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VLS-book4-script

  • 高速PCB基础理论及内存仿真技术(经典推荐)

    第一部分 信号完整性知识基础.................................................................................5第一章 高速数字电路概述.....................................................................................51.1 何为高速电路...............................................................................................51.2 高速带来的问题及设计流程剖析...............................................................61.3 相关的一些基本概念...................................................................................8第二章 传输线理论...............................................................................................122.1 分布式系统和集总电路.............................................................................122.2 传输线的RLCG 模型和电报方程...............................................................132.3 传输线的特征阻抗.....................................................................................142.3.1 特性阻抗的本质.................................................................................142.3.2 特征阻抗相关计算.............................................................................152.3.3 特性阻抗对信号完整性的影响.........................................................172.4 传输线电报方程及推导.............................................................................182.5 趋肤效应和集束效应.................................................................................232.6 信号的反射.................................................................................................252.6.1 反射机理和电报方程.........................................................................252.6.2 反射导致信号的失真问题.................................................................302.6.2.1 过冲和下冲.....................................................................................302.6.2.2 振荡:.............................................................................................312.6.3 反射的抑制和匹配.............................................................................342.6.3.1 串行匹配.........................................................................................352.6.3.1 并行匹配.........................................................................................362.6.3.3 差分线的匹配.................................................................................392.6.3.4 多负载的匹配.................................................................................41第三章 串扰的分析...............................................................................................423.1 串扰的基本概念.........................................................................................423.2 前向串扰和后向串扰.................................................................................433.3 后向串扰的反射.........................................................................................463.4 后向串扰的饱和.........................................................................................463.5 共模和差模电流对串扰的影响.................................................................483.6 连接器的串扰问题.....................................................................................513.7 串扰的具体计算.........................................................................................543.8 避免串扰的措施.........................................................................................57第四章 EMI 抑制....................................................................................................604.1 EMI/EMC 的基本概念..................................................................................604.2 EMI 的产生..................................................................................................614.2.1 电压瞬变.............................................................................................614.2.2 信号的回流.........................................................................................624.2.3 共模和差摸EMI ..................................................................................634.3 EMI 的控制..................................................................................................654.3.1 屏蔽.....................................................................................................654.3.1.1 电场屏蔽.........................................................................................654.3.1.2 磁场屏蔽.........................................................................................674.3.1.3 电磁场屏蔽.....................................................................................674.3.1.4 电磁屏蔽体和屏蔽效率.................................................................684.3.2 滤波.....................................................................................................714.3.2.1 去耦电容.........................................................................................714.3.2.3 磁性元件.........................................................................................734.3.3 接地.....................................................................................................744.4 PCB 设计中的EMI.......................................................................................754.4.1 传输线RLC 参数和EMI ........................................................................764.4.2 叠层设计抑制EMI ..............................................................................774.4.3 电容和接地过孔对回流的作用.........................................................784.4.4 布局和走线规则.................................................................................79第五章 电源完整性理论基础...............................................................................825.1 电源噪声的起因及危害.............................................................................825.2 电源阻抗设计.............................................................................................855.3 同步开关噪声分析.....................................................................................875.3.1 芯片内部开关噪声.............................................................................885.3.2 芯片外部开关噪声.............................................................................895.3.3 等效电感衡量SSN ..............................................................................905.4 旁路电容的特性和应用.............................................................................925.4.1 电容的频率特性.................................................................................935.4.3 电容的介质和封装影响.....................................................................955.4.3 电容并联特性及反谐振.....................................................................955.4.4 如何选择电容.....................................................................................975.4.5 电容的摆放及Layout ........................................................................99第六章 系统时序.................................................................................................1006.1 普通时序系统...........................................................................................1006.1.1 时序参数的确定...............................................................................1016.1.2 时序约束条件...................................................................................1063.2 高速设计的问题.......................................................................................2093.3 SPECCTRAQuest SI Expert 的组件.......................................................2103.3.1 SPECCTRAQuest Model Integrity .................................................2103.3.2 SPECCTRAQuest Floorplanner/Editor .........................................2153.3.3 Constraint Manager .......................................................................2163.3.4 SigXplorer Expert Topology Development Environment .......2233.3.5 SigNoise 仿真子系统......................................................................2253.3.6 EMControl .........................................................................................2303.3.7 SPECCTRA Expert 自动布线器.......................................................2303.4 高速设计的大致流程...............................................................................2303.4.1 拓扑结构的探索...............................................................................2313.4.2 空间解决方案的探索.......................................................................2313.4.3 使用拓扑模板驱动设计...................................................................2313.4.4 时序驱动布局...................................................................................2323.4.5 以约束条件驱动设计.......................................................................2323.4.6 设计后分析.......................................................................................233第四章 SPECCTRAQUEST SIGNAL EXPLORER 的进阶运用..........................................2344.1 SPECCTRAQuest Signal Explorer 的功能包括:................................2344.2 图形化的拓扑结构探索...........................................................................2344.3 全面的信号完整性(Signal Integrity)分析.......................................2344.4 完全兼容 IBIS 模型...............................................................................2344.5 PCB 设计前和设计的拓扑结构提取.......................................................2354.6 仿真设置顾问...........................................................................................2354.7 改变设计的管理.......................................................................................2354.8 关键技术特点...........................................................................................2364.8.1 拓扑结构探索...................................................................................2364.8.2 SigWave 波形显示器........................................................................2364.8.3 集成化的在线分析(Integration and In-process Analysis) .236第五章 部分特殊的运用...............................................................................2375.1 Script 指令的使用..................................................................................2375.2 差分信号的仿真.......................................................................................2435.3 眼图模式的使用.......................................................................................249第四部分:HYPERLYNX 仿真工具使用指南............................................................251第一章 使用LINESIM 进行前仿真.......................................................................2511.1 用LineSim 进行仿真工作的基本方法...................................................2511.2 处理信号完整性原理图的具体问题.......................................................2591.3 在LineSim 中如何对传输线进行设置...................................................2601.4 在LineSim 中模拟IC 元件.....................................................................2631.5 在LineSim 中进行串扰仿真...................................................................268第二章 使用BOARDSIM 进行后仿真......................................................................2732.1 用BOARDSIM 进行后仿真工作的基本方法...................................................2732.2 BoardSim 的进一步介绍..........................................................................2922.3 BoardSim 中的串扰仿真..........................................................................309

