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Small-scale

  • I2C slave routines for the 87L

    The 87LPC76X Microcontroller combines in a small package thebenefits of a high-performance microcontroller with on-boardhardware supporting the Inter-Integrated Circuit (I2C) bus interface.The 87LPC76X can be programmed both as an I2C bus master, aslave, or both. An overview of the I2C bus and description of the bussupport hardware in the 87LPC76X microcontrollers appears inapplication note AN464, Using the 87LPC76X Microcontroller as anI2C Bus Master. That application note includes a programmingexample, demonstrating a bus-master code. Here we show anexample of programming the microcontroller as an I2C slave.The code listing demonstrates communications routines for the87LPC76X as a slave on the I2C bus. It compliments the program inAN464 which demonstrates the 87LPC76X as an I2C bus master.One may demonstrate two 87LPC76X devices communicating witheach other on the I2C bus, using the AN464 code in one, and theprogram presented here in the other. The examples presented hereand in AN464 allow the 87LPC76X to be either a master or a slave,but not both. Switching between master and slave roles in amultimaster environment is described in application note AN435.The software for a slave on the bus is relatively simple, as theprocessor plays a relatively passive role. It does not initiate bustransfers on its own, but responds to a master initiating thecommunications. This is true whether the slave receives or transmitsdata—transmission takes place only as a response to a busmaster’s request. The slave does not have to worry about arbitrationor about devices which do not acknowledge their address. As theslave is not supposed to take control of the bus, we do not demandit to resolve bus exceptions or “hangups”. If the bus becomesinactive the processor simply withdraws, not interfering with themaster (or masters) on the bus which should (hopefully) try toresolve the situation.

    标签: routines slave I2C 87L

    上传时间: 2013-11-19

    上传用户:shirleyYim

  • Using the 87LPC76X microcontro

    I2C interface, is a very powerful tool for system designers. Theintegrated protocols allow systems to be completely software defined.Software development time of different products can be reduced byassembling a library of reusable software modules. In addition, themultimaster capability allows rapid testing and alignment ofend-products via external connections to an assembly-line computer.The mask programmable 87LPC76X and its EPROM version, the87LPC76X, can operate as a master or a slave device on the I2Csmall area network. In addition to the efficient interface to thededicated function ICs in the I2C family, the on-board interfacefacilities I/O and RAM expansion, access to EEPROM andprocessor-to-processor communications.

    标签: microcontro Using 76X LPC

    上传时间: 2013-12-30

    上传用户:Artemis

  • 《器件封装用户向导》赛灵思产品封装资料

    Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.

    标签: 封装 器件 用户 赛灵思

    上传时间: 2013-10-22

    上传用户:ztj182002

  • 802.3af-2003

    802.3af-2003_标准 802.3af-2003_modified IEEE Std 802.3a-2003 (Amendment to IEEE Std 802.3?-2002, including IEEE Std 802.3ae-2002) IEE

    标签: 802.3 2003 af

    上传时间: 2013-12-27

    上传用户:wudu0932

  • 楼宇自控原理

    楼宇自控系统 一、智能建筑概述 二、楼宇自控的发展史 三、楼宇自控系统 BAS子系统

    标签: 楼宇自控

    上传时间: 2013-12-17

    上传用户:dxxx

  • 微波射频电路仿真100例

    《微波射频电路设计与仿真100例》以微波仿真设计EDA软件ADS、HFSS等为基础,结合工程设计实践,例举了100个射频电路设计实例。从工程设计仿真实践角度出发,覆盖了射频有源器件设计、无源器件设计、射频收发信机设计等主要方向,书中实例丰富翔实,并且在例举的实例中详细介绍了设计仿真全过程。通过《微波射频电路设计与仿真100例》读者可以学习到射频电路的常见器件及其设计仿真方法,以及工程设计思路和技巧。

