叠层芯片封装技术，简称3D.是指在不改变封装体外型尺J的前提下，在同一个封装体内于垂直方向叠放两个以上的芯片的封装技术，它起源于快闪存储器（NCYNA\D）及SURAM的叠层封装。由于叠层芯片封装技术具有大容量、多功能、小尺寸、低成本的特点，2005年以来3D技术研究逐渐成为主流。TSOP封装因其具有低成本、后期加工的柔韧而在快闪存储器领域得到广泛应用，因此，基于TSP的3D封装研究显得非常重要。由TSOP3D封装技术的实用性极强，研究方法主要以实验为主。在具体实验的基础上，成功地掌握了TSP叠层封装技术，并且找到了三种不同流程的TSP叠层芯片封装的工艺。另外，还通过大量的实验研究，成功地解决了叠层芯片封装中的关键问题。目前，TSP叠层芯片技术已经用于生产实践并且带来了良好的经济效益。
上传时间： 2022-06-25
上传用户：zhanglei193
STM32F429_F746_F767核心板+开发底板AD+PADS格式（原理图库+PCB封装库）:核心板原理图库：Library Component Count : 28Name Description----------------------------------------------------------------------------------------------------2X28PIN_DIP3.0MM 40P-FPC-0.5BAT54CCJA1117B-3.3CRYSTAL_25MHZ_3225 C_0.1UF_0402 C_0.1UF_0603 C_10P_0402 C_10UF_0603 C_2.2UF_0402C_22P_0402 GZ1005D601TF IS42S16400J KEY_3X6 LED_BLUE_0603 LED_RED_0603 NC R_0R_0402 R_10K_0402R_1K_0402 R_2.2K_0402R_33R_0402STM32F767IGT6 USB_MICRO_DIP W25Q128FVSGXH2.54-5P XTAL_32.768KHZ核心板PCB库：Component Count : 18Component Name-----------------------------------------------2X28X2.54MM3.0MM_4.540P-FPC-0.532153225C_0603C_1206LED_0603LQFP176MICRO_USB_5SSC0402SOT-23SOT-89-3LSR0402SW3$2F$6-SMDTSOP-54W25Q128XH2.54-5P_NS开发板封装库：Component Count : 52Component Name-----------------------------------------------1_DIP1X2PIN_SMD2X6P_SMD2X19X2.54MM2X28X2.54MM3.0MM20PIN_2.54_DIP_BOT20PIN-JTAG06031206C3225AVX_B_3528-21BATERYBEEP-9.5X5.5C_0603C_1206CON_2PINDB9DC-005DIODE_SOPDO-214EC_47UF_6.5X6.5EC_220UF_6.5X6.5EMW1062GDCD4532HDR1X3HDR1X4LED_0603LED_RGB_5MMMAX485MAX3232MIC_6X2.2PJ-3001SQFN24QFN24AQFN32R_0603R-3X3R5MMRJ45RT7272SOP8SOP16SOT-23SOT-353SW6.2$2F$6.2-DIPASW13_6TF_CARDTO-252-2LUSB-AF90USB-MINIXTAL_SMD
上传时间： 2021-12-08
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基于FPGA设计的sdram读写测试实验Verilog逻辑源码Quartus工程文件+文档说明，DRAM选用海力士公司的 HY57V2562 型号,容量为的 256Mbit,采用了 54 引脚的TSOP 封装, 数据宽度都为 16 位, 工作电压为 3.3V,并丏采用同步接口方式所有的信号都是时钟信号。FPGA型号Cyclone4E系列中的EP4CE6F17C8，Quartus版本17.1。timescale 1ps/1psmodule top(input clk,input rst_n,output[1:0] led,output sdram_clk, //sdram clockoutput sdram_cke, //sdram clock enableoutput sdram_cs_n, //sdram chip selectoutput sdram_we_n, //sdram write enableoutput sdram_cas_n, //sdram column address strobeoutput sdram_ras_n, //sdram row address strobeoutput[1:0] sdram_dqm, //sdram data enable output[1:0] sdram_ba, //sdram bank addressoutput[12:0] sdram_addr, //sdram addressinout[15:0] sdram_dq //sdram data);parameter MEM_DATA_BITS = 16 ; //external memory user interface data widthparameter ADDR_BITS = 24 ; //external memory user interface address widthparameter BUSRT_BITS = 10 ; //external memory user interface burst widthparameter BURST_SIZE = 128 ; //burst sizewire wr_burst_data_req; // from external memory controller,write data request ,before data 1 clockwire wr_burst_finish; // from external memory controller,burst write finish
