1.5mm间距BGA封装库bga芯片封装ALTIUM库(AD库PCB封装库 )，51个封装，列表如下：Component Count : 51Component Name-----------------------------------------------BGA150P3X3-9BGA150P4X4-16BGA150P4X4-16ABGA150P5X5-25BGA150P5X5-25ABGA150P5X5-25BBGA150P6X6-36BGA150P6X6-36ABGA150P6X6-36BBGA150P7X7-49BGA150P7X7-49ABGA150P7X7-49BBGA150P8X8-64BGA150P8X8-64ABGA150P8X8-64BBGA150P9X9-81BGA150P9X9-81ABGA150P10X10-100BGA150P10X10-100ABGA150P11X11-121BGA150P11X11-121ABGA150P12X12-144BGA150P13X13-169BGA150P14X14-196BGA150P14X14-196ABGA150P15X15-225BGA150P15X15-225ABGA150P15X15-225BBGA150P16X16-256BGA150P17X17-289BGA150P18X18-324BGA150P18X18-324ABGA150P19X19-361BGA150P19X19-361ABGA150P20X20-400BGA150P21X21-441BGA150P22X22-484BGA150P22X22-484ABGA150P23X23-529BGA150P24X24-576BGA150P25X25-625BGA150P25X25-625ABGA150P26X26-676BGA150P27X27-729BGA150P28X28-784BGA150P29X29-841BGA150P30X30-900BGA150P30X30-900ABGA150P31X31-961BGA150P32X32-1024BGA150P33X33-1089
标签： BGA封装库
上传时间： 2021-11-30
上传用户：qingfengchizhu
0.5mm间距BGA封装库bga芯片封装ALTIUM库(AD库PCB封装库 )，21个，封装型号列表如下：Component Count : 21Component Name-----------------------------------------------BGA50P5X5-25BGA50P5X5-25VBGA50P6X6-36VBGA50P7X7-48BGA50P7X7-49BGA50P7X7-49VBGA50P8X8-56BGA50P8X8-64BGA50P9X9-80BGA50P9X9-81BGA50P10X10-56BGA50P11X11-100BGA50P11X11-120BGA50P11X11-121BGA50P14X14-100BGA50P14X14-132BGA50P14X14-196BGA50P15X15-164BGA50P18X18-180BGA50P19X19-281BGA50P20X20-256
标签： BGA封装库
上传时间： 2021-11-30
上传用户：
0.8mm间距BGA封装库bga芯片封装ALTIUM库(AD库PCB封装库 )，50个，PCB封装列表：Component Count : 50Component Name-----------------------------------------------BGA80P6X6-36BGA80P7X7-48BGA80P7X7-49BGA80P7X7-49ABGA80P8X6-48BGA80P8X8-64BGA80P8X8-64ABGA80P8X8-64BBGA80P9X9-81BGA80P10X10-84BGA80P10X10-100BGA80P10X10-100ABGA80P12X12-128BGA80P12X12-128ABGA80P12X12-128BBGA80P12X12-144BGA80P12X12-144ABGA80P13X13-144ABGA80P13X13-144BBGA80P13X13-144CBGA80P13X13-152BGA80P13X13-169BGA80P14X14-160BGA80P14X14-180BGA80P14X14-180ABGA80P14X14-196BGA80P14X14-196ABGA80P15X15-176BGA80P15X15-177BGA80P16X16-208BGA80P16X16-256BGA80P16X16-256ABGA80P17X17-208BGA80P17X17-208ABGA80P17X17-256BGA80P17X17-272BGA80P17X17-289BGA80P19X19-257BGA80P19X19-257ABGA80P19X19-280ABGA80P19X19-280BBGA80P19X19-280CBGA80P19X19-288BGA80P19X19-332BGA80P20X20-324BGA80P20X20-363BGA80P22X22-240BGA80P22X22-340BGA80P22X22-384BGA80P22X22-484
标签： BGA封装库
上传时间： 2021-11-30
上传用户：xsr1983
