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Surface

Surface是美国微软公司推出的全新硬件品牌,微软公司于2012年6月19日发布了Surface系列平板电脑。这款平板电脑采用镁合金机身10.6英寸显示屏,配备USB2.0或3.0接口,使用Windows8操作系统。微软官网将其称为“全高清显示屏”,屏幕比例为16:9。这款产品分为两个版本:一个使用Windows8专为ARM设计的版本WindowsRT;另一个使用英特尔Corei5IvyBridge处理器,使用Windows8Pro。2012年10月26日,中国市场由苏宁全球同步首发微软Surface
  • 使用新电源模块改进表面贴装可制造性

    The latest generation of Texas Instruments (TI) boardmountedpower modules utilizes a pin interconnect technologythat improves Surface-mount manufacturability.These modules are produced as a double-sided Surfacemount(DSSMT) subassembly, yielding a case-less constructionwith subcomponents located on both sides of theprinted circuit board (PCB). Products produced in theDSSMT outline use the latest high-efficiency topologiesand magnetic-component packaging. This providescustomers with a high-efficiency, ready-to-use switchingpower module in a compact, space-saving package. Bothnonisolated point-of-load (POL) switching regulators andthe isolated dc/dc converter modules are being producedin the DSSMT outline.TI’s plug-in power product line offers power modules inboth through-hole and Surface-mount packages. The Surfacemountmodules produced in the DSSMT outline use asolid copper interconnect with an integral solder ball fortheir

    标签: 电源模块 可制造性 表面贴装

    上传时间: 2013-10-10

    上传用户:1184599859

  • SMT生产线贴片机负荷均衡优化

    摘要:采用表面组装技术(Surface mountt echnology,SMT)进行印制板级电子电路组装是当代组装技术发展的主流。典型的SMT生产线是由高速机和多功能机串联而成,印制电路板(printed circuit board,PCB)上的元器件在贴片机之间的负荷均衡优化问题是SMT生产调度的关键问题。以使贴片时间与更换吸嘴时间之和最大的工作台生产时间最小化为目标构建了负荷均衡模型,开发了相应的遗传算法,并进行了数值实验与算法评价。与生产时间理论下界和现场机器自带软件调度方案的对比表明了模型及其算法的有效性。关键词:印制电路板;表面组装生产线;负荷分配;生产线优化

    标签: SMT 生产线 均衡 贴片机

    上传时间: 2013-10-09

    上传用户:亚亚娟娟123

  • 贴片胶与滴胶工艺

    表面贴片胶(SMA,Surface mount adhesives)用于波峰焊接和回流焊接,以保持组件在印刷电路板(PCB)上的位置,确保在装配线上传送过程中组件不会丢失。PCB装配中使用的大多数表面贴片胶(SMA)都是环氧树脂(epoxies),虽然还有聚丙烯(acrylics)用于特殊的用途。在高速滴胶系统引入和电子工业掌握如何处理货架寿命相对较短的产品之后,环氧树脂已成为世界范围内的更主流的胶剂技术。环氧树脂一般对广泛的电路板提供良好的附着力,并具有非常好的电气性能。

    标签: 贴片胶 工艺

    上传时间: 2013-10-12

    上传用户:破晓sunshine

  • 多层印制板设计基本要领

    【摘要】本文结合作者多年的印制板设计经验,着重印制板的电气性能,从印制板稳定性、可靠性方面,来讨论多层印制板设计的基本要求。【关键词】印制电路板;表面贴装器件;高密度互连;通孔【Key words】Printed Circuit Board;Surface Mounting Device;High Density Interface;Via一.概述印制板(PCB-Printed Circuit Board)也叫印制电路板、印刷电路板。多层印制板,就是指两层以上的印制板,它是由几层绝缘基板上的连接导线和装配焊接电子元件用的焊盘组成,既具有导通各层线路,又具有相互间绝缘的作用。随着SMT(表面安装技术)的不断发展,以及新一代SMD(表面安装器件)的不断推出,如QFP、QFN、CSP、BGA(特别是MBGA),使电子产品更加智能化、小型化,因而推动了PCB工业技术的重大改革和进步。自1991年IBM公司首先成功开发出高密度多层板(SLC)以来,各国各大集团也相继开发出各种各样的高密度互连(HDI)微孔板。这些加工技术的迅猛发展,促使了PCB的设计已逐渐向多层、高密度布线的方向发展。多层印制板以其设计灵活、稳定可靠的电气性能和优越的经济性能,现已广泛应用于电子产品的生产制造中。下面,作者以多年设计印制板的经验,着重印制板的电气性能,结合工艺要求,从印制板稳定性、可靠性方面,来谈谈多层制板设计的基本要领。

    标签: 多层 印制板

    上传时间: 2013-10-08

    上传用户:zhishenglu

  • 计算FR4上的差分阻抗(PDF)

    Calculation of the Differential Impedance of Tracks on FR4 substrates There is a discrepancy between calculated and measured values of impedance for differential transmission lineson FR4. This is especially noticeable in the case of Surface microstrip configurations. The anomaly is shown tobe due to the nature of the substrate material. This needs to be considered as a layered structure of epoxy resinand glass fibre. Calculations, using Boundary Element field methods, show that the distribution of the electricfield within this layered structure determines the apparent dielectric constant and therefore affects theimpedance. Thus FR4 cannot be considered to be uniform dielectric when calculating differential impedance.

    标签: FR4 计算 差分阻抗

    上传时间: 2013-10-18

    上传用户:masochism

  • 国外游戏开发者杂志2000年第八期配套代码

    国外游戏开发者杂志2000年第八期配套代码,包括Brian Sharp的implicit-Surface fluid的例子代码,例子中使用了Lander的动画库

    标签: 2000 开发者 代码

    上传时间: 2015-01-05

    上传用户:wsf950131

  • 东滕网站源码

    东滕网站源码,漂亮的界面,基本网页功能设计,聊天室- East clears out the website source code, attractive contact Surface, basic homepage functional design, chatroom ,ASP,编程网站/Program Web Site 【上载源码成为会员下载此源码】【成为VIP会员下载此源码】

    标签: 网站 源码

    上传时间: 2013-12-24

    上传用户:changeboy

  • This was the public transportation inquiry system software engineering design documents, including t

    This was the public transportation inquiry system software engineering design documents, including the demand analysis, the outline design, the contact Surface design and so on a series of designs documents, made the comprehensive analysis to the public transportation systems engineering to design ,Java,software engineering

    标签: transportation engineering documents including

    上传时间: 2015-08-15

    上传用户:lixinxiang

  • This was the public transportation inquiry system software engineering design documents, including t

    This was the public transportation inquiry system software engineering design documents, including the demand analysis, the outline design, the contact Surface design and so on a series of designs documents, made the comprehensive analysis to the public transportation systems engineering to design ,Java,software

    标签: transportation engineering documents including

    上传时间: 2013-12-26

    上传用户:Zxcvbnm

  • This was the public transportation inquiry system software engineering design documents, including t

    This was the public transportation inquiry system software engineering design documents, including the demand analysis, the outline design, the contact Surface design and so on a series of designs documents, made the comprehensive analysis to the public transportation systems engineering to design ,Java

    标签: transportation engineering documents including

    上传时间: 2015-08-15

    上传用户:caixiaoxu26