WP409利用Xilinx FPGA打造出高端比特精度和周期精度浮点DSP算法实现方案： High-Level Implementation of Bit- and Cycle-Accurate Floating-Point DSP Algorithms with Xilinx FPGAs
上传时间： 2013-11-07
上传用户：defghi010
很多不同的厂家生产各种型号的计算机，它们运行完全不同的操作系统，但TCP.IP协议族允许它们互相进行通信。这一点很让人感到吃惊，因为它的作用已远远超出了起初的设想。T C P / I P起源于6 0年代末美国政府资助的一个分组交换网络研究项目，到9 0年代已发展成为计算机之间最常应用的组网形式。它是一个真正的开放系统，因为协议族的定义及其多种实现可以不用花钱或花很少的钱就可以公开地得到。它成为被称作“全球互联网”或“因特网(Internet)”的基础，该广域网（WA N）已包含超过1 0 0万台遍布世界各地的计算机。本章主要对T C P / I P协议族进行概述，其目的是为本书其余章节提供充分的背景知识。 TCP.IP协议 缩略语 ACK (ACKnowledgment) TCP首部中的确认标志 API (Application Programming Interface) 应用编程接口 ARP (Address Resolution Protocol) 地址解析协议 ARPANET(Defense Advanced Research Project Agency NETwork) (美国)国防部远景研究规划局 AS (Autonomous System) 自治系统 ASCII (American Standard Code for Information Interchange) 美国信息交换标准码 ASN.1 (Abstract Syntax Notation One) 抽象语法记法1 BER (Basic Encoding Rule) 基本编码规则 BGP (Border Gateway Protocol) 边界网关协议 BIND (Berkeley Internet Name Domain) 伯克利I n t e r n e t域名 BOOTP (BOOTstrap Protocol) 引导程序协议 BPF (BSD Packet Filter) BSD 分组过滤器 CIDR (Classless InterDomain Routing) 无类型域间选路 CIX (Commercial Internet Exchange) 商业互联网交换 CLNP (ConnectionLess Network Protocol) 无连接网络协议 CRC (Cyclic Redundancy Check) 循环冗余检验 CSLIP (Compressed SLIP) 压缩的S L I P CSMA (Carrier Sense Multiple Access) 载波侦听多路存取 DCE (Data Circuit-terminating Equipment) 数据电路端接设备 DDN (Defense Data Network) 国防数据网 DF (Don’t Fragment) IP首部中的不分片标志 DHCP (Dynamic Host Configuration Protocol) 动态主机配置协议 DLPI (Data Link Provider Interface) 数据链路提供者接口 DNS (Domain Name System) 域名系统 DSAP (Destination Service Access Point) 目的服务访问点 DSLAM (DSL Access Multiplexer) 数字用户线接入复用器 DSSS (Direct Sequence Spread Spectrum) 直接序列扩频 DTS (Distributed Time Service) 分布式时间服务 DVMRP (Distance Vector Multicast Routing Protocol) 距离向量多播选路协议 EBONE (European IP BackbONE) 欧洲I P主干网 EOL (End of Option List) 选项清单结束 EGP (External Gateway Protocol) 外部网关协议 EIA (Electronic Industries Association) 美国电子工业协会 FCS (Frame Check Sequence) 帧检验序列 FDDI (Fiber Distributed Data Interface) 光纤分布式数据接口 FIFO (First In, First Out) 先进先出 FIN (FINish) TCP首部中的结束标志 FQDN (Full Qualified Domain Name) 完全合格的域名 FTP (File Transfer Protocol) 文件传送协议 HDLC (High-level Data Link Control) 高级数据链路控制 HELLO 选路协议 IAB (Internet Architecture Board) Internet体系结构委员会 IANA (Internet Assigned Numbers Authority) Internet号分配机构 ICMP (Internet Control Message Protocol) Internet控制报文协议 IDRP (InterDomain Routing Protocol) 域间选路协议 IEEE (Institute of Electrical and Electronics Engineering) （美国）电气与电子工程师协会 IEN (Internet Experiment Notes) 互联网试验注释 IESG (Internet Engineering Steering Group) Internet工程指导小组 IETF (Internet Engineering Task Force) Internet工程专门小组 IGMP (Internet Group Management Protocol) Internet组管理协议 IGP (Interior Gateway Protocol) 内部网关协议 IMAP (Internet Message Access Protocol) Internet报文存取协议 IP (Internet Protocol) 网际协议 I RTF (Internet Research Task Force) Internet研究专门小组 IS-IS (Intermediate System to Intermediate System Protocol) 中间系统到中间系统协议 ISN (Initial Sequence Number) 初始序号 ISO (International Organization for Standardization) 国际标准化组织 ISOC (Internet SOCiety) Internet协会 LAN (Local Area Network) 局域网 LBX (Low Bandwidth X) 低带宽X LCP (Link Control Protocol) 链路控制协议 LFN (Long Fat Net) 长肥网络 LIFO (Last In, First Out) 后进先出 LLC (Logical Link Control) 逻辑链路控制 LSRR (Loose Source and Record Route) 宽松的源站及记录路由 MBONE (Multicast Backbone On the InterNEt) Internet上的多播主干网 MIB (Management Information Base) 管理信息库 MILNET (MILitary NETwork) 军用网 MIME (Multipurpose Internet Mail Extensions) 通用I n t e r n e t邮件扩充 MSL (Maximum Segment Lifetime) 报文段最大生存时间 MSS (Maximum Segment Size) 最大报文段长度 M TA (Message Transfer Agent) 报文传送代理 MTU (Maximum Transmission Unit) 最大传输单元 NCP (Network Control Protocol) 网络控制协议 NFS (Network File System) 网络文件系统 NIC (Network Information Center) 网络信息中心 NIT (Network Interface Tap) 网络接口栓（S u n公司的一个程序） NNTP (Network News Transfer Protocol) 网络新闻传送协议 NOAO (National Optical Astronomy Observatories) 国家光学天文台 NOP (No Operation) 无操作 NSFNET (National Science Foundation NETwork) 国家科学基金网络 NSI (NASA Science Internet) （美国）国家宇航局I n t e r n e t NTP (Network Time Protocol) 网络时间协议 NVT (Network Virtual Terminal) 网络虚拟终端 OSF (Open Software Foudation) 开放软件基金 OSI (Open Systems Interconnection) 开放系统互连 OSPF (Open Shortest Path First) 开放最短通路优先 PAWS (Protection Against Wrapped Sequence number) 防止回绕的序号 PDU (Protocol Data Unit) 协议数据单元 POSIX (Portable Operating System Interface) 可移植操作系统接口 PPP (Point-to-Point Protocol) 点对点协议 PSH (PuSH) TCP首部中的急迫标志 RARP (Reverse Address Resolution Protocol) 逆地址解析协议 RFC (Request For Comments) Internet的文档，其中的少部分成为标准文档 RIP (Routing Information Protocol) 路由信息协议 RPC (Remote Procedure Call) 远程过程调用 RR (Resource Record) 资源记录 RST (ReSeT) TCP首部中的复位标志 RTO (Retransmission Time Out) 重传超时 RTT (Round-Trip Time) 往返时间 SACK (Selective ACKnowledgment) 有选择的确认 SLIP (Serial Line Internet Protocol) 串行线路I n t e r n e t协议 SMI (Structure of Management Information) 管理信息结构 SMTP (Simple Mail Transfer Protocol) 简单邮件传送协议 SNMP (Simple Network Management Protocol) 简单网络管理协议 SSAP (Source Service Access Point) 源服务访问点 SSRR (Strict Source and Record Route) 严格的源站及记录路由 SWS (Silly Window Syndrome) 糊涂窗口综合症 SYN (SYNchronous) TCP首部中的同步序号标志 TCP (Transmission Control Protocol) 传输控制协议 TFTP (Trivial File Transfer Protocol) 简单文件传送协议 TLI (Transport Layer Interface) 运输层接口 TTL (Ti m e - To-Live) 生存时间或寿命 TUBA (TCP and UDP with Bigger Addresses) 具有更长地址的T C P和U D P Telnet 远程终端协议 UA (User Agent) 用户代理 UDP (User Datagram Protocol) 用户数据报协议 URG (URGent) TCP首部中的紧急指针标志 UTC (Coordinated Universal Time) 协调的统一时间 UUCP (Unix-to-Unix CoPy) Unix到U n i x的复制 WAN (Wide Area Network) 广域网 WWW (World Wide Web) 万维网 XDR (eXternal Data Representation) 外部数据表示 XID (transaction ID) 事务标识符 XTI (X/Open Transport Layer Interface) X/ O p e n运输层接口
上传时间： 2013-11-13
上传用户：tdyoung