1mm间距bga芯片封装库ALTIUM库PCB封装库(AD库 )，114个，封装库型号列表：Component Count : 114Component Name-----------------------------------------------BGA100P5X5-25BGA100P6X6-36BGA100P6X6-36ABGA100P7X7-49BGA100P7X7-49ABGA100P8X8-64BGA100P8X8-64ABGA100P9X9-81BGA100P9X9-81ABGA100P10X10-100BGA100P10X10-100ABGA100P10X10-100BBGA100P10X10-100CBGA100P11X11-121BGA100P11X11-121ABGA100P12X12-144BGA100P12X12-144ABGA100P12X12-144BBGA100P13X13-169BGA100P13X13-169ABGA100P14X14-160BGA100P14X14-176BGA100P14X14-196BGA100P14X14-196BBGA100P15X15-225BGA100P16X16-208BGA100P16X16-256BGA100P16X16-256BBGA100P16X16-256CBGA100P17X17-169BGA100P17X17-289BGA100P18X18-320BGA100P18X18-324BGA100P19X19-361BGA100P20X20-292BGA100P20X20-400BGA100P20X20-400ABGA100P21X21-441BGA100P22X22-324BGA100P22X22-388BGA100P22X22-456BGA100P22X22-484BGA100P22X22-484BBGA100P22X22-484CBGA100P22X22-484DBGA100P23X23-413BGA100P23X23-529BGA100P24X24-552BGA100P24X24-552ABGA100P24X24-552BBGA100P24X24-576BGA100P24X24-576ABGA100P25X25-625BGA100P26X26-352BGA100P26X26-388BGA100P26X26-416BGA100P26X26-452BGA100P26X26-456ABGA100P26X26-484BGA100P26X26-665BGA100P26X26-668BGA100P26X26-672BGA100P26X26-675BGA100P26X26-676BGA100P26X26-676ABGA100P27X27-729BGA100P28X28-780BGA100P28X28-780ABGA100P28X28-783BGA100P28X28-784BGA100P29X29-841BGA100P30X30-516BGA100P30X30-556BGA100P30X30-676BBGA100P30X30-896ABGA100P30X30-900BGA100P31X31-961BGA100P32X32-772BGA100P32X32-772ABGA100P32X32-1020BGA100P32X32-1024BGA100P33X33-1089BGA100P34X34-580BGA100P34X34-680BGA100P34X34-1136BGA100P34X34-1148BGA100P34X34-1152ABGA100P34X34-1152BBGA100P34X34-1153BGA100P34X34-1156BGA100P36X36-1296BGA100P37X37-1369BGA100P38X38-1444BGA100P39X39-680BGA100P39X39-680ABGA100P39X39-792BGA100P39X39-896BGA100P39X39-1508ABGA100P39X39-1513BGA100P39X39-1517BGA100P39X39-1521BGA100P41X41-1681BGA100P42X42-860BGA100P42X42-1696BGA100P42X42-1704BGA100P42X42-1738BGA100P42X42-1760BGA100P42X42-1764
上传时间： 2021-11-30
上传用户：
主板bga芯片焊接拆装工艺视频
上传时间： 2013-11-22
上传用户：GeekyGeek
主板bga芯片焊接拆装工艺视频
上传时间： 2013-11-14
上传用户：tfyt
常用芯片表贴芯片表贴电阻电容STM封装库AD库（ATIUM PCB封装库）:PCB Library : 常用芯片表贴芯片表贴电阻电容STM封装库AD库（ATIUM PCB封装库）.PcbLibDate : 2021/5/14Time : 16:14:01Component Count : 463Component Name-----------------------------------------------LC-12-DIPH-300LC-0201LC-0201_CLC-0201_LLC-0201_RLC-0402LC-0402_CLC-0402_LLC-0402_RLC-0402_Rx2LC-0402_Rx4LC-0603LC-0603_CLC-0603_Cx4LC-0603_LLC-0603_LEDLC-0603_RLC-0603_Rx2LC-0603_Rx4LC-0805LC-0805_CLC-0805_LLC-0805_LEDLC-0805_RLC-1206LC-1206_CLC-1206_LLC-1206_RLC-1210LC-1210_CLC-1210_RLC-1806LC-1806_CLC-1806_LLC-1806_RLC-1808LC-1808_CLC-1808_LLC-1808_RLC-1812LC-1812_CLC-1812_LLC-1812_RLC-1825LC-1825_CLC-1825_LLC-1825_RLC-2010LC-2010_CLC-2010_LLC-2010_RLC-2220LC-2220_CLC-2220_LLC-2220_RLC-2225LC-2225_CLC-2225_RLC-2512LC-2512_CLC-2512_LLC-2512_RLC-ABSLC-BGA-14LC-BGA-84_7.5x12.5mmLC-BGA-121LC-BGA-143LC-BR-3LC-BR-6LC-BR-10LC-CASE 