    标签: PCB 内存 仿真技术

    上传时间: 2013-11-07

    上传用户:aa7821634

  • GHz高频信号的LabVIEW和MATLAB混合处理新方法

    探讨了对高频信号进行采集和处理的设计难点,提出将LabVIEW的采集数据的特性与MATLAB强大的计算能力相结合的方法,并以此设计了一个系统。然后通过3种不同的方法,分别是将txt文件引入MATLAB、使用MATLAB script、使用Math Script RT,来结合LabVIEW和MATLAB,以采集得到的信号和内部产生信号的均方差及相关系数为标度来分析不同方法的可行性及效率,通过对比结果,最终确定了一种最佳的方案。

    标签: LabVIEW MATLAB GHz 高频信号

    上传时间: 2013-10-21

    上传用户:jennyzai

  • GHz高频信号的LabVIEW和MATLAB混合处理新方法

    探讨了对高频信号进行采集和处理的设计难点,提出将LabVIEW的采集数据的特性与MATLAB强大的计算能力相结合的方法,并以此设计了一个系统。然后通过3种不同的方法,分别是将txt文件引入MATLAB、使用MATLAB script、使用Math Script RT,来结合LabVIEW和MATLAB,以采集得到的信号和内部产生信号的均方差及相关系数为标度来分析不同方法的可行性及效率,通过对比结果,最终确定了一种最佳的方案。

    标签: LabVIEW MATLAB GHz 高频信号

    上传时间: 2015-01-02

    上传用户:zhaoq123

  • 此软件支持多文档打开

    此软件支持多文档打开,支持多种程序语言语法高亮度显示:Delphi,SQL,Basic,C++, Perl,Java,HTML, TCL/tk,AWK Script,Python CA-Clipper MS-DOS Patch File。多种选择模式支持,支持程序语言语法高亮度显示颜色的可视化调整,支持书签:十个书签,支持多级Undo和Redo操作,层次数可以自己设置。 支持最近文件列表,最近文件的数量可以自己设置。支持查找、替换:同Delphi: 支持直接编辑Delphi的窗体文件(dfm)。支持直接编辑二进制文件。支持直接将源程序文件导出为Word文档或超文本形式。支持代码模板和代码自动完成: 支持自动文件保存。 支持“编辑”命令键的自定义:支持行号显示:可以用指定颜色显示当前行:支持文件拖放。

    标签: 软件 文档

    上传时间: 2013-12-26

    上传用户:gtf1207

  • Suite of components to add scripting capabilities to your applications, including Pascal & Basic scr

    Suite of components to add scripting capabilities to your applications, including Pascal & Basic scripting engines, Pascal & Basic syntax highlighting memo and script debug tools.