标签： fpga sdram verilog quartus
上传时间： 2021-12-18
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ALTIUM AD集成库 原理图库 PCB封装库 AD19 AD17器件库元件库嘉立创PCB库559个封装，均是项目中用到的器件，可以做为你的设计参考。PCB Library : Miscellaneous Devices LC.PcbLibDate : 2020/12/25Time : 13:36:44Component Count : 559LC-0201LC-0201_CLC-0201_LLC-0201_RLC-0402LC-0402_CLC-0402_LLC-SOT-523LC-SOT-666LC-SOT-723LC-SOT-753LC-SOT-883LC-SPMCA-027LC-SSOP-10_150milLC-SSOP-14_208milLC-SSOP-16_150milLC-SSOP-16_208milLC-SSOP-20_150milLC-SSOP-20_208milLC-SSOP-24_208milLC-SSOP-28_150milLC-SSOP-28_208milLC-SSOP-36_300milLC-SSOP-44KLC-SSOP-48_300milLC-SSOP-56_300milLC-SSOP-B40LC-STSOP-32LC-SuperSOT-3LC-SuperSOT-6LC-TBSLC-TDFN-14_EPLC-TFBGA-64LC-TFBGA-180LC-TO-3LC-TO-3PLC-TO-3P-5LLC-TO-39LC-TO-52LC-TO-92_Forming1LC-TO-92_Forming2LC-TO-92(TO-92-3)LC-TO-92-2LC-TO-92-3LLC-TO-92LLC-TO-92MODLC-TO-126LC-TO-126-4LC-TO-202LC-TO-218LC-TO-220(TO-220-3)LC-TO-220-5LC-TO-220-5(Forming)LC-TO-220-7CLC-TO-220AC(TO-220-2)LC-TO-220F(TO-220IS)LC-TO-220F-4L(Forming)LC-TO-225LC-TO-247(AC)LC-TO-251(I-PAK)LC-TO-252-2LC-TO-252-2-180LC-TO-252-3LC-TO-252-5LC-TO-263-2LC-TO-263-3LC-TO-263-5LC-TO-263-7LC-TO-264LC-TO-274AA(Super-247)LC-TO-277A(SMPC)LC-TOP3LC-TQFN-16_2.5x2.5x04PLC-TQFN-16_4x4x065PLC-TQFN-20_2.5x4.5x05PLC-TQFN-24_EP_4x5x05PLC-TQFP-32_5x5x05PLC-TQFP-32_7x7x08PLC-TQFP-44_10x10x08PLC-TQFP-48_7x7x05PLC-TQFP-52_10x10x065PLC-TQFP-64_10x10x05PLC-TQFP-64_14x14x08PLC-TQFP-80_12x12x05PLC-TQFP-100_12x12x04PLC-TQFP-100_14x14x05PLC-TQFP-100_14x20x065PLC-TQFP-128_14x14x04PLC-TQFP-128_20x14x05PLC-TQFP-144_20x20x05PLC-TSOC-6LC-TSOP(II)-44LC-TSOP(II)-54LC-TSOP(II)-66LC-TSOP-5LC-TSOP-6LC-TSOP-28LC-TSOP-32LC-TSOP-48LC-TSOP-56_14x20mmLC-TSOT-23-5LC-TSOT-23-6LC-TSOT-23-8LC-TSSOP-8_2.3x2x05PLC-TSSOP-8_3x3x065PLC-TSSOP-8_3x4.4x065PLC-TSSOP-10LC-TSSOP-14LC-TSSOP-16LC-TSSOP-20LC-TSSOP-24LC-TSSOP-28LC-TSSOP-30LC-TSSOP-38LC-TSSOP-48LC-TSSOP-56LC-TVSOP-48LC-uDFN-6LC-UFQFPN-20LC-UFQFPN-48LC-uMAX-8LC-UMLP-10LC-US8LC-USC(SOD-323)LC-USM(SC-70-3)LC-USV(SC-70-5)LC-VDFPN-8(MLP-8)LC-VFBGA-20LC-VFBGA-48LC-VFBGA-54_8x14mmLC-VFBGA-63LC-VFQFPN-36_6x6x05PLC-VMN2LC-VQFN-14_3.6x3.6x05PLC-VQFN-16_3.6x3.6x05PLC-VQFN-20_5x5x065PLC-VQFN-24_3.5x5.5x05PLC-VQFN-32_4x4x04PLC-VQFN-40_6x6x05PLC-VQFN-48_7x7x05PLC-VSO-56LC-VSON-8LC-VSON-14_3x4x05PLC-VSSOP-8_2x2.3x05PLC-VSSOP-8_3x3x065PLC-VSSOP-8_EP_3x3x065PLC-VSSOP-10LC-WBGA-84_8x12.5mmLC-WBGA-96LC-WCSP-5LC-WDFN-10LLC-WLCSP-8LC-WOBLC-WPAK-8LC-WQFN-10LC-WSON-8_2x2mmLC-WSON-8_5x6mmLC-WSON-10_2.5x2.5mmLC-XSON-6_1x1.45mmLC-ZIP-23LC-ZIP19-1--------------
标签： altium designer 封装库
上传时间： 2022-03-17
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