和分析表明，选用阻值较大的NTC热敏电阻和分压电阻可较好地解决热敏电阻因功耗较大造成的热击穿问题。 Abstract: A digital valve for controlling water temperature based on PIC16C71 was presented in this paper.A bleeder circuit which consisted of a NTC thermistor as temperature sensor and a fixed resistance was designed as water temperature measuring circuit.The analog voltage on the thermistor was converted into digital signal by a 8-bit A/D converter embedded in PIC16C71. Based on the digital signal， the MCU PIC16C71 drived the valve by a DC motor to adjust the water temperature through adjusting the proportion of hot water and cold water.The circuit diagram of controller was given，the principle，the component parameters and the accuracy of measuring temperatures were also dissertated in detail. It was found by experiment and analysis that thermal breakdown of thermistor caused by high power could be solved by selecting thermistor and fixed resistance with high impedance value.
上传时间： 2013-11-08
上传用户：Yue Zhong
