The PW3130 series product is a high integration solution for lithium-lion/polymer batteryprotection.PW3130 contains advanced power MOSFET, high-accuracy voltage detection circuits anddelay circuits. PW3130 is put into an ultra-small SOT23-5 package and only one external componentmakes it an ideal solution in limited space of battery pack. PW3130 has all the protection functionsrequired in the battery application including overcharging, overdischarging, overcurrent and loadshort circuiting protection etc. The accurate overcharging detection voltage ensures safe and fullutilization charging.The low standby current drains little current from the cell while in storage. Thedevice is not only targeted for digital cellular phones, but also for any other Li-Ion and Li-Polybattery-powered information appliances requiring long-term battery life
标签： pw3130
上传时间： 2022-02-11
上传用户：fliang
The PW2601 is a charger front-end integrated circuit designed to provide protection to Li-ionbatteries from failures of charging circuitry. The device monitors the input voltage, battery voltageand the charging current to make sure all three parameters are operated in normal range. Thedevice will switch off internal MOSFET to disconnect IN to OUT to protect load when any of inputvoltage, output current exceeds the threshold. The Over temperature protection (OTP) functionmonitors chip temperature to protect the device. The PW2601 also can protect the system’sbattery from being over charged by monitors the battery voltage continuously. The deviceoperates like a linear regulator, maintaining a 5.1V output with input voltages up to the input overvoltage threshold.The PW2601 is available in DFN-2x2-8L package. Standard products are Pb-free and Halogenfree
标签： pw2601
上传时间： 2022-02-11
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The PW2312 is a high frequency, synchronous, rectified, step-down, switch-mode converter withinternal power MOSFETs. It offers a very compact solution to achieve a 1.5A peak output currentover a wide input supply range, with excellent load and line regulation.The PW2312 requires a minimal number of readily available, external components and is available ina space saving SOT23-6 package.
标签： pw2312
上传时间： 2022-02-11
上传用户：qingfengchizhu
The PW2228A is a high efficiency single inductor Buck-Boost converter which can supply theload current up to 1.5A. It provides auto-transition between Buck and Boost Mode. The PW2228Aoperates at 2.4MHz switching frequency in CCM. DC/DC converter operates at Pulse-Skipping Modeat light load. The output voltage is programmable using an external resistor divider, or is fixed to3.3V internally. The load is disconnected from the VIN during shutdown.The PW2228A is available in TDFN3X3-10 package.
标签： pw2228a
上传时间： 2022-02-11
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The PW2163D is a high frequency, synchronous, rectified, step-down, switch-mode converter withinternal powerMOSFETs. It offers a very compact solution to provide a 3A continuous current over awide input supply range,with excellent load and line regulation.The PW2163D requires a minimal number of readily available, external components and is availablein a spacesaving SOT23-6 package
标签： pw2163d
上传时间： 2022-02-11
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The PW2162 is a fully integrated, high– efficiency 2A synchronous rectified step-down converter.The PW2162 operates at high efficiency over a wide output current load range. This device offerstwo operation modes, PWM control and PFM Mode switching control, which allows a high efficiencyover the wider range of the load. The PW2162 requires a minimum number of readily availablestandard external components and is available in an 6-pin SOT23 ROHS compliant package.
标签： pw2162
上传时间： 2022-02-11
上传用户：d1997wayne
SCB10H series pressure elements are high performance absolute pressure sensors. The sensors are based on Murata's proven capacitive 3D-MEMS technology. They enable exceptional possibility for OEM customers to integrate pressure measurement function in an optimal way into their products. SCB10H series elements can be designed to match the application specific pressure range. It is a bare capacitive sensor element that enables optimized application specific package and electronics design.
