dm s preparing process. In this case we use O distance.
标签： preparing distance process case
上传时间： 2014-11-27
上传用户：凤临西北
Learn how to build a custom Linux® distribution to use in an embedded environment, in this case to drive a Technologic Systems TS-7800 single-board computer. In this tutorial, you learn about cross-compiling, the boot loader, file systems, the root file system, disk images, and the boot process, all with respect to the decisions you make as you re building the system and creating the distribution.
标签： distribution environment embedded custom
上传时间： 2013-12-23
上传用户：stella2015
AT90USB82 USB Bootloader v1.0.5 atmel avr usb bootloader firmware. use in case that you accidentally deleted the bootloader that is shipped with the mcu.
标签： accidentall Bootloader bootloader USB
上传时间： 2017-07-31
上传用户：czl10052678
Abstract: What can be simpler than designing with CMOS and BiCMOS? These technologies are very easy to use butthey still require careful design. This tutorial discusses the odd case of circuits that seem to work but exhibit somepeculiar behaviors—including burning the designer's fingers!
上传时间： 2013-11-03
上传用户：dick_sh
The latest generation of Texas Instruments (TI) boardmountedpower modules utilizes a pin interconnect technologythat improves surface-mount manufacturability.These modules are produced as a double-sided surfacemount(DSSMT) subassembly, yielding a case-less constructionwith subcomponents located on both sides of theprinted circuit board (PCB). Products produced in theDSSMT outline use the latest high-efficiency topologiesand magnetic-component packaging. This providescustomers with a high-efficiency, ready-to-use switchingpower module in a compact, space-saving package. Bothnonisolated point-of-load (POL) switching regulators andthe isolated dc/dc converter modules are being producedin the DSSMT outline.TI’s plug-in power product line offers power modules inboth through-hole and surface-mount packages. The surfacemountmodules produced in the DSSMT outline use asolid copper interconnect with an integral solder ball fortheir
上传时间： 2013-10-10
上传用户：1184599859
The NCV7356 is a physical layer device for a single wire data linkcapable of operating with various Carrier Sense Multiple Accesswith Collision Resolution (CSMA/CR) protocols such as the BoschController Area Network (CAN) version 2.0. This serial data linknetwork is intended for use in applications where high data rate is notrequired and a lower data rate can achieve cost reductions in both thephysical media components and in the microprocessor and/ordedicated logic devices which use the network.The network shall be able to operate in either the normal data ratemode or a high-speed data download mode for assembly line andservice data transfer operations. The high-speed mode is onlyintended to be operational when the bus is attached to an off-boardservice node. This node shall provide temporary bus electrical loadswhich facilitate higher speed operation. Such temporary loads shouldbe removed when not performing download operations.The bit rate for normal communications is typically 33 kbit/s, forhigh-speed transmissions like described above a typical bit rate of83 kbit/s is recommended. The NCV7356 features undervoltagelockout, timeout for faulty blocked input signals, output blankingtime in case of bus ringing and a very low sleep mode current.
上传时间： 2013-10-24
上传用户：s蓝莓汁
this a programme that you can use socket programme
标签： programme socket this that
上传时间： 2013-12-19
上传用户：Altman
good file for use andme
上传时间： 2015-01-15
上传用户：exxxds
Library of C functions that allows a program to use WinSock 2 functionality if it is available or fall back to WinSock 1.1 if it isn t.
标签： functionality functions available Library
上传时间： 2015-01-18
上传用户：LIKE
td case ref
上传时间： 2014-01-25
上传用户：redmoons