    标签: capabilities applications components including

    上传时间: 2015-04-04

    上传用户:chenbhdt

  • 迅捷简易网页计数器 Ver2.0 一.系统要求: ASP+ACCESS 二.程序主要功能: 简单的页面计数功能。 三.使用方法 1. 上传全部文件; 2. 用记事本打开se

    迅捷简易网页计数器 Ver2.0 一.系统要求: ASP+ACCESS 二.程序主要功能: 简单的页面计数功能。 三.使用方法 1. 上传全部文件; 2. 用记事本打开setup.asp更改程序按装路径; 3. 将 下面的代码添加到需要计数的网页, <script language="javascript" src="count.asp"></script> 其中count.asp应改为计数文件的实际路径。 四.文件说明 count.asp 计数器主文件. count.mdb ACCESS数据库. index.asp 计数器测试文件.

    标签: ACCESS Ver 2.0 ASP

    上传时间: 2014-01-09

    上传用户:LIKE

  • Shell源码:find查找日期为某一天的文件 A=`find ~ -print` | ls -l --full-time $A 2>/dev/null | grep "Jun 27" |

    Shell源码:find查找日期为某一天的文件 A=`find ~ -print` | ls -l --full-time $A 2>/dev/null | grep "Jun 27" | grep 1998 下面这个script,存成一个符合规则名字的文件,置上x属性就行了。

    标签: find full-time Shell print

    上传时间: 2014-01-01

    上传用户:维子哥哥

  • This example program shows how to configure and use the A/D Converter of the following microcontroll

    This example program shows how to configure and use the A/D Converter of the following microcontroller: STMicroelectronics ST10F166 After configuring the A/D, the program reads the A/D result and outputs the converted value using the serial port. To run this program... Build the project (Project Menu, Build Target) Start the debugger (Debug Menu, Start/Stop Debug Session) View the Serial Window (View Menu, Serial Window #1) View the A/D converter peripheral (Peripheral Menu, A/D Converter) Run the program (Debug Menu, Go) A debug script (debug.ini) creates buttons that set different analog values in A/D channels. As the program runs, you will see the A/D input and output change. Other buttons create signals that generate sine wave or sawtooth patterns as analog inputs. µ Vision3 users may enable the built-in Logic Analyzer to view, measure and compare these input signals graphically.

    标签: microcontroll Converter configure following

    上传时间: 2014-12-01

    上传用户:独孤求源

  • The tar file contains the following files: ptfsf.c: heart of the perfect TFSF code ptfsf.h: he

    The tar file contains the following files: ptfsf.c: heart of the perfect TFSF code ptfsf.h: header file for same ptfsf-demo.c: FDTD code which demonstrates use of perfect TFSF code. Essentially this program used to generate results shown in the paper ptfsf-file-maker.c: code to generate an incident-field file using the "perfect" incident fields ptfsf-demo-file.c: FDTD code which uses the perfect incident fields stored in a file fdtdgen.h: defines macros used in much of my code Makefile: simple make-file to compile programs Also include are some simple script files to run the programs with reasonable values. The code assumes a two-dimensional computational domain with TMz polarization (i.e., non-zero field Ez, Hx, and Hy). The program is currently written so that the incident field always strikes the lower-left corner of the total-field region first. (If you want a different corner, that should be a fairly simple tweak to the code, but for now you ll have to make that tweak yourself.)

    标签: ptfsf following the contains

    上传时间: 2013-11-28

    上传用户:风之骄子

  • IrCOMM2k - Virtual Infrared COM Port for Windows 2000/XP。 2. FILES IN THIS ARCHIVE: - Setup.exe

    IrCOMM2k - Virtual Infrared COM Port for Windows 2000/XP。 2. FILES IN THIS ARCHIVE: - Setup.exe (setup and uninstall program) - ircomm2k.exe (service program) - ircomm2k.sys (device driver) - ircomm2k.dll (device property page) - ircomm2k.hlp (property page context help) - ircomm2k.inf (setup script for windows) - Readme.txt (this file) - License.txt (terms of license) 3. INSTALLATION 1. unzip IrCOMM2k-1.2.0.zip in a new folder 2. run the setup program 3. disable the image transfer under wireless link

    标签: IrCOMM2k Infrared ARCHIVE Virtual

    上传时间: 2015-09-15

    上传用户:yyq123456789