A History of Haskell - being lazy with class
标签： History Haskell being class
上传时间： 2017-09-17
上传用户：aappkkee
With more and more multi-frequency clocks being used in today's chips, especially in the communications field, it is often necessary to switch the source of a clock line while the chip is running.
上传时间： 2013-10-10
上传用户：1214209695
This application note describes a Linear Technology "Half-Flash" A/D converter, the LTC1099, being connected to a 256 element line scan photodiode array. This technology adapts itself to handheld (i.e., low power) bar code readers, as well as high resolution automated machine inspection applications..
上传时间： 2013-11-21
上传用户：lchjng
Smart Batteries are an increasingly popular choice formore than just traditional compact consumer electronicdevices. For example, Smart Batteries are being used asbattery backup for products such as blade servers, whereknowing battery status is very important
上传时间： 2013-11-02
上传用户：wangzhen1990
The latest generation of Texas Instruments (TI) boardmountedpower modules utilizes a pin interconnect technologythat improves surface-mount manufacturability.These modules are produced as a double-sided surfacemount(DSSMT) subassembly, yielding a case-less constructionwith subcomponents located on both sides of theprinted circuit board (PCB). Products produced in theDSSMT outline use the latest high-efficiency topologiesand magnetic-component packaging. This providescustomers with a high-efficiency, ready-to-use switchingpower module in a compact, space-saving package. Bothnonisolated point-of-load (POL) switching regulators andthe isolated dc/dc converter modules are being producedin the DSSMT outline.TI’s plug-in power product line offers power modules inboth through-hole and surface-mount packages. The surfacemountmodules produced in the DSSMT outline use asolid copper interconnect with an integral solder ball fortheir
上传时间： 2013-10-10
上传用户：1184599859
Analog Inputs and Outputs in an S7 PLC are represented in the PLC as a 16-bit integer. Over the nominal span of the analog input or output, the value of this integer will range between - 27648 and +27648. However, it is easier to use the analog values if they are scaled to the same units and ranges as the process being controlled. This applications tip describes methods for scaling analog values to and from engineering units.
上传时间： 2013-11-17
上传用户：3294322651
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their productsor to discontinue any product or service without notice, and advise customers to obtain the latestversion of relevant information to verify, before placing orders, that information being relied onis current and complete. All products are sold subject to the terms and conditions of sale suppliedat the time of order acknowledgement, including those pertaining to warranty, patentinfringement, and limitation of liability.
标签： Assembly Language C6000 320C
上传时间： 2013-11-12
上传用户：chens000
The PCA82C250 and PCA82C251 are advanced transceiver products for use in automotive and general industrialapplications with transfer rates up to 1 Mbit/s. They support the differential bus signal representation beingdescribed in the international standard for in-vehicle CAN high-speed applications (ISO 11898). Controller AreaNetwork (CAN) is a serial bus protocol being primarily intended for transmission of control related data between anumber of bus nodes.
上传时间： 2013-11-24
上传用户：Alick
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their productsor to discontinue any product or service without notice, and advise customers to obtain the latestversion of relevant information to verify, before placing orders, that information being relied onis current and complete. All products are sold subject to the terms and conditions of sale suppliedat the time of order acknowledgement, including those pertaining to warranty, patentinfringement, and limitation of liability
上传时间： 2013-12-26
上传用户：凌云御清风
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
上传时间： 2013-10-22
上传用户：ztj182002
