NXP示例编码集,Software that is described herein is for illustrative purposes only which provides customers with programming information regarding the products. This software is supplied "AS IS" without any warranties. NXP SemiCONDUCTors assumes no responsibility or liability for the use of the software, conveys no license or title under any patent, copyright, or mask work right to the product. NXP SemiCONDUCTors reserves the right to make changes in the software without notification. NXP SemiCONDUCTors also make no representation or warranty that such application will be suitable for the specified use without further testing or modification.
标签： illustrative described Software purposes
上传时间： 2014-01-23
上传用户：stampede
This software transmits data (using TCP/IP) from I/O pins (of the Tini Board - from Dallas SemiCONDUCTors) to a specific IP address.
标签： from Semicondu transmits software
上传时间： 2016-05-29
上传用户：zhangzhenyu
In the seven years since the first edition of this book was completed, Electrostatic Discharge (ESD) phenomena in integrated circuits (IC) continues to be important as technologies shrink and the speed and size of the chips increases. The phenom- ena related to ESD events in semiconductor devices take place outside the realm of normal device operation. Hence, the physics governing this behavior are not typ- ically found in general textbooks on SemiCONDUCTors.
标签： Integrated Circuits Silicon ESD In
上传时间： 2020-06-05
上传用户：shancjb
There have been many developments in the field of power electronics since the publication of the second edition, almost five years ago. Devices have become bigger and better - bigger silicon die, and current and voltage ratings. However, semiconductor devices have also become smaller and better, integrated circuit devices, that is. And the marriage of low power integrated circuit tecnology and high power SemiCONDUCTors has resulted in benefit to both fields.
标签： Electronics Handbook Edition Power
上传时间： 2020-06-07
上传用户：shancjb
stract With global drivers such as better energy consumption, energy efficiency and reduction of greenhouse gases, CO 2 emission reduction has become key in every layer of the value chain. Power Electronics has definitely a role to play in these thrilling challenges. From converters down to compound SemiCONDUCTors, innovation is leading to breakthrough technologies. Wide BandGap, Power Module Packaging, growth of Electric Vehicle market will game change the overall power electronic industry and supply chain. In this presentation we will review power electronics trends, from technologies to markets.
标签： Electronics Materials Power WBG for
上传时间： 2020-06-07
上传用户：shancjb
ONSEMI 官方的IGBT应用手册，书中有基础的关于IGBT datasheet的解读方法，IGBT门极驱动电路讲解，IGBT开关过程分析及损耗计算，并联使用方法，封装热模型，IGBT 发热计算等等。各个要点说明很详细，对于IGBT基础理解和应用有很大的帮助。
标签： IGBT
上传时间： 2022-06-30
上传用户：bluedrops