标签： 传感器
上传时间： 2022-03-03
上传用户：
目前cPU+ Memory等系统集成的多芯片系统级封装已经成为3DSiP（3 Dimension System in Package，三维系统级封装）的主流，非常具有代表性和市场前景，SiP作为将不同种类的元件，通过不同技术，混载于同一封装内的一种系统集成封装形式，不仅可搭载不同类型的芯片，还可以实现系统的功能。然而，其封装具有更高密度和更大的发热密度和热阻，对封装技术具有更大的挑战。因此，对SiP封装的工艺流程和SiP封装中的湿热分布及它们对可靠性影响的研究有着十分重要的意义本课题是在数字电视（DTV）接收端子系统模块设计的基础上对CPU和DDR芯片进行芯片堆叠的SiP封装。封装形式选择了适用于小型化的BGA封装，结构上采用CPU和DDR两芯片堆叠的3D结构，以引线键合的方式为互连，实现小型化系统级封装。本文研究该SP封装中芯片粘贴工艺及其可靠性，利用不导电胶将CPU和DDR芯片进行了堆叠贴片，分析总结了SiP封装堆叠贴片工艺最为关键的是涂布材料不导电胶的体积和施加在芯片上作用力大小，对制成的样品进行了高温高湿试验，分析湿气对SiP封装的可靠性的影响。论文利用有限元软件 Abaqus对SiP封装进行了建模，模型包括热应力和湿气扩散模型。模拟分析了封装体在温度循环条件下，受到的应力、应变、以及可能出现的失效形式：比较了相同的热载荷条件下，改变塑封料、粘结层的材料属性，如杨氏模量、热膨胀系数以及芯片、粘结层的厚度等对封装体应力应变的影响。并对封装进行了湿气吸附分析，研究了SiP封装在85℃RH85%环境下吸湿5h、17h、55和168h后的相对湿度分布情况，还对SiP封装在湿热环境下可能产生的可靠性问题进行了实验研究。在经过168小时湿气预处理后，封装外部的基板和模塑料基本上达到饱和。模拟结果表明湿应力同样对封装的可靠性会产生重要影响。实验结果也证实了，SiP封装在湿气环境下引入的湿应力对可靠性有着重要影响。论文还利用有限元分析方法对超薄多芯片SiP封装进行了建模，对其在温度循环条件下的应力、应变以及可能的失效形式进行了分析。采用二水平正交试验设计的方法研究四层芯片、四层粘结薄膜、塑封料等9个封装组件的厚度变化对芯片上最大应力的影响，从而找到最主要的影响因子进行优化设计，最终得到更优化的四层芯片叠层SiP封装结构。
标签： sip封装
上传时间： 2022-04-08
上传用户：
S32K1xx Series Reference Manual 用户手册--2029页 Supports S32K116, S32K118, S32K142, S32K144, S32K146, and S32K148S32K是一款符合AEC-Q100规范、基于32位ARM Cortex-M4F和Cortex-M0+内核的MCU，适用于通用汽车和高可靠性工业应用。The S32K1xx product series further extends the highly scalable portfolio of Arm® Cortex®-M0+/M4F MCUs in the automotive industry. It builds on the legacy of the KEA series, while introducing higher memory options alongside a richer peripheral set extending capability into a variety of automotive applications. With a 2.70–5.5 V supply and focus on automotive environment robustness, the S32K product series devices are well suited to a wide range of applications in electrically harsh environments, and are optimized for cost-sensitive applications offering low pin-count options. The S32K product series offers a broad range of memory, peripherals, and package options. It shares common peripherals and pin counts, allowing developers to migrate easily within an MCU family or among the MCU families to take advantage of more memory or feature integration. This scalability allows developers to use the S32K product series as the standard for their end product platforms, maximizing hardware and software reuse and reducing time to market
标签： S32K116 S32K118 S32K142 S32K144
上传时间： 2022-04-16
上传用户：jason_vip1
Vivado设计分为Project Mode和Non-project Mode两种模式，一般简单设计中，我们常用的是Project Mode。在本手册中，我们将以一个简单的实验案例，一步一步的完成Vivado的整个设计流程一、新建工程1、打开Vivado 2013.4开发工具，可通过桌面快捷方式或开始菜单中xilinx DesignTools-Vivado 2013.4下的Vivado 2013.4打开软件，开启后，软件如下所示：2、单击上述界面中Create New Project图标，弹出新建工程向导，点击Next.3、输入工程名称、选择工程存储路径，并勾选Create project subdirectory选项，为工程在指定存储路径下建立独立的文件夹。设置完成后，点击Next注意：工程名称和存储路径中不能出现中文和空格，建议工程名称以字母、数字、下划线来组成。4、选择RTL Project一项，并勾选Do not specifty sources at this time，勾选该选项是为了跳过在新建工程的过程中添加设计源文件。点击Next.IA5、根据使用的FPGA开发平台，选择对应的FPGA目标器件。（在本手册中，以xilinx官方开发板KC705为例，Nexys4开发板请选择Artix-7 XC7A100TCSG324-2的器件，即Family和Subfamily均为Artix-7，封装形式（Package）为cSG324，速度等级（Speed grade）为-1，温度等级（Temp Grade）为C）。点击Next6、确认相关信息与设计所用的的FPGA器件信息是否一致，一致请点击Finish，不一致，请返回上一步修改。二、设计文件输入1、如下图所示，点击Flow Navigator下的Project Manager->Add Sources或中间Sources中的对话框打开设计文件导入添加对话框。2、选择第二项Add or Create Design Sources，用来添加或新建Verilog或VHDL源文件，点击Next
标签： vivado
上传时间： 2022-05-28
上传用户：默默