The LPC4350/30/20/10 are ARM Cortex-M4 based microcontrollers for embeddedapplications. The ARM Cortex-M4 is a next generation core that offers systemenhancements such as low power consumption, enhanced debug features, and a highlevel of support block integration.The LPC4350/30/20/10 operate at CPU frequencies of up to 150 MHz. The ARMCortex-M4 CPU incorporates a 3-stage pipeline, uses a Harvard architecture withseparate local instruction and data buses as well as a third bus for peripherals, andincludes an internal prefetch unit that supports speculative branching. The ARMCortex-M4 supports single-cycle digital signal processing and SIMD instructions. Ahardware floating-point processor is integrated in the core.The LPC4350/30/20/10 include an ARM Cortex-M0 coprocessor, up to 264 kB of datamemory, advanced configurable peripherals such as the State Configurable Timer (SCT)and the Serial General Purpose I/O (SGPIO) interface, two High-speed USB controllers,Ethernet, LCD, an external memory controller, and multiple digital and analog peripherals
上传时间： 2013-10-28
上传用户：15501536189
Abstract: Designers who must interface 1-Wire temperature sensors with Xilinx field-programmable gate arrays(FPGAs) can use this reference design to drive a DS28EA00 1-Wire slave device. The downloadable softwarementioned in this document can also be used as a starting point to connect other 1-Wire slave devices. The systemimplements a 1-Wire master connected to a UART and outputs temperature to a PC from the DS28EA00 temperaturesensor. In addition, high/low alarm outputs are displayed from the DS28EA00 PIO pins using LEDs.
标签： PicoBlaze Create Master Xilinx
上传时间： 2013-11-12
上传用户：大三三
WP409利用Xilinx FPGA打造出高端比特精度和周期精度浮点DSP算法实现方案： High-Level Implementation of Bit- and Cycle-Accurate Floating-Point DSP Algorithms with Xilinx FPGAs
上传时间： 2013-10-21
上传用户：huql11633
The fundamental problem of communication is that of reproducing at one point either exactly or approximately a message selected at another point. Frequently the messages have meaning; that is they refer to or are correlated according to some system with certain physical or conceptual entities.
标签： 通信
上传时间： 2013-11-11
上传用户：xy@1314
PCB LAYOUT 術語解釋(TERMS)1. COMPONENT SIDE(零件面、正面)︰大多數零件放置之面。2. SOLDER SIDE(焊錫面、反面)。3. SOLDER MASK(止焊膜面)︰通常指Solder Mask Open 之意。4. TOP PAD︰在零件面上所設計之零件腳PAD，不管是否鑽孔、電鍍。5. BOTTOM PAD：在銲錫面上所設計之零件腳PAD，不管是否鑽孔、電鍍。6. POSITIVE LAYER：單、雙層板之各層線路；多層板之上、下兩層線路及內層走線皆屬之。7. NEGATIVE LAYER：通常指多層板之電源層。8. INNER PAD：多層板之POSITIVE LAYER 內層PAD。9. ANTI-PAD：多層板之NEGATIVE LAYER 上所使用之絕緣範圍，不與零件腳相接。10. THERMAL PAD：多層板內NEGATIVE LAYER 上必須零件腳時所使用之PAD，一般稱為散熱孔或導通孔。11. PAD (銲墊)：除了SMD PAD 外，其他PAD 之TOP PAD、BOTTOM PAD 及INNER PAD 之形狀大小皆應相同。12. Moat : 不同信號的 Power& GND plane 之間的分隔線13. Grid : 佈線時的走線格點2. Test Point : ATE 測試點供工廠ICT 測試治具使用ICT 測試點 LAYOUT 注意事項:PCB 的每條TRACE 都要有一個作為測試用之TEST PAD(測試點)，其原則如下：1. 一般測試點大小均為30-35mil，元件分布較密時，測試點最小可至30mil.測試點與元件PAD 的距離最小為40mil。2. 測試點與測試點間的間距最小為50-75mil，一般使用75mil。密度高時可使用50mil,3. 測試點必須均勻分佈於PCB 上，避免測試時造成板面受力不均。4. 多層板必須透過貫穿孔(VIA)將測試點留於錫爐著錫面上(Solder Side)。5. 測試點必需放至於Bottom Layer6. 輸出test point report(.asc 檔案powerpcb v3.5)供廠商分析可測率7. 測試點設置處:Setuppadsstacks
上传时间： 2013-11-17
上传用户：cjf0304
