用matlab编了一个damping程序，希望大家有帮助
上传时间： 2014-01-12
上传用户：qazxsw
BGA布线指南 BGA CHIP PLACEMENT AND ROUTING RULE BGA是PCB上常用的组件，通常CPU、NORTH BRIDGE、SOUTH BRIDGE、AGP CHIP、CARD BUS CHIP…等，大多是以bga的型式包装，简言之，80﹪的高频信号及特殊信号将会由这类型的package内拉出。因此，如何处理BGA package的走线，对重要信号会有很大的影响。 通常环绕在BGA附近的小零件，依重要性为优先级可分为几类： 1. by pass。 2. clock终端RC电路。 3. damping（以串接电阻、排组型式出现；例如memory BUS信号） 4. EMI RC电路（以dampin、C、pull height型式出现；例如USB信号）。 5. 其它特殊电路（依不同的CHIP所加的特殊电路；例如CPU的感温电路）。 6. 40mil以下小电源电路组（以C、L、R等型式出现；此种电路常出现在AGP CHIP or含AGP功能之CHIP附近，透过R、L分隔出不同的电源组）。 7. pull low R、C。 8. 一般小电路组（以R、C、Q、U等型式出现；无走线要求）。 9. pull height R、RP。 中文DOC，共5页，图文并茂
上传时间： 2013-04-24
上传用户：cxy9698
LAYOUT REPORT .............. 1 目錄.................. 1 1. PCB LAYOUT 術語解釋(TERMS)......... 2 2. Test Point : ATE 測試點供工廠ICT 測試治具使用............ 2 3. 基準點 (光學點) -for SMD:........... 4 4. 標記 (LABEL ING)......... 5 5. VIA HOLE PAD................. 5 6. PCB Layer 排列方式...... 5 7.零件佈置注意事項 (PLACEMENT NOTES)............... 5 8. PCB LAYOUT 設計............ 6 9. Transmission Line ( 傳輸線 )..... 8 10.General Guidelines – 跨Plane.. 8 11. General Guidelines – 繞線....... 9 12. General Guidelines – damping Resistor. 10 13. General Guidelines - RJ45 to Transformer................. 10 14. Clock Routing Guideline........... 12 15. OSC & CRYSTAL Guideline........... 12 16. CPU
上传时间： 2013-12-20
上传用户：康郎
LAYOUT REPORT .............. 1 目錄.................. 1 1. PCB LAYOUT 術語解釋(TERMS)......... 2 2. Test Point : ATE 測試點供工廠ICT 測試治具使用............ 2 3. 基準點 (光學點) -for SMD:........... 4 4. 標記 (LABEL ING)......... 5 5. VIA HOLE PAD................. 5 6. PCB Layer 排列方式...... 5 7.零件佈置注意事項 (PLACEMENT NOTES)............... 5 8. PCB LAYOUT 設計............ 6 9. Transmission Line ( 傳輸線 )..... 8 10.General Guidelines – 跨Plane.. 8 11. General Guidelines – 繞線....... 9 12. General Guidelines – damping Resistor. 10 13. General Guidelines - RJ45 to Transformer................. 10 14. Clock Routing Guideline........... 12 15. OSC & CRYSTAL Guideline........... 12 16. CPU
上传时间： 2013-10-29
上传用户：1234xhb
This paper presents a new type of electromagnetic damper with rotating inertial mass that has been devel oped to control the vibrations of structures subjected to earthquakes. The electromagnetic inertial mass damper (EIMD) consists of a ball screw that converts axial oscillation of the rod end into rotational motion of the internal flflywheel and an electric generator that is turned by the rotation of the inner rod. The EIMD is able to generate a large inertial force created by the rotating flflywheel and a variable damping force devel oped by the electric generator. Device performance tests of reduced-scale and full-scale EIMDs were under taken to verify the basic characteristics of the damper and the validity of the derived theoretical formulae. Shaking table tests of a three-story structure with EIMDs and earthquake response analyses of a building with EIMDs were conducted to demonstrate the seismic response control performance of the EIMD. The EIMD is able to reduce story drifts as well as accelerations and surpasses conventional types of dampers in reducing acceleration responses.
标签： electromagnetic response Seismic control using
上传时间： 2021-11-04
上传用户：a1293065