017AA-01LC-CASE-A_3216LC-CASE-B_3528LC-CASE-C_6032LC-CASE-D_7343LC-CASE-E_7343LC-CASE-P_2012LC-CASE-R_2012LC-DBLC-DBSLC-DFN-2LLC-DFN-8_3x3mmLC-DFN-8_5x6mmLC-DFN-10_3x3mmLC-DFN-10_EP_3x3mmLC-DIP-4LC-DIP-5LC-DIP-6LC-DIP-7LC-DIP-8LC-DIP-14LC-DIP-16LC-DIP-18LC-DIP-20LC-DIP-24_300milLC-DIP-24_600milLC-DIP-28_300milLC-DIP-28_600milLC-DIP-40LC-DO-15LC-DO-27LC-DO-35LC-DO-41LC-DO-201ADLC-DO-213AALC-DO-213ABLC-DO-218ABLC-DSON-10LC-FBGA-84_9x12.5mmLC-FBGA-96_8x14mmLC-FBGA-256LC-FBGA-272LC-FBGA-289LC-FBGA-484LC-FBGA-780LC-GBJLC-GBULC-GDTs_SMDLC-GDTs_THTLC-HC-49SLC-HC-49SMDLC-HC-49ULC-HTSSOP-32LC-HVMDIPLC-HVQFN-32_5x5x05PLC-HZIP25-P-1.27LC-KBJLC-KBLLC-KBPLC-KBPCLC-KBULC-LBSLC-LFBGA-217LC-LFCSP-8_3x2x05PLC-LFCSP-8_3x3x05PLC-LFCSP-16_4x4x05PLC-LFCSP-20_4x4x05PLC-LFCSP-24_4x4x05PLC-LFCSP-28_5x5x05PLC-LFCSP40_6x6x05PLC-LFCSP56_8x8x05PLC-LGA-8_3x5mmLC-LGA-14_3x5mmLC-LGA-16_3x3mmLC-LGA-16_4x4mmLC-LL-34LC-LL-35LC-LL-41LC-LPCC-148LC-LQFP-32_7x7x08PLC-LQFP-44_10x10x08PLC-LQFP-48_7x7x05P
上传时间： 2021-12-02
上传用户：
目前cPU+ Memory等系统集成的多芯片系统级封装已经成为3DSiP（3 Dimension System in Package，三维系统级封装）的主流，非常具有代表性和市场前景，SiP作为将不同种类的元件，通过不同技术，混载于同一封装内的一种系统集成封装形式，不仅可搭载不同类型的芯片，还可以实现系统的功能。然而，其封装具有更高密度和更大的发热密度和热阻，对封装技术具有更大的挑战。因此，对SiP封装的工艺流程和SiP封装中的湿热分布及它们对可靠性影响的研究有着十分重要的意义本课题是在数字电视（DTV）接收端子系统模块设计的基础上对CPU和DDR芯片进行芯片堆叠的SiP封装。封装形式选择了适用于小型化的BGA封装，结构上采用CPU和DDR两芯片堆叠的3D结构，以引线键合的方式为互连，实现小型化系统级封装。本文研究该SP封装中芯片粘贴工艺及其可靠性，利用不导电胶将CPU和DDR芯片进行了堆叠贴片，分析总结了SiP封装堆叠贴片工艺最为关键的是涂布材料不导电胶的体积和施加在芯片上作用力大小，对制成的样品进行了高温高湿试验，分析湿气对SiP封装的可靠性的影响。论文利用有限元软件 Abaqus对SiP封装进行了建模，模型包括热应力和湿气扩散模型。模拟分析了封装体在温度循环条件下，受到的应力、应变、以及可能出现的失效形式：比较了相同的热载荷条件下，改变塑封料、粘结层的材料属性，如杨氏模量、热膨胀系数以及芯片、粘结层的厚度等对封装体应力应变的影响。并对封装进行了湿气吸附分析，研究了SiP封装在85℃RH85%环境下吸湿5h、17h、55和168h后的相对湿度分布情况，还对SiP封装在湿热环境下可能产生的可靠性问题进行了实验研究。在经过168小时湿气预处理后，封装外部的基板和模塑料基本上达到饱和。模拟结果表明湿应力同样对封装的可靠性会产生重要影响。实验结果也证实了，SiP封装在湿气环境下引入的湿应力对可靠性有着重要影响。论文还利用有限元分析方法对超薄多芯片SiP封装进行了建模，对其在温度循环条件下的应力、应变以及可能的失效形式进行了分析。采用二水平正交试验设计的方法研究四层芯片、四层粘结薄膜、塑封料等9个封装组件的厚度变化对芯片上最大应力的影响，从而找到最主要的影响因子进行优化设计，最终得到更优化的四层芯片叠层SiP封装结构。
标签： sip封装
上传时间： 2022-04-08
上传用户：
摘要：本文介绍了使用Cadence APD完成一款SIP芯片BGA封装的设计流程。结合Cadence APD在BGA封装设计方面的强大功能，以图文并茂、实际设计为例说明Cadence APD完成包含一块基带芯片和一块RF芯片的BGA封装的设计方法和设计流程。该设计方法对于SIP封装设计、加速设计周期、降低开发成本具有直接的指导价值。关键词：Cadence APD、SIP设计、BGA封装设计1引言随着通讯和消费类电子的飞速发展，电子产品、特别是便携式产品不断向小型化和多功能化发展，对集成电路产品提出了新的要求，更加注重多功能、高集成度、高性能、轻量化、高可靠性和低成本。而产品的快速更新换代，使得研发周期的缩短也越来越重要，更快的进入市场也就意味着更多的利润。微电子封装对集成电路（IC）产品的体积、性能、可靠性质量、成本等都有重要影响，IC成本的40%是用于封装的，而产品失效率中超过25%的失效因素源自封装，封装已成为研发新一代电子系统的关键环节及制约因素（图1.1）。系统封装（Sip）具有高密度封装、多功能化设计、较短的市场进入时间以及更低的开发成本等优势，得到了越来越多的关注。国际上大的封装厂商如ASE、Amkor、ASAT和Starchips等都已经推出了自己的SIP产品。
标签： cadenceapd sip 芯片封装
上传时间： 2022-07-04
上传用户：
视频图像格式转换芯片的算法研究
上传时间： 2013-05-25
上传用户：eeworm