Integrated EMI/Thermal Design forSwitching Power SuppliesWei ZhangThesis submitted to the Faculty of theVirginia Polytechnic Institute and State Universityin partial fulfillment of the requirements for the degree of Integrated EMI/Thermal Design forSwitching Power SuppliesWei Zhang(ABSTRACT)This work presents the modeling and analysis of EMI and thermal performancefor switch power supply by using the CAD tools. The methodology and design guidelinesare developed.By using a boost PFC circuit as an example, an equivalent circuit model is builtfor EMI noise prediction and analysis. The parasitic elements of circuit layout andcomponents are extracted analytically or by using CAD tools. Based on the model, circuitlayout and magnetic component design are modified to minimize circuit EMI. EMI filtercan be designed at an early stage without prototype implementation.In the second part, thermal analyses are conducted for the circuit by using thesoftware Flotherm, which includes the mechanism of conduction, convection andradiation. Thermal models are built for the components. Thermal performance of thecircuit and the temperature profile of components are predicted. Improved thermalmanagement and winding arrangement are investigated to reduce temperature.In the third part, several circuit layouts and inductor design examples are checkedfrom both the EMI and thermal point of view. Insightful information is obtained.
上传时间： 2013-11-16
上传用户：萍水相逢
LAYOUT REPORT .............. 1 目錄.................. 1 1. PCB LAYOUT 術語解釋(TERMS)......... 2 2. Test Point : ATE 測試點供工廠ICT 測試治具使用............ 2 3. 基準點 (光學點) -for SMD:........... 4 4. 標記 (LABEL ING)......... 5 5. VIA HOLE PAD................. 5 6. PCB Layer 排列方式...... 5 7.零件佈置注意事項 (PLACEMENT NOTES)............... 5 8. PCB LAYOUT 設計............ 6 9. Transmission Line ( 傳輸線 )..... 8 10.General Guidelines – 跨Plane.. 8 11. General Guidelines – 繞線....... 9 12. General Guidelines – Damping Resistor. 10 13. General Guidelines - RJ45 to Transformer................. 10 14. Clock Routing Guideline........... 12 15. OSC & CRYSTAL Guideline........... 12 16. CPU
上传时间： 2013-10-29
上传用户：1234xhb
The power of programmability gives industrial automation designers a highly efficient， cost-effective alternative to traditional motor control units （MCUs）。 The parallel-processing power， fast computational speeds， and connectivity versatility of Xilinx® FPGAs can accelerate the implementation of advanced motor control algorithms such as Field Oriented Control （FOC）。 Additionally， Xilinx devices lower costs with greater on-chip integration of system components and shorten latencies with high-performance digital signal processing （DSP） that can tackle compute-intensive functions such as PID Controller， Clark/Park transforms， and Space Vector PWM. The Xilinx Spartan®-6 FPGA Motor Control Development Kit gives designers an ideal starting point for evaluating time-saving， proven， motor-control reference designs. The kit also shortens the process of developing custom control capabilities， with integrated peripheral functions （Ethernet， PowerLink， and PCI® Express）， a motor-control FPGA mezzanine card （FMC） with built-in Texas Instruments motor drivers and high-precision Delta-Sigma modulators， and prototyping support for evaluating alternative front-end circuitry.
上传时间： 2013-10-28
上传用户：wujijunshi