    标签: 100 射频电路 仿真

    上传时间: 2013-10-14

    上传用户:lmq0059

  • ZigBee无线传感网络的路由协议研究

     为满足无线网络技术具有低功耗、节点体积小、网络容量大、网络传输可靠等技术要求,设计了一种以MSP430单片机和CC2420射频收发器组成的无线传感节点。通过分析其节点组成,提出了ZigBee技术中的几种网络拓扑形式,并研究了ZigBee路由算法。针对不同的传输要求形式选用不同的网络拓扑形式可以尽大可能地减少系统成本。同时针对不同网络选用正确的ZigBee路由算法有效地减少了网络能量消耗,提高了系统的可靠性。应用试验表明,采用ZigBee方式通信可以提高传输速率且覆盖范围大,与传统的有线通信方式相比可以节约40%左右的成本。 Abstract:  To improve the proposed technical requirements such as low-ower, small nodes, large capacity and reliable network transmission, wireless sensor nodes based on MSP430 MCU and CC2420 RF transceiver were designed. This paper provided network topology of ZigBee technology by analysing the component of the nodes and researched ZigBee routing algorithm. Aiming at different requirements of transmission mode to choose the different network topologies form can most likely reduce the system cost. And aiming at different network to choose the correct ZigBee routing algorithm can effectively reduced the network energy consumption and improved the reliability of the system. Results show that the communication which used ZigBee mode can improve the transmission rate, cover more area and reduce 40% cost compared with traditional wired communications mode.

    标签: ZigBee 无线传感网络 协议研究 路由

    上传时间: 2013-10-09

    上传用户:robter

  • UHF读写器设计中的FM0解码技术

       针对UHF读写器设计中,在符合EPC Gen2标准的情况下,对标签返回的高速数据进行正确解码以达到正确读取标签的要求,提出了一种新的在ARM平台下采用边沿捕获统计定时器数判断数据的方法,并对FM0编码进行解码。与传统的使用定时器定时采样高低电平的FM0解码方法相比,该解码方法可以减少定时器定时误差累积的影响;可以将捕获定时器数中断与数据判断解码相对分隔开,使得中断对解码影响很小,实现捕获与解码的同步。通过实验表明,这种方法提高了解码的效率,在160 Kb/s的接收速度下,读取一张标签的时间约为30次/s。 Abstract:  Aiming at the requirement of receiving correctly decoded data from the tag under high-speed communication which complied with EPC Gen2 standard in the design of UHF interrogator, the article introduced a new technology for FM0 decoding which counted the timer counter to judge data by using the edge interval of signal capture based on the ARM7 platform. Compared with the traditional FM0 decoding method which used the timer timed to sample the high and low level, the method could reduce the accumulation of timing error and could relatively separate capture timer interrupt and the data judgment for decoding, so that the disruption effect on the decoding was small and realizd synchronization of capture and decoding. Testing result shows that the method improves the efficiency of decoding, at 160 Kb/s receiving speed, the time of the interrogator to read a tag is about 30 times/s.

    标签: UHF FM0 读写器 解码技术

    上传时间: 2013-11-10

    上传用户:liufei

  • 遗传算法及其在电力系统中的应用(电子书)免费下载

    本书着重介绍了遗传算法及其在电力系统中的应用,为了便于读者阅读和用于解决实际问题,书中对算法的基本原理、求解过程作了详细介绍,并附有算例供参考。 本书内容包括:遗传算法的基本原理、解题过程和简单算例;电源规划数学模型和基于遗传算法的电源规划模型;输电网络规划基础知识、输电网络规划数学模型和基于遗传算法的输电网络规划模型;电力系统无功优化数学模型、无功优化方法综览及遗传算法在无功优化规划中的应用;电力市场基本概念、技术支持系统、电价及遗传算法在电力市场竞价机制中的应用等。 本书可作为高等学校电气工程及其自动化学等专业本科高年级学生和研究生的教材,还可供从事相关领域的研究人员和工程技术人员参考。

    标签: 算法 电力系统 中的应用 免费下载

    上传时间: 2014-12-31

    上传用户:qingzhuhu

  • 《器件封装用户向导》赛灵思产品封装资料

    Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.

    标签: 封装 器件 用户 赛灵思

    上传时间: 2013-11-21

    上传用户:不懂夜的黑