Advances in low power electronics now allow placementof battery-powered sensors and other devices in locationsfar from the power grid. Ideally, for true grid independence,the batteries should not need replacement, but instead berecharged using locally available renewable energy, suchas solar power. This Design Note shows how to producea compact battery charger that operates from a small2-cell solar panel. A unique feature of this design is thatthe DC/DC converter uses power point control to extractmaximum power from the solar panel.
上传时间： 2014-01-20
上传用户：wettetw
The LTC®4151 is a high side power monitor that includesa 12-bit ADC for measuring current and voltage, as wellas the voltage on an auxiliary input. Data is read throughthe widely used I2C interface. An unusual feature in thisdevice is its 7V to 80V operating range, allowing it to coverapplications from 12V automotive to 48V telecom.
上传时间： 2013-10-29
上传用户：集美慧
The SN65LBC170 and SN75LBC170 aremonolithic integrated circuits designed forbidirectional data communication on multipointbus-transmission lines. Potential applicationsinclude serial or parallel data transmission, cabledperipheral buses with twin axial, ribbon, ortwisted-pair cabling. These devices are suitablefor FAST-20 SCSI and can transmit or receivedata pulses as short as 25 ns, with skew lessthan 3 ns.These devices combine three 3-state differentialline drivers and three differential input linereceivers, all of which operate from a single 5-Vpower supply.The driver differential outputs and the receiverdifferential inputs are connected internally to formthree differential input/output (I/O) bus ports thatare designed to offer minimum loading to the buswhenever the driver is disabled or VCC = 0. Theseports feature a wide common-mode voltage rangemaking the device suitable for party-lineapplications over long cable runs.
上传时间： 2013-10-13
上传用户：ytulpx
NXP Semiconductor designed the LPC2400 microcontrollers around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded Trace. The LPC2400 microcontrollers have 512 kB of on-chip high-speedFlash memory. This Flash memory includes a special 128-bit wide memory interface andaccelerator architecture that enables the CPU to execute sequential instructions fromFlash memory at the maximum 72 MHz system clock rate. This feature is available onlyon the LPC2000 ARM Microcontroller family of products. The LPC2400 can execute both32-bit ARM and 16-bit Thumb instructions. Support for the two Instruction Sets meansEngineers can choose to optimize their application for either performance or code size atthe sub-routine level. When the core executes instructions in Thumb state it can reducecode size by more than 30 % with only a small loss in performance while executinginstructions in ARM state maximizes core performance.
上传时间： 2013-11-15
上传用户：zouxinwang
MPLAB C30用户指南(英文) HIGHLIGHTSThe information covered in this chapter is as follows:• About this Guide• Recommended Reading• Troubleshooting• The Microchip Web Site• Development Systems Customer Notification Service• Customer Support Document LayoutThe document layout is as follows:• Chapter 1: Compiler Overview – describes MPLAB C30, development tools andfeature set.• Chapter 2: Differences between MPLAB C30 and ANSI C – describes thedifferences between the C language supported by MPLAB C30 syntax and thestandard ANSI-89 C.• Chapter 3: Using MPLAB C30 – describes how to use the MPLAB C30 compilerfrom the command line.• Chapter 4: MPLAB C30 Runtime Environment – describes the MPLAB C30runtime model, including information on sections, initialization, memory models, thesoftware stack and much more.• Chapter 5: Data Types – describes MPLAB C30 integer, floating point and pointerdata types.• Chapter 6: Device Support Files – describes the MPLAB C30 header and registerdefinition files, as well as how to use with SFR’s.• Chapter 7: Interrupts – describes how to use interrupts.• Chapter 8: Mixing Assembly Language and C Modules – provides guidelines tousing MPLAB C30 with MPLAB ASM30 assembly language modules.
上传时间： 2013-10-21
上传用户：13925096126
The HCS12X family is the successor to the HCS12family, with many additional features. One new feature isthe increased memory available to the CPU and themethods available to access it. This document focuses onthe improved memory map configuration.
上传时间： 2013-11-13
上传用户：王者A
提出了一种改进的LSM-ALSM子空间模式识别方法，将LSM的旋转策略引入ALSM，使子空间之间互不关联的情况得到改善，提高了ALSM对相似样本的区分能力。讨论中以性能函数代替经验函数来确定拒识规则的参数，实现了识别率、误识率与拒识率之间的最佳平衡；通过对有限字符集的实验结果表明，LSM-ALSM算法有效地改善了分类器的识别率和可靠性。关 键 词 学习子空间; 性能函数; 散布矩阵; 最小描述长度在子空间模式识别方法中，一个线性子空间代表一个模式类别，该子空间由反映类别本质的一组特征矢量张成，分类器根据输入样本在各子空间上的投影长度将其归为相应的类别。典型的子空间算法有以下三种[1, 2]：CLAFIC(Class-feature Information Compression)算法以相关矩阵的部分特征向量来构造子空间，实现了特征信息的压缩，但对样本的利用为一次性，不能根据分类结果进行调整和学习，对样本信息的利用不充分；学习子空间方法(Leaning Subspace Method, LSM)通过旋转子空间来拉大样本所属类别与最近邻类别的距离，以此提高分类能力，但对样本的训练顺序敏感，同一样本训练的顺序不同对子空间构造的影响就不同；平均学习子空间算法(Averaged Learning Subspace Method, ALSM)是在迭代训练过程中，用错误分类的样本去调整散布矩阵，训练结果与样本输入顺序无关，所有样本平均参与训练，其不足之处是各模式的子空间之间相互独立。针对以上问题，本文提出一种改进的子空间模式识别方法。子空间模式识别的基本原理1.1 子空间的分类规则子空间模式识别方法的每一类别由一个子空间表示，子空间分类器的基本分类规则是按矢量在各子空间上的投影长度大小，将样本归类到最大长度所对应的类别，在类x()iω的子空间上投影长度的平方为()211,2,,()argmax()jMTkkjpg===Σx (1)式中 函数称为分类函数；为子空间基矢量。两类的分类情况如图1所示。
上传时间： 2013-12-25
上传用户：熊少锋
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
上传时间： 2013-10-22
上传用户：ztj182002
The C8051F020/1/2/3 devices are fully integrated mixed-signal System-on-a-Chip MCUs with 64 digital I/O pins (C8051F020/2) or 32 digital I/O pins (C8051F021/3). Highlighted features are listed below; refer to Table 1.1 for specific product feature selection.
上传时间： 2013-11-08
上传用户：lwq11
With the Altera Nios II embedded processor, you as the system designercan accelerate time-critical software algorithms by adding custominstructions to the Nios II processor instruction set. Using custominstructions, you can reduce a complex sequence of standard instructionsto a single instruction implemented in hardware. You can use this featurefor a variety of applications, for example, to optimize software innerloops for digital signal processing (DSP), packet header processing, andcomputation-intensive applications. The Nios II configuration wizard,part of the Quartus® II software’s SOPC Builder, provides a graphicaluser interface (GUI) used to add up to 256 custom instructions to theNios II processor
上传时间： 2013-11-07
上传用户：swing
