RFC 1945 Http1.0协议实现。对协议进行了完整面向对象设计，并实现简单的Http服务器与客户端。源码行数达4000行。
上传时间： 2017-06-28
上传用户：siguazgb
使用java实现的RFC1945 http1.0协议。所有面向对象设计严谨按照RFC 1945协议中的描述。源代码逾4000行。提供给Java网络编程初学者学习
上传时间： 2013-12-10
上传用户：s363994250
Example script to read CF-compliant structured grid NetCDF data into Matlab using the NetCDF-Java libraryI m using "toolsUI.jar" which is advertised as "a nice fat jar file containing everything in a single jar"
标签： CF-compliant NetCDF-Jav structured Example
上传时间： 2017-06-30
上传用户：gmh1314
IPv6协议中flow_label的相关RFC
标签： flow_label IPv6 RFC 协议
上传时间： 2017-07-14
上传用户：skhlm
中、英文RFC文档大全打包下载完全版 .
上传时间： 2013-11-28
上传用户：李彦东
A Consumer’s Guide to Using eXpressDSP-Compliant Algorithms
标签： eXpressDSP-Compliant Algorithms Consumer Guide
上传时间： 2017-08-01
上传用户：alan-ee
* TFTP client compatible with RFC-1350 * compile under visiual c++ or borland c++ * author email: yuyushine@163.com ***************************************************/ #define _VC /* if compile under visiual c++ else undefine this*/ #include <stdio.h> #include <winsock.h> #include <conio.h> #ifndef MAKEWORD #define MAKEWORD(l,h) ((WORD)(((BYTE)(l))|(((WORD)(BYTE)(h))<<8))) #endif #define WSA_MAJOR_VERSION 1 #define WSA_MINOR_VERSION 1 #define WSA_VERSION MAKEWORD(WSA_MAJOR_VERSION, WSA_MINOR_VERSION)
标签： compatible borland compile visiual
上传时间： 2014-01-15
上传用户：yuchunhai1990
rfc 3984 文档 2005年英文pdf版本。
上传时间： 2013-12-20
上传用户：yiwen213
RFC中文文档大全，为E文不好的网友增加方便！！！
上传时间： 2013-12-24
上传用户：csgcd001
This document was developed under the Standard Hardware and Reliability Program (SHARP) TechnologyIndependent Representation of Electronic Products (TIREP) project. It is intended for use by VHSIC HardwareDescription Language (VHDL) design engineers and is offered as guidance for the development of VHDL modelswhich are compliant with the VHDL Data Item Description (DID DI-EGDS-80811) and which can be providedto manufacturing engineering personnel for the development of production data and the subsequent productionof hardware. Most VHDL modeling performed to date has been concentrated at either the component level orat the conceptual system level. The assembly and sub-assembly levels have been largely disregarded. Under theSHARP TIREP project, an attempt has been made to help close this gap. The TIREP models are based upon lowcomplexity Standard Electronic Modules (SEM) of the format A configuration. Although these modules are quitesimple, it is felt that the lessons learned offer guidance which can readily be applied to a wide range of assemblytypes and complexities.
上传时间： 2014-12-23
上传用户：xinhaoshan2016
